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OPA2345EA/2K5G4

Texas Instruments

OPA2345EA/2K5G4 by Texas Instruments

OPA2345EA/2K5G4 by Texas Instruments is a CMOS Operational Amplifier with 1200uV Max Input Offset Voltage, 92dB Nominal CMRR, and 3000kHz Unity Gain Bandwidth. Ideal for industrial applications requiring low-bias current and micropower consumption. Package style: Small Outline, Thin Profile, Shrink Pitch.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,687 parts In-Stock

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8,687

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Digiode

USA . 1,287 parts In-Stock

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1,287

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Distributors (Availability)

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One Stop Electronics

USA . 1,416 parts In-Stock

1+ parts

$3.410

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1,416

$3.410

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Parana Technologies

USA . 237 parts In-Stock

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$3.893

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$4.370

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237

$3.893

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$4.370

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DigiPath Technology Company

USA . 1,174 parts In-Stock

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$4.287

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$3.944

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1,174

$4.287

$3.944

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ChromeModa Solutions

Germany . 2,976 parts In-Stock

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$4.374

100+ parts

$3.587

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2,976

$4.374

$3.587

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IDEA Electronic Components Group

UK . 1,845 parts In-Stock

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$4.374

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$3.937

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1,845

$4.374

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$3.937

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AZTECH Wire

Italy . 280 parts In-Stock

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$9.709

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280

$9.709

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Kepictronics

USA . 10,000 parts In-Stock

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Corphita

USA . 5,000 parts In-Stock

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Microchip USA

USA . 320 parts In-Stock

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Overview

Experience superior performance and reliability with the OPA2345EA/2K5G4 operational amplifier by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality components for a wide range of applications. This versatile op amp offers exceptional value with low bias current, micropower operation, and high common-mode rejection ratio. Whether you're designing precision instrumentation, sensor interfaces, or signal conditioning circuits, this compact op amp is the perfect choice for your next project. Trust Texas Instruments to provide innovative solutions that exceed your expectations.

Feature Benefit Bullets

No. of Functions: 2

Having multiple functions allows for greater versatility in circuit design, making this op amp suitable for a variety of applications.

Nominal Common Mode Reject Ratio: 92 dB

A high CMRR value indicates strong rejection of common mode signals, ensuring improved signal integrity and accuracy.

No. of Terminals: 8

The 8-terminal configuration allows for compact integration within circuit designs, accommodating numerous application needs.

Maximum Supply Voltage Limit: 7.5 V

A maximum supply voltage of 7.5 V allows for compatibility with various power supply levels, making it adaptable to different circuits.

Amplifier Type: Operational Amplifier

Operational amplifiers are fundamental components in signal conditioning, making this product suitable for a wide range of electronic applications.

Architecture: Voltage Feedback

Voltage feedback architecture is widely used for its stability and ease of use, ensuring reliable performance in various configurations.

Maximum Average Bias Current (IIB): 10 pA

Low bias current minimizes offset errors and enhances accuracy in signal processing, ideal for precision applications.

Maximum Input Offset Voltage: 1200 µV

A low input offset voltage contributes to higher accuracy in performance, making it well-suited for sensitive applications.

Length: 0.118 in (3 mm)

The small size allows for easy integration into compact electronic designs, saving space on PCBs.

Low-Bias: Yes

Low-bias design reduces power consumption and increases operational life, especially important in battery-powered devices.

Micropower: Yes

Micropower capabilities make this op amp energy-efficient, contributing to reduced energy costs in long-term applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliability in industrial applications where heat is a concern.

Minimum Operating Temperature: -40 °C

A wide operating temperature range allows the device to function in extreme conditions, making it suitable for rugged environments.

Package Body Material: Plastic/Epoxy

Durable materials enhance the longevity of the product, making it robust for various application needs.

Package Shape: Square

The square package shape aids in space-efficient layouts on PCBs, optimizing performance in limited area designs.

Package Style (Meter): Small Outline, Thin Profile, Shrink Pitch

This style supports modern, compact design trends, allowing for minimalist PCB layouts without sacrificing performance.

Packing Method: Tape And Reel

Tape and reel packaging supports automated assembly processes, increasing manufacturing efficiency and speed.

Power Supplies (V): 3/5 V

Supports multiple voltage levels which enhances compatibility with various systems and reduces design constraints.

Maximum Seated Height: 0.043 in (1.1 mm)

A low profile allows for implementation in height-restricted applications, maintaining functionality in tight spaces.

Nominal Slow Rate: 2 V/us

A moderate slow rate allows for manageable response times in signal processing applications, balancing speed and accuracy.

Maximum Supply Current: 600 μA

Low supply current is indicative of energy efficiency, which is essential for battery-operated devices.

Nominal Supply Voltage / Vsup (V): 5.5 V

An optimal nominal supply voltage allows for peak performance under standard operating conditions, ensuring reliability.

Surface Mount: Yes

Surface mount technology allows for automated assembly and compact designs, streamlining manufacturing processes.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making this product ideal for various applications.

Temperature Grade: Industrial

Industrial-grade components are built to withstand harsher environments, ensuring reliability in critical applications.

Terminal Form: Gull Wing

Gull wing terminals facilitate easier soldering and assembly, improving reliability and manufacturability.

Terminal Pitch: 0.026 in (0.65 mm)

A fine terminal pitch allows for high-density layouts, maximizing the use of available board space.

Terminal Position: Dual

Dual terminal positioning supports better circuit layout design and connectivity options, enhancing versatility in applications.

Nominal Unity Gain Bandwidth: 3 MHz

A bandwidth of 3 MHz is sufficient for many general-purpose applications, allowing for effective signal amplification.

Minimum Voltage Gain: 31600

High minimum voltage gain enhances amplification capabilities, making it suitable for low signal level applications.

Width: 0.118 in (3 mm)

The compact width contributes to space-saving design in PCBs, ideal for modern electronic devices.

Technical Specifications

Operational Amplifiers (Op Amps) OPA2345EA/2K5G4 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

3/5 V

Total Functions:

2

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

YES (AVCL>=5)

Low-Bias:

Yes

Low-Offset:

No

Micropower:

Yes

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

3 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

92 dB

Input Offset Voltage Limit:

1200 uV

Minimum Voltage Gain:

31600

Nominal Slew Rate:

2 V/us

Peak Bias Current:

10 pA

Maximum Bias Current (IIB) @25 °C:

10 pA

Operational Characteristics

Nominal Supply Voltage:

5.5 V

Maximum Supply Voltage:

7.5 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Maximum Supply Current:

600 μA

Physical Characteristics

Length:

0.118 in (3 mm)

Width:

0.118 in (3 mm)

Maximum Seated Height:

0.043 in (1.1 mm)

Total Terminals:

8

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Position:

Dual

Terminal Form:

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

S-PDSO-G8

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

Package Shape:

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Equivalence Code:

TSSOP8,.19

Trade Compliance

OPA2345EA/2K5G4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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