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PT5812C

Texas Instruments

PT5812C by Texas Instruments

PT5812C by Texas Instruments is a voltage-mode switching regulator with 18 terminals, operating b/w -40 to 85°C. It offers a max output current of 19A and a switching frequency of 350kHz, suitable for industrial applications requiring a nominal input voltage of 3.3V.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,494 parts In-Stock

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4,494

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Vyrian

USA . 4,242 parts In-Stock

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4,242

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One Stop Electronics

USA . 1,631 parts In-Stock

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$4.500

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1,631

$4.500

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Ampacity Inc.

Singapore . 863 parts In-Stock

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$4.500

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863

$4.500

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Semicontronic

India . 1,521 parts In-Stock

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$6.500

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$6.338

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$6.305

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1,521

$6.500

$6.338

$6.305

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AZTECH Wire

Italy . 352 parts In-Stock

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$8.619

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352

$8.619

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Parana Technologies

USA . 73 parts In-Stock

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$16.868

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$17.109

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73

$16.868

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$17.109

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DigiPath Technology Company

USA . 768 parts In-Stock

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$18.574

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768

$18.574

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ChromeModa Solutions

Germany . 3,707 parts In-Stock

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$18.953

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$15.541

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3,707

$18.953

$15.541

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IDEA Electronic Components Group

UK . 340 parts In-Stock

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$18.953

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$18.005

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$17.058

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340

$18.953

$18.005

$17.058

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Corphita

USA . 4,050 parts In-Stock

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Corohmni

South Africa . 385 parts In-Stock

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Overview

Elevate your power management solutions with the PT5812C from Texas Instruments. This switching regulator offers impeccable quality and reliability, backed by the trusted reputation of its manufacturer. Ideal for a wide range of applications, this product stands out for its efficiency and performance. With its compact design and advanced technology, the PT5812C provides value and benefits that will exceed your expectations. Upgrade to the PT5812C and experience the advantages of top-notch power regulation in your projects.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and convenient installation on a circuit board, saving space and reducing assembly time.

Package Shape: RECTANGULAR

The rectangular shape is commonly used for integrated circuits, providing compatibility with standard PCB layouts.

No. of Terminals: 18

Sufficient terminals for versatile connectivity and functionality in a circuit design.

Maximum Operating Temperature: 85 °C

Suitable for industrial applications where a higher operating temperature range is required.

Control Mode: VOLTAGE-MODE

Provides precise control over the output voltage, ensuring stable power delivery.

Nominal Input Voltage: 3.3 V

Designed for compatibility with 3.3V systems, making it suitable for a wide range of applications.

Maximum Output Current: 19 A

Capable of delivering high current output, suitable for power-hungry devices or systems.

Technology: HYBRID

Combines the advantages of different technologies, offering efficiency and performance benefits.

Technical Specifications

Switching Regulators & Controllers PT5812C attributes and parameters. Explore more Switching Regulators & Controllers devices from Texas Instruments

Specs

Other IC type:

Control Mode:

VOLTAGE-MODE

Maximum Input Voltage:

3.63 V

Minimum Input Voltage:

2.97 V

Nominal Input Voltage:

3.3 V

JESD-30 Code:

R-XSMA-G18

No. of Functions:

1

No. of Terminals:

18

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

19 A

Package Body Material:

UNSPECIFIED

Package Equivalence Code:

SMSIP18H,1.0

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Qualification:

Not Qualified

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Switcher Config:

BUCK

Maximum Switching Frequency:

350 kHz

Technology:

HYBRID

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

2.54 mm

Terminal Position:

SINGLE

Trade Compliance

PT5812C Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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