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OPA2343EA/250G4

Texas Instruments

OPA2343EA/250G4 by Texas Instruments

OPA2343EA/250G4 by Texas Instruments is a CMOS operational amplifier with 8000uV max input offset voltage, 92dB nominal CMRR, and 5500kHz unity gain bandwidth. Ideal for industrial applications requiring low bias current and high voltage feedback architecture in a small outline package.

Median Price

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Lifecycle Status

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4

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1k+

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Chip Stock

USA . 14,610 parts In-Stock

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Vyrian

USA . 4,944 parts In-Stock

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Digiode

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Nova Conductors

Japan . 35 parts In-Stock

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Parana Technologies

USA . 653 parts In-Stock

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$1.454

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$2.140

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$1.454

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DigiPath Technology Company

USA . 2,376 parts In-Stock

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$1.601

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$1.473

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IDEA Electronic Components Group

UK . 1,235 parts In-Stock

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$1.634

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$1.471

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$1.634

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ChromeModa Solutions

Germany . 1,130 parts In-Stock

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$1.634

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$1.340

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$1.634

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Corohmni

South Africa . 349 parts In-Stock

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$1.649

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One Stop Electronics

USA . 730 parts In-Stock

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$2.410

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AZTECH Wire

Italy . 664 parts In-Stock

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Continental Prestige Electronics

USA . 5,380 parts In-Stock

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Microchip USA

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Argo Parts USA

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Corphita

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A-Z Elektronik GmbH

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Bastille Electronics

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Overview

Elevate your electronics with the OPA2343EA/250G4 by Texas Instruments, a top-of-the-line operational amplifier designed for precision and reliability. With a reputation for excellence in semiconductor manufacturing, Texas Instruments delivers unparalleled quality in every product. Ideal for a wide range of applications, this Op Amp offers customers exceptional value, benefits, and advantages. Experience enhanced performance and efficiency with the OPA2343EA/250G4, setting new standards in the industry. Unlock the potential of your projects with this cutting-edge technology from Texas Instruments.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material combination ensures durability and reliability in various operating conditions.

Maximum Input Offset Voltage:

8000 uV - Low input offset voltage ensures accurate and stable operation of the amplifier.

Maximum Average Bias Current (IIB):

0.00006 uA - Low bias current minimizes power consumption and improves signal fidelity.

Surface Mount:

YES - Surface mount capability allows for easy and efficient PCB integration.

No. of Functions:

2 - Dual functions provide versatility and flexibility in circuit design.

Package Shape:

SQUARE - Square shape enables compact and space-saving PCB layout.

Nominal Common Mode Reject Ratio:

92 dB - High CMRR ensures rejection of common-mode noise for cleaner output signals.

Nominal Supply Voltage / Vsup (V):

5 - Suitable supply voltage for a wide range of applications.

Power Supplies (V):

3/5 - Dual power supply options enhance compatibility with different systems.

No. of Terminals:

8 - Sufficient terminals for interfacing with external components.

Maximum Input Offset Current (IIO):

0.00001 uA - Negligible input offset current minimizes errors in amplification.

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH - Compact package style for space-constrained designs.

Maximum Supply Voltage Limit:

7.5 V - High supply voltage limit ensures robust operation.

Maximum Operating Temperature:

85 °C - Wide operating temperature range for reliable performance in various environments.

Maximum Bias Current (IIB) @25°C:

0.00001 uA - Ultra-low bias current ensures minimal signal distortion.

Frequency Compensation:

YES - Built-in frequency compensation for stability and improved performance.

Minimum Voltage Gain:

40000 - High minimum voltage gain for amplifying weak signals effectively.

Minimum Operating Temperature:

40 °C - Suitable for applications in harsh cold environments.

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER - Durable terminal finish for long-lasting connections.

Terminal Position:

DUAL - Dual terminal position for flexible PCB layout options.

Maximum Seated Height:

1.1 mm - Low profile design for compact applications.

Width:

3 mm - Compact width for space-efficient PCB design.

Maximum Time At Peak Reflow Temperature (s):

30 - Allows for sufficient time at peak reflow temperature for proper soldering.

Peak Reflow Temperature °C:

260 - High peak reflow temperature for reliable solder joints.

Length:

3 mm - Compact length for space-saving PCB layout.

Temperature Grade:

INDUSTRIAL - Suitable for industrial applications that require robust and reliable performance.

Low-Bias:

YES - Low-bias design for minimal power consumption and improved signal integrity.

Nominal Unity Gain Bandwidth:

5500 kHz - High unity gain bandwidth for accurate signal amplification.

Minimum Common Mode Reject Ratio:

74 dB - Minimum CMRR ensures effective rejection of common-mode noise.

Technology:

CMOS - CMOS technology for low power consumption and high speed operation.

Terminal Form:

GULL WING - Gull wing terminal form for easy soldering and reliable connections.

Amplifier Type:

OPERATIONAL AMPLIFIER - Operational amplifier for a wide range of signal processing applications.

Maximum Supply Current:

2.5 mA - Maximum supply current for stable operation under different load conditions.

Architecture:

VOLTAGE-FEEDBACK - Voltage feedback architecture for precise amplification of input signals.

Packing Method:

TR - Tape and reel packing method for efficient handling and storage.

Nominal Slow Rate:

6 V/us - Nominal slow rate for stable and controlled signal amplification.

Terminal Pitch:

0.65 mm - Suitable terminal pitch for easy PCB assembly and soldering.

Moisture Sensitivity Level (MSL):

2 - MSL 2 designation for moderate moisture sensitivity during storage and handling.

Technical Specifications

Operational Amplifiers (Op Amps) OPA2343EA/250G4 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

3/5 V

Total Functions:

2

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Micropower:

No

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

5.5 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

92 dB

Minimum Common Mode Rejection Ratio (CMRR ):

74 dB

Input Offset Voltage Limit:

8000 uV

Minimum Voltage Gain:

40000

Nominal Slew Rate:

6 V/us

Maximum Input Offset Current (IIO):

10 pA

Peak Bias Current:

60 pA

Maximum Bias Current (IIB) @25 °C:

10 pA

Operational Characteristics

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

7.5 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

30 s

Maximum Supply Current:

2.5 mA

Physical Characteristics

Length:

0.118 in (3 mm)

Width:

0.118 in (3 mm)

Maximum Seated Height:

0.043 in (1.1 mm)

Total Terminals:

8

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold Silver

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

2

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

Package Shape:

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Equivalence Code:

TSSOP8,.19

Trade Compliance

OPA2343EA/250G4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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