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MSP432P411YIPZR

Texas Instruments

MSP432P411YIPZR by Texas Instruments

MSP432P411YIPZR by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU, offering 1048576 ROM words and 256 RAM words. It features 26-Ch 16-Bit ADC channels, 8 DMA channels, and PWM support. Ideal for industrial applications requiring low power consumption and high-speed processing up to 48 MHz.

Median Price

$22.696

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,912 parts In-Stock

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$22.696

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4,912

$22.696

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Vyrian

USA . 8,858 parts In-Stock

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8,858

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Chip Stock

USA . 445 parts In-Stock

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445

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Nova Conductors

Japan . 88 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 267 parts In-Stock

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$20.000

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267

$20.000

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Semicontronic

India . 3,894 parts In-Stock

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$20.310

100+ parts

$19.802

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$19.701

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3,894

$20.310

$19.802

$19.701

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Ampacity Inc.

Singapore . 3,587 parts In-Stock

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$20.310

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Corphita

USA . 3,180 parts In-Stock

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$21.501

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3,180

$21.501

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Parana Technologies

USA . 742 parts In-Stock

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$32.131

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$98.799

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742

$32.131

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$98.799

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DigiPath Technology Company

USA . 623 parts In-Stock

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$35.380

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623

$35.380

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ChromeModa Solutions

Germany . 1,681 parts In-Stock

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$36.102

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$29.604

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1,681

$36.102

$29.604

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IDEA Electronic Components Group

UK . 1,357 parts In-Stock

1+ parts

$36.102

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$34.297

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$32.492

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1,357

$36.102

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$32.492

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Corohmni

South Africa . 7 parts In-Stock

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$61.114

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7

$61.114

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Continental Prestige Electronics

USA . 3,315 parts In-Stock

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Argo Parts USA

USA . 2,650 parts In-Stock

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Microchip USA

USA . 435 parts In-Stock

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435

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Robosynatics

Brazil . 200 parts In-Stock

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Lucentia Tech

USA . 200 parts In-Stock

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$0.022

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$0.022

200

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$0.022

$0.022

Bastille Electronics

Australia . 50 parts In-Stock

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Overview

Elevate your projects with the Texas Instruments MSP432P411YIPZR microcontroller, delivering top-notch quality and performance. As a leader in the industry, Texas Instruments ensures reliability and innovation in every product. Ideal for various applications, this microcontroller offers unparalleled value with its advanced features and capabilities. Experience seamless connectivity, low power consumption, and high-speed processing, making it the perfect choice for your next project. Choose Texas Instruments for cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller chip, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy and secure installation on circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 3.7 V

Provides a wide operating range for compatibility with various power sources.

Package Shape: SQUARE

Optimal shape for efficient use of space on the circuit board.

Bit Size: 32

High bit size allows for complex calculations and processing.

No. of Terminals: 100

Sufficient number of terminals for various connections and interfaces.

Maximum Clock Frequency: 48 MHz

High clock frequency enables fast data processing and execution of instructions.

Peripherals: COMPARATOR(16), DMA(8), LCD, POR, RTC, TIMER(7), WDT

Wide range of peripherals allow for versatile functionality and connectivity options.

ROM Programmability: FLASH

Flash programmable ROM allows for easy and flexible firmware updates.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environments with reliability.

Technical Specifications

Microcontrollers MSP432P411YIPZR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

48 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

0

No. of I/O Lines:

84

No. of Serial I/Os:

8

No. of Terminals:

100

No. of Timers:

6

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

262144

RAM Words:

256

ROM Words:

1048576

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

48 rpm

Maximum Supply Current:

8.2 mA

Maximum Supply Voltage:

3.7 V

Minimum Supply Voltage:

1.62 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(4), IRDA(4), SPI(8), UART(4)

Peripherals:

COMPARATOR(16), DMA(8), LCD, POR, RTC, TIMER(7), WDT

Analog To Digital Convertors:

26-Ch 16-Bit

Trade Compliance

MSP432P411YIPZR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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