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PCM1803DBG4

Texas Instruments

PCM1803DBG4 by Texas Instruments

PCM1803DBG4 by Texas Instruments is a 24-bit ADC with 2 analog in channels, operating at 3.3-5V. It features a 0.096 MHz sample rate and outputs data in serial format. Ideal for industrial applications requiring precise analog-to-digital conversion in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,425 parts In-Stock

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8,425

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Digiode

USA . 4,373 parts In-Stock

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4,373

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Distributors (Availability)

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Parana Technologies

USA . 2,368 parts In-Stock

1+ parts

$5.584

100+ parts

-

1k+ parts

$6.375

10k+ parts

-

2,368

$5.584

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$6.375

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DigiPath Technology Company

USA . 1,756 parts In-Stock

1+ parts

$6.149

100+ parts

$5.657

1k+ parts

-

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1,756

$6.149

$5.657

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ChromeModa Solutions

Germany . 2,062 parts In-Stock

1+ parts

$6.274

100+ parts

$5.145

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2,062

$6.274

$5.145

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IDEA Electronic Components Group

UK . 1,468 parts In-Stock

1+ parts

$6.274

100+ parts

-

1k+ parts

$5.647

10k+ parts

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1,468

$6.274

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$5.647

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AZTECH Wire

Italy . 520 parts In-Stock

1+ parts

$9.770

100+ parts

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520

$9.770

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One Stop Electronics

USA . 403 parts In-Stock

1+ parts

$11.000

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403

$11.000

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$23.889

100+ parts

$21.739

1k+ parts

$19.589

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1,000

$23.889

$21.739

$19.589

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Component Stockers USA

USA . 621 parts In-Stock

1+ parts

$99.990

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621

$99.990

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Corphita

USA . 4,823 parts In-Stock

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4,823

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Microchip USA

USA . 2,253 parts In-Stock

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Overview

Unleash the power of high-quality audio conversion with the PCM1803DBG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch Analog-to-Digital Converters that guarantee superior performance and precision. Whether you're working on professional audio equipment or consumer electronics, this product offers unmatched value with its exceptional 24-bit resolution and small outline package. Elevate your projects with the PCM1803DBG4 and experience the benefits of Texas Instruments' cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and resistant to external elements, ensuring durability and reliability.

No. of Analog In Channels: 2

Having 2 analog input channels allows for flexibility in connecting multiple input sources, making it suitable for applications requiring multiple input signals.

Surface Mount: YES

Being surface mountable makes installation and integration easier and more space-efficient in modern electronic designs.

No. of Bits: 24

With a high number of bits, this ADC can provide precise and accurate conversion of analog signals into digital data, suitable for applications requiring high resolution.

Power Supplies (V): 3.3,5

Supporting multiple power supply options allows for compatibility with various systems and power configurations, offering flexibility in deployment.

No. of Terminals: 20

Having 20 terminals provides ample connectivity options and allows for interfacing with other components or peripherals, enhancing versatility in circuit design.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in harsh environmental conditions or extended operation durations.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature enables this ADC to function in cold environments without compromising performance, making it suitable for a wide range of applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The use of high-quality terminal finish enhances connectivity, prevents corrosion, and ensures stable operation over time, increasing the longevity of the product.

Technology: CMOS

Utilizing CMOS technology offers low power consumption, high speed, and compatibility with a wide range of digital systems, making this ADC efficient and versatile.

Maximum Analog Input Voltage: 3 V

Supporting a maximum analog input voltage of 3V makes this ADC suitable for applications where higher input voltages need to be accurately measured and converted.

Sample Rate: 0.096 MHz

The high sample rate of 0.096 MHz allows for fast and efficient conversion of analog signals, enabling real-time data acquisition and processing.

Converter Type: ADC, DELTA-SIGMA

The delta-sigma ADC type offers high resolution and low noise performance, making it ideal for applications requiring precise and high-quality signal conversion.

Nominal Supply Voltage: 5 V

Having a nominal supply voltage of 5V ensures compatibility with standard power sources, making integration easier in a variety of electronic systems.

Output Bit Code: 2'S COMPLEMENT BINARY

The 2's complement binary output bit code allows for easy interpretation of digital data and compatibility with standard data processing systems, ensuring seamless integration.

Output Format: SERIAL

The serial output format simplifies data transmission and enables easy interfacing with microcontrollers or other digital devices, enhancing the overall functionality of this ADC.

Technical Specifications

Analog-to-Digital Converters PCM1803DBG4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

2

No. of Functions:

1

No. of Bits:

24

Sub-Category:

Analog to Digital Converters

Output Bit Code:

2's Complement Binary

Output Format:

Serial

Sample Rate:

96 kHz

Electrical Specifications

Power Supplies:

3.3,5 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

3 V

Nominal Supply Voltage:

5 V

Maximum Supply Current:

10 mA

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Form Factor

Terminal Position:

Dual

No. of Terminals:

20

Terminal Form:

Terminal Pitch:

0.026 in (0.65 mm)

Surface Mount:

Yes

Width:

0.209 in (5.3 mm)

Length:

0.283 in (7.2 mm)

Maximum Seated Height:

0.079 in (2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline, Shrink Pitch

Package Shape:

Package Equivalence Code:

SSOP20,.3

Package Code:

Standards and Codes

JESD-30 Code:

R-PDSO-G20

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

PCM1803DBG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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