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MSP50C37BDW

Texas Instruments

MSP50C37BDW by Texas Instruments

MSP50C37BDW by Texas Instruments is a Speech Synthesizer IC with 28 terminals, operating at temperatures from -10 to 70°C. It has a power supply range of 4-6.5V and is designed for music & sound applications. This CMOS technology IC comes in a small outline package suitable for surface mount assembly.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,633 parts In-Stock

1+ parts

-

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7,633

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Digiode

USA . 1,884 parts In-Stock

1+ parts

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1,884

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,356 parts In-Stock

1+ parts

$3.483

100+ parts

$323.409

1k+ parts

$3.134

10k+ parts

-

1,356

$3.483

$323.409

$3.134

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DigiPath Technology Company

USA . 984 parts In-Stock

1+ parts

$3.835

100+ parts

$3.528

1k+ parts

-

10k+ parts

-

984

$3.835

$3.528

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ChromeModa Solutions

Germany . 4,730 parts In-Stock

1+ parts

$3.913

100+ parts

$3.209

1k+ parts

-

10k+ parts

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4,730

$3.913

$3.209

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IDEA Electronic Components Group

UK . 816 parts In-Stock

1+ parts

$3.913

100+ parts

-

1k+ parts

$3.522

10k+ parts

-

816

$3.913

-

$3.522

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One Stop Electronics

USA . 518 parts In-Stock

1+ parts

$6.800

100+ parts

-

1k+ parts

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10k+ parts

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518

$6.800

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AZTECH Wire

Italy . 369 parts In-Stock

1+ parts

$16.726

100+ parts

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369

$16.726

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Corphita

USA . 3,599 parts In-Stock

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3,599

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Overview

Elevate your audio projects with the MSP50C37BDW by Texas Instruments, a top-tier Speech Synthesizer IC designed for music and sound applications. Crafted with precision and expertise, this product offers unparalleled quality and reliability in a compact Small Outline package. With dual terminals and a wide operating temperature range, this IC is versatile and durable, ensuring seamless performance in various environments. Whether you're a seasoned professional or a hobbyist, the MSP50C37BDW delivers exceptional value and benefits, making it the perfect choice for all your synthesizing needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable and lightweight material makes the product suitable for various applications without adding unnecessary weight.

Surface Mount: YES

Allows for easy installation on printed circuit boards, saving space and simplifying the manufacturing process.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of space on the PCB, optimizing the design layout.

General IC Type: SPEECH SYNTHESIZER

Specifically designed for speech synthesis applications, ensuring high-quality audio output and performance.

Power Supplies (V): 4/6.5

Offers flexibility in power supply options, allowing compatibility with different voltage requirements.

No. of Terminals: 28

Provides ample connectivity options for interfacing with other components, enhancing versatility in system design.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB and is suitable for compact designs.

Maximum Operating Temperature: 70 °C

Can operate efficiently at high temperatures, ensuring reliable performance in various environmental conditions.

Minimum Operating Temperature: -10 °C

Capable of functioning in cold temperatures, making it suitable for use in a wide range of environments.

Terminal Position: DUAL

Dual terminal positions provide redundancy and flexibility in connecting the IC to other components.

Temperature Grade: COMMERCIAL

Designed for commercial use, ensuring reliability and stability in typical operating conditions.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity, enhancing efficiency and performance.

Terminal Form: GULL WING

Gull wing terminal form allows for easy soldering onto the PCB, simplifying the assembly process.

Terminal Pitch: 1.27 mm

The small terminal pitch enables high-density mounting on the PCB, contributing to space-saving design.

Technical Specifications

Music & Sound Synthesizer ICs MSP50C37BDW attributes and parameters. Explore more Music & Sound Synthesizer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G28

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-10 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

4/6.5

Qualification:

Not Qualified

Sub-Category:

Audio Synthesizer ICs

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

MSP50C37BDW General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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