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OPA890IDBVTG4

Texas Instruments

OPA890IDBVTG4 by Texas Instruments

OPA890IDBVTG4 by Texas Instruments is an operational amplifier with a max input offset voltage of 6000uV, ideal for industrial applications. With a nominal voltage of 5V and a min slew rate of 175V/us, it offers high performance in a compact package. This op amp features bipolar technology, voltage-feedback architecture, and wideband capability for versatile circuit designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 9,930 parts In-Stock

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Vyrian

USA . 5,737 parts In-Stock

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Digiode

USA . 2,798 parts In-Stock

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One Stop Electronics

USA . 158 parts In-Stock

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$5.410

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$5.410

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Parana Technologies

USA . 749 parts In-Stock

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$6.303

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$7.054

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$6.303

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DigiPath Technology Company

USA . 2,313 parts In-Stock

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$6.940

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$6.385

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IDEA Electronic Components Group

UK . 1,364 parts In-Stock

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$7.082

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$6.374

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ChromeModa Solutions

Germany . 491 parts In-Stock

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$7.082

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$5.807

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$7.082

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AZTECH Wire

Italy . 351 parts In-Stock

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$9.024

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Microchip USA

USA . 2,540 parts In-Stock

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Corphita

USA . 1,523 parts In-Stock

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Overview

Experience unparalleled precision and performance with the OPA890IDBVTG4 operational amplifier by Texas Instruments. Designed with superior quality and reliability, this amplifier is ideal for a wide range of applications in industries such as automotive, industrial, and telecommunications. With its compact design and advanced technology, the OPA890IDBVTG4 offers exceptional value, accuracy, and efficiency to customers looking for top-notch operational amplifiers. Trust Texas Instruments for cutting-edge solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the operational amplifier, making it suitable for a variety of environments.

Maximum Input Offset Voltage: 6000 uV

The low input offset voltage ensures accurate performance in precision applications, making this operational amplifier a reliable choice for critical measurements.

Maximum Average Bias Current (IIB): 2 uA

With a low bias current, this operational amplifier minimizes power consumption and improves stability in circuits, making it ideal for low-power applications.

Surface Mount: YES

The surface mount capability enables easy and efficient installation on circuit boards, saving space and simplifying assembly processes.

Nominal Common Mode Reject Ratio: 67 dB

The high common mode rejection ratio ensures that the operational amplifier can effectively reject interference and noise, leading to clean and accurate signal amplification.

Nominal Supply Voltage / Vsup (V): 5

The nominal supply voltage of 5V makes this operational amplifier compatible with standard power sources, making it versatile for a wide range of applications.

Power Supplies (V): +-1.5/+-6/3/12

The wide range of power supply options allows flexibility in design and compatibility with various voltage sources, making this operational amplifier suitable for diverse circuit configurations.

No. of Terminals: 6

The 6 terminals provide convenient connectivity for input, output, and power connections, enabling easy integration into different circuit layouts.

Minimum Slew Rate: 175 V/us

The fast slew rate ensures rapid response to input signal changes, making this operational amplifier ideal for applications requiring high-speed signal processing.

Minimum Voltage Gain: 400

The high minimum voltage gain allows for amplification of weak signals with high fidelity, making this operational amplifier suitable for demanding amplification tasks.

Technology: BIPOLAR

The bipolar technology used in this operational amplifier offers good linearity and low noise performance, making it ideal for precision applications requiring accurate signal processing.

Amplifier Type: OPERATIONAL AMPLIFIER

As an operational amplifier, this product is designed for amplifying and processing signals with high efficiency and precision, making it a versatile choice for a wide range of electronic applications.

Technical Specifications

Operational Amplifiers (Op Amps) OPA890IDBVTG4 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

BIPOLAR

Power Supply:

±1.5/±6/3/12 V

Total Functions:

1

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

No

Low-Offset:

No

Micropower:

No

Wideband:

Yes

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

100 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

67 dB

Minimum Common Mode Rejection Ratio (CMRR ):

61 dB

Input Offset Voltage Limit:

6000 uV

Minimum Voltage Gain:

400

Minimum Slew Rate:

175 V/us

Nominal Slew Rate:

500 V/us

Maximum Input Offset Current (IIO):

350 nA

Peak Bias Current:

2 uA

Maximum Bias Current (IIB) @25 °C:

1.6 uA

Operational Characteristics

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

6 V

Maximum Negative Supply Voltage:

-5 V

Minimum Negative Supply Voltage:

-6 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Supply Current:

1.2 mA

Physical Characteristics

Length:

0.114 in (2.9 mm)

Width:

0.063 in (1.6 mm)

Maximum Seated Height:

0.057 in (1.45 mm)

Total Terminals:

6

Terminal Pitch:

0.037 in (0.95 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel/Palladium/Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

2

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

Package Shape:

Package Style:

Small Outline, Low Profile, Shrink Pitch

Package Equivalence Code:

TSOP6,.11,37

Trade Compliance

OPA890IDBVTG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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