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PT6303C

Texas Instruments

PT6303C by Texas Instruments

PT6303C by Texas Instruments is a 12-terminal switching regulator with a max output current of 3A and voltage-mode control. Operating b/w -40°C to 85°C, it has a max switching frequency of 600kHz and is ideal for industrial applications requiring a nominal input voltage of 10V and nominal output voltage of 3.3V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,348 parts In-Stock

1+ parts

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5,348

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Digiode

USA . 4,778 parts In-Stock

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4,778

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NAC Semi

USA . 2 parts In-Stock

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2

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 715 parts In-Stock

1+ parts

$5.050

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715

$5.050

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One Stop Electronics

USA . 335 parts In-Stock

1+ parts

$5.500

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335

$5.500

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Parana Technologies

USA . 1,569 parts In-Stock

1+ parts

$10.603

100+ parts

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$11.101

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1,569

$10.603

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$11.101

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DigiPath Technology Company

USA . 1,490 parts In-Stock

1+ parts

$11.675

100+ parts

$10.741

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1,490

$11.675

$10.741

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ChromeModa Solutions

Germany . 4,859 parts In-Stock

1+ parts

$11.913

100+ parts

$9.769

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4,859

$11.913

$9.769

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IDEA Electronic Components Group

UK . 1,907 parts In-Stock

1+ parts

$11.913

100+ parts

$11.317

1k+ parts

$10.722

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1,907

$11.913

$11.317

$10.722

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Corphita

USA . 1,854 parts In-Stock

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1,854

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Overview

Experience superior power management with the PT6303C by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-quality switching regulators and controllers that are surface mountable and designed for industrial applications. The PT6303C offers a nominal output voltage of 3.3V and a maximum output current of 3A, making it ideal for a wide range of power supply needs. Trust in Texas Instruments to provide reliable and efficient solutions for your power management requirements.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy installation and space-saving on circuit boards, making this product efficient for compact designs.

Package Shape: RECTANGULAR

The rectangular package shape provides stability and ease of mounting, ensuring reliable performance in various applications.

No. of Terminals: 12

Having 12 terminals allows for versatile connectivity options, making this product suitable for complex circuit configurations.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures stable performance in demanding industrial environments.

Control Mode: VOLTAGE-MODE

Voltage-mode control offers precise regulation of output voltage, enhancing the efficiency and reliability of the product.

Maximum Output Current: 3 A

The high maximum output current capability of 3 A enables this product to power a variety of electronic devices with adequate current capacity.

Technology: HYBRID

Hybrid technology combines the advantages of different technologies, offering high efficiency and performance optimization in this switching regulator.

Technical Specifications

Switching Regulators & Controllers PT6303C attributes and parameters. Explore more Switching Regulators & Controllers devices from Texas Instruments

Specs

Additional Features:

INPUT VOLTAGE CAN BE UPTO 38V WHEN THE INHIBIT FUNCTION IS NOT USED

Other IC type:

Control Mode:

VOLTAGE-MODE

Maximum Input Voltage:

26 V

Minimum Input Voltage:

9 V

Nominal Input Voltage:

10 V

JESD-30 Code:

R-XSMA-G12

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

12

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

3 A

Nominal Output Voltage:

3.3 V

Package Body Material:

UNSPECIFIED

Package Equivalence Code:

SMSIP12H,.7

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Peak Reflow Temperature (C):

215

Qualification:

Not Qualified

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Switcher Config:

BUCK

Maximum Switching Frequency:

600 kHz

Technology:

HYBRID

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

2.54 mm

Terminal Position:

SINGLE

Trade Compliance

PT6303C Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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