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PCC2510F32RSPR

Texas Instruments

PCC2510F32RSPR by Texas Instruments

PCC2510F32RSPR by Texas Instruments is a CMOS telecom IC with 36 terminals in a square chip carrier package. Operating temperature range of -40 to 85°C, power supplies of 2.5/3.3V, and surface mountable design make it ideal for industrial applications requiring reliable interface functionality.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,207 parts In-Stock

1+ parts

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6,207

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Digiode

USA . 4,854 parts In-Stock

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4,854

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 396 parts In-Stock

1+ parts

$9.816

100+ parts

-

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396

$9.816

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Parana Technologies

USA . 945 parts In-Stock

1+ parts

$15.821

100+ parts

-

1k+ parts

$16.178

10k+ parts

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945

$15.821

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$16.178

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DigiPath Technology Company

USA . 450 parts In-Stock

1+ parts

$17.420

100+ parts

$16.027

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450

$17.420

$16.027

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IDEA Electronic Components Group

UK . 1,524 parts In-Stock

1+ parts

$17.776

100+ parts

$16.887

1k+ parts

$15.998

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1,524

$17.776

$16.887

$15.998

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ChromeModa Solutions

Germany . 794 parts In-Stock

1+ parts

$17.776

100+ parts

$14.576

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794

$17.776

$14.576

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One Stop Electronics

USA . 936 parts In-Stock

1+ parts

$933.000

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936

$933.000

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Corphita

USA . 100 parts In-Stock

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100

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Overview

Experience the superior quality and reliability of Texas Instruments with the PCC2510F32RSPR. This innovative telecom interface IC is perfect for a variety of applications, offering seamless connectivity and efficiency. With a durable plastic/epoxy package body and industrial temperature grade, this chip carrier style IC ensures optimal performance in any environment. Trust Texas Instruments to provide the power supplies you need, with 36 terminals for flexible use. Upgrade your technology with the PCC2510F32RSPR today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation properties and durability, making the product suitable for a variety of environments.

Surface Mount: YES

Surface mount technology allows for easy assembly onto PCBs, saving space and reducing production costs.

Package Shape: SQUARE

The square shape facilitates efficient placement on the PCB, optimizing use of space.

Power Supplies (V): 2.5/3.3

Compatible with common power supply voltages, ensuring compatibility with other components in the system.

No. of Terminals: 36

Having a higher number of terminals allows for more connections and functionality in the product.

Package Style (Meter): CHIP CARRIER

The chip carrier package style is compact and easy to handle, making it suitable for various applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can perform reliably in a wide range of conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures the product can function even in extreme cold environments.

Terminal Position: QUAD

The quad terminal position allows for efficient routing of connections and simplifies PCB layout.

Temperature Grade: INDUSTRIAL

Designed for industrial use, this product can withstand harsh environmental conditions and high temperatures.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Terminal Form: NO LEAD

The no-lead terminal form is environmentally friendly and provides a reliable connection without the use of lead.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch allows for high-density mounting, enabling more functionality in a compact space.

Technical Specifications

Other Function Telecom Interface ICs PCC2510F32RSPR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N36

No. of Terminals:

36

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC36,.25SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Sub-Category:

Other Telecom ICs

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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