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PT6311G

Texas Instruments

PT6311G by Texas Instruments

PT6311G by Texas Instruments is a 12-terminal switching regulator with max output current of 2A and max switching frequency of 800kHz. Ideal for applications requiring buck switcher config, operating b/w -40 to 70°C in plastic/epoxy package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,857 parts In-Stock

1+ parts

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7,857

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Digiode

USA . 3,670 parts In-Stock

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3,670

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 788 parts In-Stock

1+ parts

$3.125

100+ parts

-

1k+ parts

$3.645

10k+ parts

-

788

$3.125

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$3.645

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One Stop Electronics

USA . 1,171 parts In-Stock

1+ parts

$3.500

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-

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1,171

$3.500

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IDEA Electronic Components Group

UK . 2,338 parts In-Stock

1+ parts

$3.511

100+ parts

-

1k+ parts

$3.160

10k+ parts

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2,338

$3.511

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$3.160

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ChromeModa Solutions

Germany . 834 parts In-Stock

1+ parts

$3.511

100+ parts

$2.879

1k+ parts

-

10k+ parts

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834

$3.511

$2.879

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Ampacity Inc.

Singapore . 859 parts In-Stock

1+ parts

$5.500

100+ parts

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859

$5.500

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AZTECH Wire

Italy . 444 parts In-Stock

1+ parts

$5.843

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444

$5.843

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Semicontronic

India . 1,353 parts In-Stock

1+ parts

$6.500

100+ parts

$6.338

1k+ parts

$6.305

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1,353

$6.500

$6.338

$6.305

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Corphita

USA . 3,891 parts In-Stock

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3,891

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Corohmni

South Africa . 369 parts In-Stock

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369

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DigiPath Technology Company

USA . 200 parts In-Stock

1+ parts

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100+ parts

$3.166

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200

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$3.166

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Overview

Unlock the power of efficient energy management with the PT6311G from Texas Instruments. Designed with precision and reliability in mind, this switching regulator offers seamless control over voltage levels while maximizing output current up to 2A. Whether you're looking to optimize power efficiency in industrial applications or enhance battery life in consumer electronics, the PT6311G is your go-to solution. Trust in Texas Instruments' reputation for excellence and innovation, and experience the benefits of superior quality and performance with this cutting-edge product. Elevate your projects with the PT6311G and revolutionize the way you manage power consumption.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and resistance to environmental factors, making this product ideal for long-term use in various conditions.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on PCBs, saving space and reducing assembly time.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this product can withstand elevated temperatures while maintaining performance and reliability.

Maximum Output Current: 2 A

The high maximum output current of 2A allows for powering multiple components or devices simultaneously, making this product suitable for various applications.

Minimum Input Voltage: 19.5 V

The low minimum input voltage requirement of 19.5V ensures compatibility with a wide range of power sources, providing flexibility in design and implementation.

Technical Specifications

Switching Regulators & Controllers PT6311G attributes and parameters. Explore more Switching Regulators & Controllers devices from Texas Instruments

Specs

Other IC type:

Maximum Input Voltage:

38 V

Minimum Input Voltage:

19.5 V

JESD-30 Code:

R-PDFM-G12

No. of Functions:

1

No. of Terminals:

12

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

2 A

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Qualification:

Not Qualified

Surface Mount:

YES

Switcher Config:

BUCK

Maximum Switching Frequency:

800 kHz

Temperature Grade:

Terminal Form:

GULL WING

Terminal Position:

DUAL

Trade Compliance

PT6311G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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