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OPA857TD1

Texas Instruments

OPA857TD1 by Texas Instruments

The Texas Instruments OPA857TD1 is an Operational Amplifier with a max input offset voltage of 10000 uV and nominal unity gain bandwidth of 130000 kHz. It is designed for industrial applications, operates b/w -40 to 85 °C, and features a surface mount rectangular package with 15 terminals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,997 parts In-Stock

1+ parts

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4,997

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Vyrian

USA . 4,498 parts In-Stock

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100+ parts

-

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10k+ parts

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4,498

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,416 parts In-Stock

1+ parts

$2.410

100+ parts

-

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1,416

$2.410

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Parana Technologies

USA . 847 parts In-Stock

1+ parts

$3.797

100+ parts

-

1k+ parts

$4.286

10k+ parts

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847

$3.797

-

$4.286

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DigiPath Technology Company

USA . 1,669 parts In-Stock

1+ parts

$4.181

100+ parts

-

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1,669

$4.181

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ChromeModa Solutions

Germany . 2,456 parts In-Stock

1+ parts

$4.266

100+ parts

$3.498

1k+ parts

-

10k+ parts

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2,456

$4.266

$3.498

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IDEA Electronic Components Group

UK . 1,843 parts In-Stock

1+ parts

$4.266

100+ parts

-

1k+ parts

$3.839

10k+ parts

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1,843

$4.266

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$3.839

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AZTECH Wire

Italy . 860 parts In-Stock

1+ parts

$18.424

100+ parts

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860

$18.424

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Corphita

USA . 523 parts In-Stock

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523

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Overview

Elevate your design with the OPA857TD1 by Texas Instruments, a high-quality operational amplifier that offers unmatched performance and reliability. Manufactured by the industry leader in semiconductor technology, this Op Amp is perfect for a wide range of applications. From industrial automation to consumer electronics, this compact and efficient chip provides exceptional value, precision, and versatility. Trust Texas Instruments to deliver cutting-edge solutions that exceed your expectations.

Feature Benefit Bullets

Maximum Input Offset Voltage: 10000 uV

Low input offset voltage ensures accurate and precise signal processing, making this operational amplifier suitable for high-precision applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and effort during manufacturing processes.

Package Shape: RECTANGULAR

Rectangular package shape facilitates compact and efficient layout design on the PCB, optimizing space usage in electronic circuits.

No. of Terminals: 15

Higher number of terminals provides flexibility in connecting external components and peripherals, allowing for versatile circuit configurations.

Package Style (Meter): UNCASED CHIP

Uncased chip package style offers a small footprint and enhances heat dissipation, improving overall performance and reliability.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable operation in various environmental conditions, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Wide operating temperature range allows for operation in harsh environments and ensures consistent performance in extreme temperature conditions.

Terminal Position: UPPER

Upper terminal position simplifies PCB layout and wiring, improving overall ease of assembly and maintenance.

Width: 0.785 mm

Compact width dimensions enable space-saving integration in tight layouts, making this operational amplifier ideal for small form-factor applications.

Length: 0.807 mm

Short length design contributes to a smaller overall footprint on the PCB, allowing for densely packed circuit designs and efficient use of available space.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable operation in harsh industrial environments, making this operational amplifier suitable for rugged applications.

Nominal Unity Gain Bandwidth: 130000 kHz

High unity gain bandwidth supports high-speed signal processing and amplification, making this operational amplifier suitable for applications requiring fast response times.

Terminal Form: NO LEAD

No lead terminal form simplifies soldering and assembly processes, reducing the risk of damage during installation and enhancing overall product reliability.

Amplifier Type: OPERATIONAL AMPLIFIER

Designed as an operational amplifier, this product offers precision amplification and signal processing capabilities, making it a versatile choice for a wide range of applications.

Technical Specifications

Operational Amplifiers (Op Amps) OPA857TD1 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Total Functions:

1

Sub-Category:

Operational Amplifiers

Performance Specifications

Nominal Unity Gain Bandwidth:

130 MHz

Input Offset Voltage Limit:

10000 uV

Operational Characteristics

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Physical Characteristics

Length:

0.032 in (0.807 mm)

Width:

0.031 in (0.785 mm)

Total Terminals:

15

Terminal Position:

Upper

Terminal Form:

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Standards

JESD-30 Code:

R-XUUC-N15

Packaging and Shipping

Package Code:

DIE

Package Shape:

Package Style:

Uncased Chip

Trade Compliance

OPA857TD1 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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