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PDP83TG720SWCSTQ1

Texas Instruments

PDP83TG720SWCSTQ1 by Texas Instruments

PDP83TG720SWCSTQ1 by Texas Instruments is an AEC-Q100 compliant Ethernet transceiver with 4 transceivers, supporting data rates up to 1000 Mbps. Operating in automotive temperature grades (-40 to 125°C), it has a low supply current of 260 mA and a nominal voltage of 1V, making it ideal for automotive network interfaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 5,091 parts In-Stock

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Digiode

USA . 858 parts In-Stock

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Nova Conductors

Japan . 40 parts In-Stock

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AZTECH Wire

Italy . 621 parts In-Stock

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$7.520

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$7.520

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

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$8.028

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$7.626

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$7.626

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$8.028

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$7.626

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Parana Technologies

USA . 1,499 parts In-Stock

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$8.251

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$8.866

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$8.251

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Corohmni

South Africa . 301 parts In-Stock

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$8.977

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DigiPath Technology Company

USA . 928 parts In-Stock

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$9.086

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$8.359

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$9.086

$8.359

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ChromeModa Solutions

Germany . 1,412 parts In-Stock

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$9.271

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$7.602

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IDEA Electronic Components Group

UK . 1,295 parts In-Stock

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$9.271

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$8.807

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$8.344

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One Stop Electronics

USA . 543 parts In-Stock

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$214.000

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Ampacity Inc.

Singapore . 431 parts In-Stock

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$418.000

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Semicontronic

India . 1,380 parts In-Stock

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$444.000

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$432.900

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$430.680

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Continental Prestige Electronics

USA . 5,821 parts In-Stock

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Argo Parts USA

USA . 3,356 parts In-Stock

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Corphita

USA . 3,030 parts In-Stock

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Bastille Electronics

Australia . 300 parts In-Stock

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300

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Overview

Experience seamless connectivity with the PDP83TG720SWCSTQ1 by Texas Instruments, a top-of-the-line Ethernet transceiver designed for automotive applications. Crafted with precision and quality in mind, this network interface offers unmatched reliability and performance. With four transceivers and a data rate of 1000 Mbps, this product ensures fast and stable connections for your networking needs. Trust Texas Instruments to deliver cutting-edge technology that meets the highest industry standards, providing you with the value and benefits you deserve. Elevate your connectivity experience with the PDP83TG720SWCSTQ1 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material ensures a lightweight yet rugged design, making it suitable for various applications.

Surface Mount: YES

Easy surface mount installation allows for quick and hassle-free integration into existing systems.

Screening Level: AEC-Q100

AEC-Q100 screening level guarantees high reliability and quality performance, ideal for automotive applications where durability is key.

Package Shape: SQUARE

The square package shape offers a compact and space-saving design, perfect for applications with limited space constraints.

No. of Terminals: 36

With a high number of terminals, this product can accommodate a variety of connections, providing flexibility for different configurations.

Package Style: CHIP CARRIER/HEAT SINK/SLUG

The chip carrier, heat sink/slug, and very thin profile package styles ensure efficient heat dissipation and optimal performance in demanding environments.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand extreme conditions without compromising functionality.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for reliable operation even in cold environments, making it suitable for a wide range of applications.

Terminal Position: QUAD

The quad terminal position offers a stable and secure connection, reducing the risk of signal interference or disconnection.

Maximum Seated Height: 1 mm

The low maximum seated height ensures a compact form factor, making it ideal for applications where space is limited.

Technical Specifications

Network Interfaces PDP83TG720SWCSTQ1 attributes and parameters. Explore more Network Interfaces devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES WITH 3.3 NOMINAL SUPPLY

Data Rate:

1000 Mbps

JESD-30 Code:

S-PQCC-N36

Length:

6 mm

No. of Functions:

1

No. of Terminals:

36

No. of Transceivers:

4

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC36,.24SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Screening Level:

AEC-Q100

Maximum Seated Height:

1 mm

Maximum Supply Current:

260 mA

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

6 mm

Trade Compliance

PDP83TG720SWCSTQ1 Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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