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MSP432P401VIRGCR

Texas Instruments

MSP432P401VIRGCR by Texas Instruments

MSP432P401VIRGCR by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU, offering 128KB RAM and 524288 ROM words. It features 14-Ch 16-Bit ADCs, 48 MHz clock frequency, and low power mode for industrial applications requiring high-speed processing and connectivity via I2C, IRDA, SPI, UART.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,012 parts In-Stock

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Cyclops Electronics Ltd

UK . 4,000 parts In-Stock

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Digiode

USA . 499 parts In-Stock

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499

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Distributors (Availability)

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AZTECH Wire

Italy . 251 parts In-Stock

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$14.769

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One Stop Electronics

USA . 798 parts In-Stock

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$15.000

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798

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Parana Technologies

USA . 2,063 parts In-Stock

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$65.914

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$65.914

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DigiPath Technology Company

USA . 1,098 parts In-Stock

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$72.580

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$72.580

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ChromeModa Solutions

Germany . 3,014 parts In-Stock

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$74.061

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$60.730

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3,014

$74.061

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IDEA Electronic Components Group

UK . 421 parts In-Stock

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$74.061

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$70.358

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$66.655

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421

$74.061

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Corphita

USA . 1,163 parts In-Stock

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Microchip USA

USA . 150 parts In-Stock

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Overview

Unlock the power of innovation with the MSP432P401VIRGCR by Texas Instruments, a cutting-edge microcontroller that offers unparalleled quality and reliability. Designed for a wide range of applications, this device boasts advanced features such as low power mode, multiple peripherals, and high-speed connectivity options. With a focus on value and efficiency, this product delivers exceptional performance while maximizing energy savings, making it the ideal choice for customers seeking top-notch technology solutions. Elevate your projects to new heights with the Texas Instruments MSP432P401VIRGCR microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material makes the package lightweight and durable, ideal for portable and rugged applications.

Maximum Supply Voltage: 3.7 V

Higher supply voltage allows for compatibility with a wider range of power sources.

ADC Channels: YES

Analog to Digital Converters allow for analog signal processing, making the microcontroller suitable for a variety of sensor applications.

Maximum Clock Frequency: 48 MHz

Higher clock frequency allows for faster processing speeds, making the microcontroller suitable for high-performance tasks.

Connectivity: I2C(3), IRDA(3), SPI(6), UART(3)

Multiple communication interfaces provide flexibility in connecting to other devices, enhancing the microcontroller's versatility.

ROM Programmability: FLASH

Flash ROM offers reprogrammability, allowing for easy updates and customization of the microcontroller's firmware.

Technical Specifications

Microcontrollers MSP432P401VIRGCR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

48 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e4

Length:

9 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

0

No. of I/O Lines:

48

No. of Serial I/Os:

8

No. of Terminals:

64

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

131072

RAM Words:

128

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

48 rpm

Maximum Supply Current:

8.2 mA

Maximum Supply Voltage:

3.7 V

Minimum Supply Voltage:

1.62 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(3), IRDA(3), SPI(6), UART(3)

Peripherals:

COMPARATOR(6), DMA(8), POR, RTC, TIMER(6), WDT

Analog To Digital Convertors:

14-Ch 16-Bit

Trade Compliance

MSP432P401VIRGCR Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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