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OPA832IDR

Texas Instruments

OPA832IDR by Texas Instruments

OPA832IDR by Texas Instruments is a video amplifier with 8 terminals, operating temperature range of -40 to 85°C, and supply voltage range of 1.4V to 5.5V. It is designed for audio and video applications requiring a small outline package with gull wing terminals in industrial settings.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,246 parts In-Stock

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Digiode

USA . 437 parts In-Stock

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437

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Distributors (Availability)

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Parana Technologies

USA . 315 parts In-Stock

1+ parts

$2.680

100+ parts

-

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$3.163

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315

$2.680

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$3.163

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DigiPath Technology Company

USA . 667 parts In-Stock

1+ parts

$2.951

100+ parts

$2.715

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667

$2.951

$2.715

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ChromeModa Solutions

Germany . 1,487 parts In-Stock

1+ parts

$3.011

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$2.469

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1,487

$3.011

$2.469

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IDEA Electronic Components Group

UK . 312 parts In-Stock

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$3.011

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$2.710

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312

$3.011

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$2.710

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AZTECH Wire

Italy . 868 parts In-Stock

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$19.800

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868

$19.800

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One Stop Electronics

USA . 332 parts In-Stock

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$19.800

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332

$19.800

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A-Z Elektronik GmbH

Germany . 6,006 parts In-Stock

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Microchip USA

USA . 4,670 parts In-Stock

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Lixinc

USA . 4,163 parts In-Stock

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Corphita

USA . 3,314 parts In-Stock

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Perfect Parts

USA . 874 parts In-Stock

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Overview

Elevate your audio and video experience with the OPA832IDR from Texas Instruments. Crafted with precision and expertise, this video amplifier offers unparalleled quality and performance. Perfect for a wide range of applications in the audio and video industry, this product delivers crisp and clear signals to enhance your viewing and listening pleasure. With its compact design and advanced technology, the OPA832IDR provides customers with exceptional value, reliability, and convenience. Upgrade your system today and immerse yourself in a world of high-quality sound and visuals like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, perfect for portable applications.

Surface Mount: YES

Being surface mountable, this amplifier is easy to integrate into circuit boards, saving space and simplifying assembly.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient placement and alignment on the circuit board, optimizing space usage.

General IC Type: VIDEO AMPLIFIER

Designed specifically for video amplification, this product ensures high-quality video output and performance.

No. of Terminals: 8

The ample number of terminals allow for versatile connectivity options, enabling compatibility with different systems and setups.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB and reduces the overall footprint of the amplifier, ideal for compact designs.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this amplifier can withstand demanding environmental conditions and ensure reliable performance.

Minimum Operating Temperature: -40 °C

The wide temperature range allows the amplifier to operate in extreme cold environments, making it suitable for a variety of applications.

Terminal Position: DUAL

The dual terminal position provides flexibility in installation and connection, accommodating various wiring configurations.

Maximum Seated Height: 1.75 mm

The low seated height allows for a slim profile and compact design, making it easy to integrate the amplifier into tight spaces.

Width: 3.9 mm

The narrow width of the amplifier contributes to its space-saving design, enabling efficient use of PCB real estate.

Minimum Supply Voltage (Vsup): 1.4 V

The low minimum supply voltage requirement allows for operation in low-power scenarios, making the amplifier energy-efficient.

Length: 4.9 mm

The short length of the amplifier further enhances its compact form factor, facilitating integration into small electronic devices.

Temperature Grade: INDUSTRIAL

Designed for industrial use, this amplifier meets high standards of reliability and durability, making it suitable for rugged environments.

Technology: BIPOLAR

The bipolar technology used in this amplifier ensures high performance and accuracy in video signal amplification, delivering superior results.

Terminal Form: GULL WING

The gull-wing terminal form simplifies the soldering process and ensures secure connections, enhancing the overall reliability of the amplifier.

Terminal Pitch: 1.27 mm

The narrow terminal pitch allows for dense packing of components on the PCB, optimizing board space and improving design flexibility.

Maximum Supply Voltage (Vsup): 5.5 V

The high maximum supply voltage capability provides headroom for signal amplification, accommodating a wide range of input signals for versatile performance.

Technical Specifications

Audio & Video Amplifiers OPA832IDR attributes and parameters. Explore more Audio & Video Amplifiers devices from Texas Instruments

Specs

Additional Features:

IT CAN ALSO OPERATE WITH 2.8V TO 11V SINGLE SUPPLY

General IC Type:

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.4 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

OPA832IDR General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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