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OPA832IDG4

Texas Instruments

OPA832IDG4 by Texas Instruments

OPA832IDG4 by Texas Instruments is a video amplifier IC with 8 terminals, operating temperature range of -40 to 85°C, and supply voltage from 1.4V to 5.5V. It is designed for audio & video applications requiring small outline packaging and industrial-grade performance in a compact form factor.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,956 parts In-Stock

1+ parts

-

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3,956

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Digiode

USA . 671 parts In-Stock

1+ parts

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671

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 570 parts In-Stock

1+ parts

$1.941

100+ parts

-

1k+ parts

$2.476

10k+ parts

-

570

$1.941

-

$2.476

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DigiPath Technology Company

USA . 608 parts In-Stock

1+ parts

$2.137

100+ parts

$1.966

1k+ parts

-

10k+ parts

-

608

$2.137

$1.966

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ChromeModa Solutions

Germany . 3,893 parts In-Stock

1+ parts

$2.181

100+ parts

$1.788

1k+ parts

-

10k+ parts

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3,893

$2.181

$1.788

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IDEA Electronic Components Group

UK . 227 parts In-Stock

1+ parts

$2.181

100+ parts

-

1k+ parts

$1.963

10k+ parts

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227

$2.181

-

$1.963

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One Stop Electronics

USA . 590 parts In-Stock

1+ parts

$4.800

100+ parts

-

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590

$4.800

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AZTECH Wire

Italy . 630 parts In-Stock

1+ parts

$10.429

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630

$10.429

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Corphita

USA . 3,323 parts In-Stock

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3,323

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Overview

Elevate your audio and video experiences with the OPA832IDG4 by Texas Instruments. Crafted with precision and expertise, this video amplifier offers unparalleled quality and performance in a compact package. Whether you're looking to enhance your home entertainment system or streamline your professional audio setup, this versatile device delivers exceptional clarity and fidelity. Trust Texas Instruments to provide innovative solutions that elevate your audiovisual experiences to new heights. Choose the OPA832IDG4 and immerse yourself in the world of superior sound and visuals.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable audio and video amplifier applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving space and reducing assembly time.

General IC Type: VIDEO AMPLIFIER

Specifically designed for video amplification, ensuring high-quality and clear video output for a better viewing experience.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, ensuring stable performance over time.

Minimum Supply Voltage (Vsup): 1.4 V

Low minimum supply voltage requirement allows for efficient power usage and compatibility with a wide range of power sources.

Maximum Seated Height: 1.75 mm

Compact design with low seated height allows for easy integration into space-constrained applications.

Technology: BIPOLAR

Bipolar technology provides high gain and wide bandwidth, ideal for high-frequency video amplification with improved signal integrity.

Technical Specifications

Audio & Video Amplifiers OPA832IDG4 attributes and parameters. Explore more Audio & Video Amplifiers devices from Texas Instruments

Specs

Additional Features:

IT CAN ALSO OPERATE WITH 2.8V TO 11V SINGLE SUPPLY

General IC Type:

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.4 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

OPA832IDG4 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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