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PCA9515ADGKTG4

Texas Instruments

PCA9515ADGKTG4 by Texas Instruments

PCA9515ADGKTG4 by Texas Instruments is an interface IC with 2 functions, operating at 2.3-3.6V, suitable for industrial applications. It comes in a small outline package with nickel palladium gold finish and operates b/w -40 to 85°C temperature range. The IC has a terminal pitch of 0.65mm and is designed using BICMOS technology.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,263 parts In-Stock

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5,263

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Digiode

USA . 3,755 parts In-Stock

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3,755

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Nova Conductors

Japan . 50 parts In-Stock

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50

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One Stop Electronics

USA . 1,039 parts In-Stock

1+ parts

$0.500

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1,039

$0.500

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Parana Technologies

USA . 2,034 parts In-Stock

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$1.841

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$2.389

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2,034

$1.841

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$2.389

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DigiPath Technology Company

USA . 293 parts In-Stock

1+ parts

$2.027

100+ parts

$1.865

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293

$2.027

$1.865

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ChromeModa Solutions

Germany . 4,562 parts In-Stock

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$2.068

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$1.696

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$2.068

$1.696

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IDEA Electronic Components Group

UK . 2,316 parts In-Stock

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$2.068

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$1.861

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$2.068

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$1.861

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AZTECH Wire

Italy . 608 parts In-Stock

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$12.463

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608

$12.463

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Ampacity Inc.

Singapore . 170 parts In-Stock

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$47.500

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170

$47.500

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QUARKTWIN TECHNOLOGY LTD

USA . 20,264 parts In-Stock

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Continental Prestige Electronics

USA . 6,558 parts In-Stock

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Microchip USA

USA . 4,934 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,688 parts In-Stock

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Corphita

USA . 4,616 parts In-Stock

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Argo Parts USA

USA . 1,427 parts In-Stock

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Metaverse IC Inc.

Canada . 700 parts In-Stock

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700

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Bastille Electronics

Australia . 300 parts In-Stock

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300

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Perfect Parts

USA . 269 parts In-Stock

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269

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Overview

Unlock seamless communication and connectivity with the PCA9515ADGKTG4 by Texas Instruments. This cutting-edge interface IC boasts superior quality and reliability, backed by the trusted name of Texas Instruments. Ideal for a wide range of applications in the category of Other Function Interface ICs, this product offers unparalleled value and benefits to customers seeking efficient and effective solutions. Experience the advantages of smooth data transmission and enhanced performance with the PCA9515ADGKTG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable and long-lasting applications.

Surface Mount: YES

The surface mount feature allows for easy and compact installation on PCBs, saving space and simplifying assembly processes.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this product can handle a wide range of power inputs, providing flexibility in various operating conditions.

No. of Functions: 2

Having multiple functions in a single IC simplifies the design and integration process, reducing the need for additional components and optimizing performance.

Package Shape: SQUARE

The square package shape helps in efficient utilization of space on the PCB, enabling compact designs and efficient layout arrangements.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliability and stability of the product even in harsh environmental conditions, making it suitable for industrial applications.

Technical Specifications

Other Function Interface ICs PCA9515ADGKTG4 attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

3 V

Maximum Supply Voltage-1:

3.6 V

Minimum Supply Voltage-1:

2.3 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

PCA9515ADGKTG4 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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