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OPA234UE4

Texas Instruments

OPA234UE4 by Texas Instruments

OPA234UE4 by Texas Instruments is an Operational Amplifier with a max input offset voltage of 250uV, low bias current of 0.025uA, and high common mode reject ratio of 106dB. Ideal for automotive applications due to its micropower technology, compact size (1.75mm seated height), and wide temperature range (-40 to 125 °C).

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,716 parts In-Stock

1+ parts

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5,716

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Digiode

USA . 3,391 parts In-Stock

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3,391

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 10 parts In-Stock

1+ parts

$6.245

100+ parts

$579.955

1k+ parts

$5.621

10k+ parts

-

10

$6.245

$579.955

$5.621

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One Stop Electronics

USA . 333 parts In-Stock

1+ parts

$6.410

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-

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333

$6.410

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DigiPath Technology Company

USA . 677 parts In-Stock

1+ parts

$6.877

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677

$6.877

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ChromeModa Solutions

Germany . 4,714 parts In-Stock

1+ parts

$7.017

100+ parts

$5.754

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4,714

$7.017

$5.754

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IDEA Electronic Components Group

UK . 376 parts In-Stock

1+ parts

$7.017

100+ parts

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$6.315

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376

$7.017

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$6.315

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AZTECH Wire

Italy . 755 parts In-Stock

1+ parts

$10.398

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755

$10.398

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Component Stockers USA

USA . 554 parts In-Stock

1+ parts

$99.990

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554

$99.990

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Corphita

USA . 1,903 parts In-Stock

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Microchip USA

USA . 221 parts In-Stock

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221

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Overview

Enhance your electronic designs with the OPA234UE4 from Texas Instruments, a top-quality operational amplifier that delivers precision and reliability. Manufactured by industry leader Texas Instruments, this op amp is ideal for a wide range of applications. With low offset voltage, micropower capabilities, and high common-mode rejection ratio, this compact device offers exceptional performance. Whether you're working on automotive projects or need a reliable amplifier for your circuits, the OPA234UE4 provides the value, efficiency, and quality you need to bring your designs to life.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and reliable material for long-term use.

Maximum Input Offset Voltage: 250 uV

Low offset voltage ensures accurate signal processing.

Nominal Supply Voltage / Vsup (V): 15

Optimal supply voltage for efficient operation.

Nominal Common Mode Reject Ratio: 106 dB

High common mode rejection ratio for improved noise rejection.

Low-Offset: YES

Low offset for precise signal amplification.

Nominal Unity Gain Bandwidth: 350 kHz

High unity gain bandwidth for fast signal processing.

Technology: BIPOLAR

Bipolar technology for reliable and stable performance.

Architecture: VOLTAGE-FEEDBACK

Voltage-feedback architecture for accurate voltage amplification.

Technical Specifications

Operational Amplifiers (Op Amps) OPA234UE4 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

BIPOLAR

Power Supply:

±1.35/±18/2.7/36 V

Total Functions:

1

Sub-Category:

Operational Amplifiers

Frequency Compensation:

Yes

Low-Offset:

Yes

Micropower:

Yes

Performance Specifications

Nominal Unity Gain Bandwidth:

350 kHz

Nominal Common Mode Rejection Ratio (CMRR ):

106 dB

Input Offset Voltage Limit:

250 uV

Minimum Voltage Gain:

19950

Nominal Slew Rate:

0.2 V/us

Peak Bias Current:

-25 nA

Maximum Bias Current (IIB) @25 °C:

30 nA

Operational Characteristics

Nominal Supply Voltage:

15 V

Maximum Supply Voltage:

18 V

Maximum Negative Supply Voltage:

-15 V

Minimum Negative Supply Voltage:

-18 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Maximum Supply Current:

350 μA

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

Packaging and Shipping

Packing Method:

Tube

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP8,.25

Trade Compliance

OPA234UE4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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