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PCM1680DBQG4

Texas Instruments

PCM1680DBQG4 by Texas Instruments

PCM1680DBQG4 by Texas Instruments is a 24-bit D/A converter with 5V supply, 0.2us settling time, and 110mA max current. Ideal for applications requiring precise analog output voltage up to 4.095V in compact designs due to its small outline package and serial input format.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,549 parts In-Stock

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Digiode

USA . 1,248 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 133 parts In-Stock

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EMSNET

USA . 33 parts In-Stock

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Parana Technologies

USA . 1,204 parts In-Stock

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$11.324

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$11.755

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$11.324

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$11.755

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AZTECH Wire

Italy . 482 parts In-Stock

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$11.995

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ChromeModa Solutions

Germany . 6,742 parts In-Stock

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$12.724

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$10.434

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$10.434

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IDEA Electronic Components Group

UK . 964 parts In-Stock

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$12.724

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$12.088

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$11.452

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$11.452

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One Stop Electronics

USA . 1,168 parts In-Stock

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$15.000

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QUARKTWIN TECHNOLOGY LTD

USA . 26,736 parts In-Stock

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Corphita

USA . 4,959 parts In-Stock

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Microchip USA

USA . 1,573 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,302 parts In-Stock

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DigiPath Technology Company

USA . 1,162 parts In-Stock

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$11.472

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Perfect Parts

USA . 1,026 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 451 parts In-Stock

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Overview

Experience high-quality audio with the PCM1680DBQG4 by Texas Instruments, a leading manufacturer in digital-to-analog converters. Perfect for a range of applications, this converter offers precise analog output voltage and fast settling time. With its small outline package and advanced technology, customers can enjoy superior sound performance and reliability. Upgrade your audio systems with the PCM1680DBQG4 and immerse yourself in crystal-clear sound like never before.

Feature Benefit Bullets

Maximum Analog Output Voltage: 4.095 V

This high maximum analog output voltage allows for accurate and precise conversion of digital signals to analog, making this product suitable for applications requiring high resolution.

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides durability and protection to the internal components, ensuring reliability in various environmental conditions.

No. of Bits: 24

With 24 bits of resolution, this DAC offers high precision and accuracy in converting digital signals to analog, resulting in high-quality output signals.

Minimum Operating Temperature: -25 °C

The wide operating temperature range from -25°C to 70°C allows for the product to be used in various environments, making it versatile and reliable for different applications.

Technology: CMOS

Utilizing CMOS technology enables low power consumption, high-speed operation, and compatibility with a wide range of digital systems, making this product efficient and versatile.

Technical Specifications

Digital-to-Analog Converters PCM1680DBQG4 attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Technology:

CMOS

Sub-Category:

Other Converters

Input Format:

Serial

Input Bit Code:

2's Complement Binary

Nominal Settling Time (tstl):

200 ns

Maximum Supply Current:

110 mA

No. of Bits:

24

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

5 V

Minimum Analog Output Voltage:

0 V

Maximum Analog Output Voltage:

4.095 V

Power Supplies:

5 V

Operating Conditions

Minimum Operating Temperature:

-25 °C (-13 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Moisture Sensitivity Level (MSL):

1

Form Factor

No. of Terminals:

28

Terminal Form:

Terminal Position:

Dual

Terminal Pitch:

0.025 in (0.635 mm)

Terminal Finish:

Nickel Palladium Gold

Surface Mount:

Yes

Width:

0.154 in (3.9 mm)

Length:

0.39 in (9.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Small Outline

Package Code:

Package Equivalence Code:

SSOP28,.25

Standards and Codes

Qualified:

No

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Trade Compliance

PCM1680DBQG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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