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PT6707C

Texas Instruments

PT6707C by Texas Instruments

PT6707C by Texas Instruments is a voltage-mode switching regulator with 17 terminals, operating b/w -40 to 85°C. It offers a max output current of 13A and a switching frequency of up to 400 kHz. Ideal for industrial applications requiring a hybrid technology solution in a compact rectangular package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,070 parts In-Stock

1+ parts

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2,070

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Digiode

USA . 1,479 parts In-Stock

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1,479

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,464 parts In-Stock

1+ parts

$4.500

100+ parts

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1,464

$4.500

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Parana Technologies

USA . 358 parts In-Stock

1+ parts

$5.771

100+ parts

$535.903

1k+ parts

$5.194

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358

$5.771

$535.903

$5.194

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DigiPath Technology Company

USA . 1,718 parts In-Stock

1+ parts

$6.354

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1,718

$6.354

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ChromeModa Solutions

Germany . 5,236 parts In-Stock

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$6.484

100+ parts

$5.317

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5,236

$6.484

$5.317

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IDEA Electronic Components Group

UK . 2,245 parts In-Stock

1+ parts

$6.484

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$5.836

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2,245

$6.484

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$5.836

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AZTECH Wire

Italy . 447 parts In-Stock

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$10.035

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447

$10.035

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Corphita

USA . 3,759 parts In-Stock

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3,759

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Overview

Experience the superior quality and reliability of Texas Instruments with the PT6707C Switching Regulator & Controller. Designed for industrial-grade applications, this product offers a wide input voltage range, high output current capability, and efficient operation up to 400 kHz. With its compact rectangular package and surface-mount design, the PT6707C is perfect for demanding electronic systems where space-saving and performance are crucial. Trust Texas Instruments for cutting-edge technology and seamless integration into your next project.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and efficient mounting on circuit boards, saving space and reducing assembly time.

Package Shape: RECTANGULAR

Provides a standard shape for the package, making it compatible with various circuit board layouts and designs.

Maximum Output Current: 13 A

Capable of delivering high output current, making it suitable for powering various electronic devices and components.

Control Mode: VOLTAGE-MODE

Voltage-mode control offers precise regulation and stability, ensuring consistent power delivery to the load.

Maximum Switching Frequency: 400 kHz

High switching frequency allows for efficient power conversion and helps reduce the size of external components.

Technology: HYBRID

Hybrid technology combines the benefits of different types of regulators, resulting in improved efficiency and performance.

Technical Specifications

Switching Regulators & Controllers PT6707C attributes and parameters. Explore more Switching Regulators & Controllers devices from Texas Instruments

Specs

Other IC type:

Control Mode:

VOLTAGE-MODE

Maximum Input Voltage:

5.5 V

Minimum Input Voltage:

3.1 V

Nominal Input Voltage:

5 V

JESD-30 Code:

R-XSMA-G17

No. of Functions:

1

No. of Terminals:

17

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

13 A

Package Body Material:

UNSPECIFIED

Package Equivalence Code:

SMSIP17H,1.0

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Qualification:

Not Qualified

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Switcher Config:

SINGLE

Maximum Switching Frequency:

400 kHz

Technology:

HYBRID

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

2.54 mm

Terminal Position:

SINGLE

Trade Compliance

PT6707C Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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