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PREF4132B30DBVRQ1

Texas Instruments

PREF4132B30DBVRQ1 by Texas Instruments

PREF4132B30DBVRQ1 by Texas Instruments is a voltage reference IC with a package style of small outline, low profile, and shrink pitch. It operates b/w -40 to 125°C, providing an output voltage range of 2.9985V to 3.0015V suitable for automotive applications due to its AEC-Q100 screening level.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,097 parts In-Stock

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9,097

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Digiode

USA . 842 parts In-Stock

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842

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,187 parts In-Stock

1+ parts

$0.500

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1,187

$0.500

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Parana Technologies

USA . 2,029 parts In-Stock

1+ parts

$1.326

100+ parts

-

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$2.063

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2,029

$1.326

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$2.063

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ChromeModa Solutions

Germany . 5,736 parts In-Stock

1+ parts

$1.490

100+ parts

$1.222

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5,736

$1.490

$1.222

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IDEA Electronic Components Group

UK . 1,295 parts In-Stock

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$1.490

100+ parts

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$1.341

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1,295

$1.490

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$1.341

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Semicontronic

India . 1,574 parts In-Stock

1+ parts

$2.500

100+ parts

$2.438

1k+ parts

$2.425

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1,574

$2.500

$2.438

$2.425

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One Stop Electronics

USA . 1,105 parts In-Stock

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$6.500

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1,105

$6.500

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AZTECH Wire

Italy . 281 parts In-Stock

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$17.072

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281

$17.072

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Corphita

USA . 1,153 parts In-Stock

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1,153

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Corohmni

South Africa . 464 parts In-Stock

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464

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DigiPath Technology Company

USA . 80 parts In-Stock

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$1.343

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80

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$1.343

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Overview

Elevate your automotive applications with the PREF4132B30DBVRQ1 by Texas Instruments. This small outline, low profile voltage reference offers precision and reliability, meeting AEC-Q100 standards. With a nominal output voltage of 3V and a maximum voltage tolerance of 0.05%, this IC guarantees accurate performance in a compact package. Trust in Texas Instruments' reputation for quality and innovation to bring value to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, making the product long-lasting and reliable.

Surface Mount: YES

Facilitates easy installation and integration into circuit boards, saving time and effort during assembly.

Screening Level: AEC-Q100

Ensures high quality and reliability for automotive applications, meeting industry standards and requirements.

Package Shape: RECTANGULAR

Allows for efficient use of space on the circuit board, making it suitable for compact designs.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for a wide range of operating environments.

Minimum Output Voltage: 2.9985 V

Provides a stable and precise output voltage, ensuring accurate performance in voltage reference applications.

Minimum Operating Temperature: -40 °C

Can operate in low temperature conditions, making it versatile for various environmental conditions.

Maximum Output Voltage: 3.0015 V

Offers a tight output voltage range, ensuring consistency and reliability in voltage references.

Maximum Seated Height: 1.45 mm

Has a low profile design, allowing for easy integration into compact electronic devices.

Width (mm): 1.6 mm

Compact size enables space-saving on the circuit board, ideal for applications with limited space.

Other IC type: THREE TERMINAL VOLTAGE REFERENCE

Provides accurate and stable voltage reference, essential for precision electronic circuits.

Minimum Supply Voltage (Vsup): 3.0485 V

Requires low power supply voltage, suitable for energy-efficient electronic devices.

Length: 2.9 mm

Compact size allows for easy integration into small electronic devices and circuit layouts.

Temperature Grade: AUTOMOTIVE

Meets automotive industry standards for temperature performance and reliability, making it suitable for automotive applications.

Maximum Supply Current (Isup): 0.1 mA

Consumes low supply current, contributing to energy efficiency and reducing power consumption.

Maximum Output Current: 0.01 A

Can provide sufficient output current for voltage reference applications, ensuring stable operation.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity, enhancing performance and reliability.

Terminal Form: GULL WING

Enables easy soldering and secure connection on the circuit board, enhancing reliability and ease of installation.

Maximum Voltage Tolerance: 0.05 %

Offers precise voltage tolerance, ensuring accurate voltage output for reliable circuit operation.

Terminal Pitch: 0.95 mm

Provides a standard terminal pitch for compatibility with various circuit board designs and layouts.

Max Voltage Temp Coef: 30 ppm/°C

Has a low voltage temperature coefficient, ensuring stable voltage output over a wide temperature range.

Maximum Supply Voltage (Vsup): 5.5 V

Can accept a wide range of supply voltages, providing flexibility in power supply options for different applications.

Nominal Output Voltage: 3 V

Delivers a precise nominal output voltage, essential for accurate voltage references in electronic circuits.

Technical Specifications

Voltage References PREF4132B30DBVRQ1 attributes and parameters. Explore more Voltage References devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G5

Length:

2.9 mm

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

5

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

.01 A

Maximum Output Voltage:

3.0015 V

Minimum Output Voltage:

2.9985 V

Nominal Output Voltage:

3 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP5/6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.45 mm

Maximum Supply Current (Isup):

.1 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3.0485 V

Surface Mount:

YES

Technology:

CMOS

Max Voltage Temp Coef:

30 ppm/Cel

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Trim or Adjustable Output (V):

NO

Maximum Voltage Tolerance:

.05 %

Width (mm):

1.6 mm

Trade Compliance

PREF4132B30DBVRQ1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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