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P87561IRNFRQ1

Texas Instruments

P87561IRNFRQ1 by Texas Instruments

P87561IRNFRQ1 by Texas Instruments is a switching regulator with 26 terminals, operating temperature range of -40 to 125°C. It features a max output current of 16A, PWM control technique, and BUCK switcher configuration. Ideal for automotive applications due to its compact size (4.5mm x 4mm) and high switching frequency of 2200kHz.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 5,605 parts In-Stock

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Digiode

USA . 4,558 parts In-Stock

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One Stop Electronics

USA . 1,145 parts In-Stock

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$5.500

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$5.500

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Semicontronic

India . 1,170 parts In-Stock

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$7.500

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$7.312

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$7.275

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$7.500

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Ampacity Inc.

Singapore . 363 parts In-Stock

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$7.500

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AZTECH Wire

Italy . 866 parts In-Stock

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$10.857

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Parana Technologies

USA . 1,797 parts In-Stock

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$12.496

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$12.936

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DigiPath Technology Company

USA . 2,011 parts In-Stock

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$13.759

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$12.658

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$13.759

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IDEA Electronic Components Group

UK . 746 parts In-Stock

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$14.040

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$13.338

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$12.636

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746

$14.040

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ChromeModa Solutions

Germany . 711 parts In-Stock

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$14.040

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$11.513

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Microchip USA

USA . 2,914 parts In-Stock

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Corphita

USA . 1,761 parts In-Stock

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Corohmni

South Africa . 371 parts In-Stock

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Overview

Unlock the power of efficient energy conversion with Texas Instruments' P87561IRNFRQ1 Switching Regulator. Designed for automotive applications, this chip carrier is a game-changer in current-mode control. With a maximum output current of 16A and a wide input voltage range from 2.8V to 5.5V, this switching regulator offers superior performance and reliability. Say goodbye to energy wastage and hello to optimized power management with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material ensures the product is easy to handle and long-lasting.

Surface Mount: YES

Easily mountable on circuit boards, saving space and simplifying assembly.

No. of Terminals: 26

Sufficient terminals for multiple connections and configurations.

Maximum Operating Temperature: 125 °C

Capable of operating in high-temperature environments, suitable for various applications.

Control Mode: CURRENT-MODE

Efficient control mode for stable and precise output regulation.

Minimum Operating Temperature: -40 °C

Can withstand low temperatures, making it suitable for a wide range of environments.

Nominal Input Voltage: 3.7 V

Compatible with common input voltage levels, ensuring versatility in usage.

Maximum Output Current: 16 A

Capable of handling high output currents for powering various devices.

Control Technique: PULSE WIDTH MODULATION

Efficient control technique for adjusting output voltage with precision.

Switcher Config: BUCK

Efficient buck configuration for voltage regulation, reducing power loss.

Technical Specifications

Switching Regulators & Controllers P87561IRNFRQ1 attributes and parameters. Explore more Switching Regulators & Controllers devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES IN PFM CONTROL TECHNIQUE; OUTPUT IN ADJUSTABLE MODE IS 0.6V TO 3.36V

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

5.5 V

Minimum Input Voltage:

2.8 V

Nominal Input Voltage:

3.7 V

JESD-30 Code:

R-PQCC-N26

Length:

4.5 mm

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

26

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

16 A

Maximum Output Voltage:

3.36 V

Minimum Output Voltage:

.6 V

Nominal Output Voltage:

1 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG

Maximum Seated Height:

.9 mm

Surface Mount:

YES

Switcher Config:

BUCK

Maximum Switching Frequency:

2200 kHz

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width (mm):

4 mm

Trade Compliance

P87561IRNFRQ1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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