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PCM55HP/1KG6

Texas Instruments

PCM55HP/1KG6 by Texas Instruments

PCM55HP/1KG6 by Texas Instruments is a 16-bit D/A converter with +-5V supplies, 3us settling time, and -3V to 3V output voltage range. Ideal for applications requiring precise analog signal generation in commercial temperature environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,040 parts In-Stock

1+ parts

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5,040

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Digiode

USA . 2,484 parts In-Stock

1+ parts

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2,484

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,249 parts In-Stock

1+ parts

$17.925

100+ parts

-

1k+ parts

$18.091

10k+ parts

-

1,249

$17.925

-

$18.091

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One Stop Electronics

USA . 1,578 parts In-Stock

1+ parts

$18.000

100+ parts

-

1k+ parts

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1,578

$18.000

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AZTECH Wire

Italy . 245 parts In-Stock

1+ parts

$19.013

100+ parts

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245

$19.013

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DigiPath Technology Company

USA . 2,110 parts In-Stock

1+ parts

$19.737

100+ parts

$18.158

1k+ parts

-

10k+ parts

-

2,110

$19.737

$18.158

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ChromeModa Solutions

Germany . 3,955 parts In-Stock

1+ parts

$20.140

100+ parts

$16.515

1k+ parts

-

10k+ parts

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3,955

$20.140

$16.515

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IDEA Electronic Components Group

UK . 1,682 parts In-Stock

1+ parts

$20.140

100+ parts

$19.133

1k+ parts

$18.126

10k+ parts

-

1,682

$20.140

$19.133

$18.126

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Microchip USA

USA . 5,750 parts In-Stock

1+ parts

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5,750

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Corphita

USA . 4,012 parts In-Stock

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4,012

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Overview

Unlock the power of precision with the PCM55HP/1KG6 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality digital-to-analog converters that provide unparalleled performance and reliability. Ideal for a wide range of applications, this product offers customers the value of fast settling time, high accuracy, and a compact package design. Experience the benefits of seamless integration and exceptional output voltage control with the PCM55HP/1KG6. Elevate your projects with this innovative solution from Texas Instruments.

Feature Benefit Bullets

Maximum Analog Output Voltage: 3 V

Provides a high maximum output voltage, suitable for a wide range of applications.

Package Body Material: PLASTIC/EPOXY

Durable and cost-effective material for the package body.

Surface Mount: YES

Easy to install and mount on PCBs.

No. of Bits: 16

High resolution with 16 bits, providing accurate analog output.

Power Supplies (V): +-5

Flexible power supply options with both positive and negative voltages.

Package Style (Meter): SMALL OUTLINE

Compact package style for space-saving designs.

Nominal Settling Time (tstl): 3 us

Fast settling time for quick response and accuracy.

Maximum Operating Temperature: 70 °C

Wide operating temperature range for versatile applications.

Minimum Operating Temperature: 0 °C

Operates in a wide range of temperatures, suitable for various environments.

Input Format: PARALLEL, WORD

Supports multiple input formats for compatibility with different systems.

Technical Specifications

Digital-to-Analog Converters PCM55HP/1KG6 attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Sub-Category:

Other Converters

Input Format:

Parallel, Word

Input Bit Code:

Complementary Binary, Complementary 2's Complement, Complementary Offset Binary

Nominal Settling Time (tstl):

3 µs

No. of Bits:

16

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

5 V

Minimum Analog Output Voltage:

-3 V

Maximum Analog Output Voltage:

3 V

Power Supplies:

±5 V

Nominal Negative Supply Voltage:

-5 V

Operating Conditions

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Temperature Grade:

Form Factor

No. of Terminals:

24

Terminal Form:

Terminal Position:

Dual

Terminal Pitch:

0.05 in (1.27 mm)

Surface Mount:

Yes

Width:

0.331 in (8.4 mm)

Length:

0.61 in (15.5 mm)

Maximum Seated Height:

0.098 in (2.5 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Small Outline

Package Code:

SOP

Package Equivalence Code:

SOP24,.5

Standards and Codes

Qualified:

No

JESD-30 Code:

R-PDSO-G24

Trade Compliance

PCM55HP/1KG6 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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