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OPA2832IDGKRG4

Texas Instruments

OPA2832IDGKRG4 by Texas Instruments

OPA2832IDGKRG4 by Texas Instruments is a dual operational amplifier with 8 terminals in a small outline package. It features a max seated height of 1.1mm, 0.65mm terminal pitch, and industrial temperature grade. Ideal for applications requiring precise signal amplification in compact electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,589 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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3,589

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-

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Digiode

USA . 2,149 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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2,149

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 376 parts In-Stock

1+ parts

$4.410

100+ parts

-

1k+ parts

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10k+ parts

-

376

$4.410

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-

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Parana Technologies

USA . 238 parts In-Stock

1+ parts

$4.613

100+ parts

-

1k+ parts

$5.082

10k+ parts

-

238

$4.613

-

$5.082

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DigiPath Technology Company

USA . 228 parts In-Stock

1+ parts

$5.079

100+ parts

$4.673

1k+ parts

-

10k+ parts

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228

$5.079

$4.673

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ChromeModa Solutions

Germany . 3,556 parts In-Stock

1+ parts

$5.183

100+ parts

$4.250

1k+ parts

-

10k+ parts

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3,556

$5.183

$4.250

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IDEA Electronic Components Group

UK . 2,182 parts In-Stock

1+ parts

$5.183

100+ parts

-

1k+ parts

$4.665

10k+ parts

-

2,182

$5.183

-

$4.665

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AZTECH Wire

Italy . 305 parts In-Stock

1+ parts

$18.260

100+ parts

-

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10k+ parts

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305

$18.260

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Corphita

USA . 4,452 parts In-Stock

1+ parts

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4,452

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Microchip USA

USA . 279 parts In-Stock

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279

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Overview

Elevate your electronic designs with the OPA2832IDGKRG4 by Texas Instruments. As a trusted leader in the industry, Texas Instruments delivers unparalleled quality and reliability in their operational amplifiers. This innovative product offers dual functions in a compact square package, making it ideal for a wide range of applications. Experience enhanced performance and precision with this industrial-grade amplifier, designed to meet your unique needs. Trust Texas Instruments to provide cutting-edge technology and exceptional value in every product they create.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides good durability and protection for the internal components of the operational amplifier.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving time and effort during manufacturing.

No. of Functions: 2

Having 2 functions in one package provides versatility and flexibility for various applications that may require different operational capabilities.

Package Shape: SQUARE

The square shape of the package allows for efficient use of space on the PCB, making it suitable for compact designs.

No. of Terminals: 8

With 8 terminals, this operational amplifier offers sufficient connectivity options for different input and output requirements in a circuit.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This package style provides a low profile and compact form factor, making it suitable for space-constrained applications.

Terminal Position: DUAL

The dual terminal position allows for convenient routing of connections and reduces the chances of signal interference, enhancing the overall performance of the operational amplifier.

Maximum Seated Height: 1.1 mm

The low maximum seated height of 1.1 mm makes this operational amplifier ideal for applications where space is limited and a low profile is required.

Width: 3 mm

The compact width of 3 mm enables easy integration into small electronic devices or PCB layouts.

Length: 3 mm

The small length of 3 mm further contributes to the overall compactness and space-saving design of the operational amplifier.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable performance and operation in harsh environmental conditions, making this operational amplifier suitable for industrial applications.

Technology: BIPOLAR

The bipolar technology used in this operational amplifier offers high precision and low noise characteristics, making it ideal for applications that require accurate signal processing.

Terminal Form: GULL WING

The gull wing terminal form provides secure solder connections and facilitates easy placement and soldering during assembly, ensuring reliable connectivity.

Amplifier Type: OPERATIONAL AMPLIFIER

Being an operational amplifier, this product is designed for precise and stable amplification of signals, making it suitable for a wide range of signal processing applications.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65 mm allows for high-density mounting on the PCB, enabling compact and space-efficient circuit designs.

Technical Specifications

Operational Amplifiers (Op Amps) OPA2832IDGKRG4 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Technology:

BIPOLAR

Total Functions:

2

Sub-Category:

Operational Amplifiers

Physical Characteristics

Length:

0.118 in (3 mm)

Width:

0.118 in (3 mm)

Maximum Seated Height:

0.043 in (1.1 mm)

Total Terminals:

8

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Position:

Dual

Terminal Form:

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

S-PDSO-G8

Packaging and Shipping

Package Code:

Package Shape:

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Trade Compliance

OPA2832IDGKRG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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