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MSP432P411YTPZR

Texas Instruments

MSP432P411YTPZR by Texas Instruments

MSP432P411YTPZR by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU family, offering 256 RAM words and 1048576 ROM words. It features 26-Ch 16-Bit ADC channels, 8 DMA channels, and PWM support. Ideal for industrial applications requiring low power consumption and high-speed processing up to 24 MHz.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,969 parts In-Stock

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Digiode

USA . 395 parts In-Stock

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395

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Distributors (Availability)

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AZTECH Wire

Italy . 360 parts In-Stock

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$7.283

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360

$7.283

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Parana Technologies

USA . 1,465 parts In-Stock

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$15.777

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$16.136

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$15.777

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DigiPath Technology Company

USA . 2,224 parts In-Stock

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$17.372

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$15.983

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2,224

$17.372

$15.983

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ChromeModa Solutions

Germany . 2,787 parts In-Stock

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$17.727

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$14.536

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2,787

$17.727

$14.536

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IDEA Electronic Components Group

UK . 1,951 parts In-Stock

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$17.727

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$16.841

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$15.954

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1,951

$17.727

$16.841

$15.954

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One Stop Electronics

USA . 770 parts In-Stock

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$33.000

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770

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Corphita

USA . 1,120 parts In-Stock

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Microchip USA

USA . 462 parts In-Stock

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Overview

Unlock the potential of your projects with the Texas Instruments MSP432P411YTPZR microcontroller. Designed with quality and precision by a trusted manufacturer, this powerful device is perfect for a wide range of applications. With integrated cache, low power mode, and a variety of peripherals including 26 analog to digital converters, this microcontroller offers unmatched value and performance. Whether you're working on IoT devices, industrial automation, or consumer electronics, the MSP432P411YTPZR will help you bring your ideas to life with ease. Trust in Texas Instruments for innovative solutions that exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the microcontroller, making it suitable for various applications.

Integrated Cache: YES

Integrated cache helps improve the overall performance and efficiency of the microcontroller by reducing access time to frequently used data.

Maximum Supply Voltage: 3.7 V

Higher maximum supply voltage allows for flexibility in powering the microcontroller and compatibility with a wider range of power sources.

On Chip Data RAM Width: 8

Having a wider on-chip data RAM width of 8 enhances the processing capabilities of the microcontroller, enabling it to handle larger amounts of data efficiently.

Package Shape: SQUARE

The square package shape allows for easier integration into circuit layouts and ensures a compact design for space-constrained applications.

Bit Size: 32

The 32-bit architecture of the microcontroller provides faster data processing and higher computational power, making it suitable for demanding tasks.

No. of Terminals: 100

Having 100 terminals provides ample connectivity options for peripherals and external components, allowing for versatile and customizable system designs.

Minimum Supply Voltage: 1.62 V

Low minimum supply voltage enables efficient power management and extends battery life in portable devices powered by the microcontroller.

CPU Family: CORTEX-M4F

Being part of the Cortex-M4F CPU family ensures high performance, low power consumption, and rich peripheral integration for optimized system operation.

Minimum Operating Temperature: -40 °C

Wide operating temperature range from -40 to 105°C allows for reliable operation in extreme environmental conditions.

Technical Specifications

Microcontrollers MSP432P411YTPZR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

8

No. of External Interrupts:

0

No. of I/O Lines:

84

No. of Serial I/Os:

2

No. of Terminals:

100

No. of Timers:

6

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

262144

RAM Words:

256

ROM Words:

1048576

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

24 rpm

Maximum Supply Voltage:

3.7 V

Minimum Supply Voltage:

1.62 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(4), IRDA(4), SPI(8), UART(4)

Peripherals:

COMPARATOR(16), DMA(8), LCD, POR, RTC, TIMER(7), WDT

Analog To Digital Convertors:

26-Ch 16-Bit

Trade Compliance

MSP432P411YTPZR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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