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MSP432P411VIPZ

Texas Instruments

MSP432P411VIPZ by Texas Instruments

MSP432P411VIPZ by Texas Instruments is a 32-bit microcontroller with 128KB RAM and 524288 ROM words. It features 26-Ch 16-Bit ADCs, 8 DMA channels, and operates at a max frequency of 48 MHz. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,939 parts In-Stock

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Digiode

USA . 2,393 parts In-Stock

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2,393

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Distributors (Availability)

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AZTECH Wire

Italy . 322 parts In-Stock

1+ parts

$10.627

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322

$10.627

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One Stop Electronics

USA . 991 parts In-Stock

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$11.000

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991

$11.000

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Parana Technologies

USA . 709 parts In-Stock

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$70.733

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709

$70.733

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DigiPath Technology Company

USA . 2,332 parts In-Stock

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$77.886

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$71.655

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2,332

$77.886

$71.655

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IDEA Electronic Components Group

UK . 2,286 parts In-Stock

1+ parts

$79.475

100+ parts

$75.501

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$71.528

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2,286

$79.475

$75.501

$71.528

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ChromeModa Solutions

Germany . 500 parts In-Stock

1+ parts

$79.475

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$65.170

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500

$79.475

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Corphita

USA . 1,536 parts In-Stock

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Microchip USA

USA . 260 parts In-Stock

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Overview

Unleash the power of innovation with the MSP432P411VIPZ by Texas Instruments. As a leader in microcontroller technology, Texas Instruments delivers unparalleled quality and reliability. Perfect for a wide range of applications, this Cortex-M4F CPU family microcontroller offers customers exceptional value and benefits. With features like 26-channel 16-bit ADC converters, 6 DMA channels, and a maximum clock frequency of 48 MHz, the MSP432P411VIPZ provides high performance in a compact package. Experience seamless connectivity with I2C, IRDA, SPI, and UART interfaces, making it ideal for diverse projects. Elevate your designs and unlock endless possibilities with the MSP432P411VIPZ from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, ensuring a longer lifespan.

Maximum Supply Voltage: 3.7 V

Allows for flexibility in power supply options, accommodating a range of voltage inputs.

CPU Family: CORTEX-M4F

Utilizing a Cortex-M4F processor ensures high performance and efficiency in processing tasks.

RAM Bytes: 131072

Ample RAM capacity allows for smooth multitasking and efficient storage of data during operation.

Connectivity: I2C(4), IRDA(4), SPI(8), UART(4)

Multiple connectivity options enable seamless communication with other devices, enhancing the functionality of the microcontroller.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC architecture microcontroller allows for faster and more efficient processing of instructions, leading to improved performance.

Maximum Clock Frequency: 48 MHz

High clock frequency enables swift execution of instructions and operations, contributing to overall system speed.

Low Power Mode: YES

The availability of a low power mode promotes energy efficiency and prolongs battery life in applications where power consumption is crucial.

Technical Specifications

Microcontrollers MSP432P411VIPZ attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

48 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

0

No. of I/O Lines:

84

No. of Serial I/Os:

8

No. of Terminals:

100

No. of Timers:

6

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

131072

RAM Words:

128

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

48 rpm

Maximum Supply Current:

8.2 mA

Maximum Supply Voltage:

3.7 V

Minimum Supply Voltage:

1.62 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(4), IRDA(4), SPI(8), UART(4)

Peripherals:

COMPARATOR(16), DMA(8), LCD, POR, RTC, TIMER(7), WDT

Analog To Digital Convertors:

26-Ch 16-Bit

Trade Compliance

MSP432P411VIPZ Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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