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MSP432P401YTRGCT

Texas Instruments

MSP432P401YTRGCT by Texas Instruments

MSP432P401YTRGCT by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU, 256 RAM words, and 1048576 ROM words. It features 14-Ch 16-Bit ADCs, 8 DMA channels, and PWM support. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,792 parts In-Stock

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6,792

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Digiode

USA . 1,629 parts In-Stock

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1,629

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Distributors (Availability)

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One Stop Electronics

USA . 1,122 parts In-Stock

1+ parts

$16.000

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$16.000

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AZTECH Wire

Italy . 243 parts In-Stock

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$19.525

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243

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Parana Technologies

USA . 496 parts In-Stock

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$27.002

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$31.085

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496

$27.002

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$31.085

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DigiPath Technology Company

USA . 1,542 parts In-Stock

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$29.732

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1,542

$29.732

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ChromeModa Solutions

Germany . 6,168 parts In-Stock

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$30.339

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$24.878

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6,168

$30.339

$24.878

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IDEA Electronic Components Group

UK . 1,167 parts In-Stock

1+ parts

$30.339

100+ parts

$28.822

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$27.305

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1,167

$30.339

$28.822

$27.305

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Corphita

USA . 4,020 parts In-Stock

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Microchip USA

USA . 477 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the MSP432P401YTRGCT microcontroller by Texas Instruments. With a reputation for excellence, Texas Instruments delivers top-quality products that set the standard in the industry. Ideal for a wide range of applications, this microcontroller provides unparalleled performance and reliability. Experience the value and benefits of seamless connectivity, low power consumption, and advanced features that will take your projects to the next level. Trust Texas Instruments to bring innovation to your designs with the MSP432P401YTRGCT microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good protection and durability for the microcontroller, ensuring reliable performance in various environments.

Integrated Cache: YES

Integrated cache improves the microcontroller's processing speed and efficiency by storing frequently accessed data for quicker access.

Maximum Supply Voltage: 3.7 V

Higher supply voltage allows for better performance and capability of the microcontroller during operation.

On Chip Data RAM Width: 8

8-bit data RAM width enhances the microcontroller's data processing capabilities and efficiency.

Package Shape: SQUARE

Square package shape offers compact and efficient design for better integration and space-saving in electronic devices.

Bit Size: 32

32-bit architecture allows for faster and more efficient processing of data and instructions in the microcontroller.

CPU Family: CORTEX-M4F

Being part of the CORTEX-M4F CPU family ensures high performance and reliability for the microcontroller, suitable for a wide range of applications.

Maximum Operating Temperature: 105 °C

High maximum operating temperature allows the microcontroller to function effectively in harsh environmental conditions without overheating.

ADC Channels: YES

Integrated ADC channels enable the microcontroller to convert analog signals into digital data for processing, expanding its functionality.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture in a microcontroller enhances its processing efficiency, making it a good choice for real-time applications.

Technical Specifications

Microcontrollers MSP432P401YTRGCT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

24 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e4

Length:

9 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

8

No. of External Interrupts:

0

No. of I/O Lines:

48

No. of Serial I/Os:

2

No. of Terminals:

64

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG

Peak Reflow Temperature (C):

260

RAM Bytes:

262144

RAM Words:

256

ROM Words:

1048576

ROM Programmability:

FLASH

Maximum Seated Height:

.88 mm

Speed:

24 rpm

Maximum Supply Voltage:

3.7 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(3), IRDA(3), SPI(6), UART(3)

Peripherals:

COMPARATOR(6), DMA(8), POR, RTC, TIMER(7), WDT

Analog To Digital Convertors:

14-Ch 16-Bit

Trade Compliance

MSP432P401YTRGCT Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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