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MSP430TCH5ERHBR

Texas Instruments

MSP430TCH5ERHBR by Texas Instruments

MSP430TCH5ERHBR by Texas Instruments is a 16-bit microcontroller with 512B RAM, 8-Ch 10-Bit ADC, and FLASH ROM. Ideal for industrial applications, it offers connectivity via I2C, IRDA, LIN, SCI, SPI, UART interfaces. Operating temperature range from -40 to 85 °C with low supply current of 0.42 mA makes it suitable for various embedded systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,349 parts In-Stock

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5,349

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Digiode

USA . 3,051 parts In-Stock

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3,051

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Distributors (Availability)

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AZTECH Wire

Italy . 297 parts In-Stock

1+ parts

$11.270

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297

$11.270

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Microchip USA

USA . 4,874 parts In-Stock

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$13.614

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One Stop Electronics

USA . 819 parts In-Stock

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$34.000

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819

$34.000

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Parana Technologies

USA . 825 parts In-Stock

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$63.146

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825

$63.146

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DigiPath Technology Company

USA . 1,462 parts In-Stock

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$69.532

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$69.532

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ChromeModa Solutions

Germany . 1,462 parts In-Stock

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$70.951

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$58.180

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$70.951

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IDEA Electronic Components Group

UK . 476 parts In-Stock

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$70.951

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$67.403

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$63.856

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Corphita

USA . 2,358 parts In-Stock

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Overview

Unlock the potential of your projects with the Texas Instruments MSP430TCH5ERHBR microcontroller. Built with precision and expertise, Texas Instruments ensures top quality and reliability in every product. This versatile microcontroller excels in various applications, offering unmatched value and benefits to customers. Whether you're looking for efficient power management, reliable connectivity, or advanced peripherals, the MSP430TCH5ERHBR delivers on all fronts. Experience the difference with Texas Instruments and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material enhances durability and makes the product lightweight.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in power supply options.

Package Shape: SQUARE

The square package shape helps in efficient space utilization on the circuit board.

Bit Size: 16

The 16-bit size enhances the processing capability and performance of the microcontroller.

Power Supplies (V): 2/3.3

The availability of multiple power supply options makes the product versatile in different applications.

No. of Terminals: 32

With 32 terminals, this microcontroller can accommodate various input and output connections.

Minimum Supply Voltage: 1.8 V

The low minimum supply voltage helps in energy efficiency and power saving.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range ensures reliability in challenging environments.

CPU Family: MSP430

The MSP430 CPU family is known for its low power consumption and high performance, making it a reliable choice.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the microcontroller to function in extreme cold conditions.

ADC Channels: YES

The presence of ADC channels enables analog to digital conversion, expanding the microcontroller's functionality.

DMA Channels: YES

DMA channels enhance data transfer speed and efficiency, making the microcontroller ideal for multitasking applications.

ROM Words: 16384

With 16384 ROM words, the microcontroller has ample memory capacity for program storage.

Maximum Seated Height: 1 mm

The low maximum seated height allows for compact design implementations.

Width: 5 mm

The small width dimension facilitates integration into space-constrained devices.

Peripherals: BOD, COMPARATOR(8), POR, PWM, TIMER(2), WDT

The variety of peripherals enhances the microcontroller's capabilities for different applications.

Maximum Time At Peak Reflow Temperature (s): 30

The short reflow time ensures efficient manufacturing processes.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance makes the microcontroller suitable for lead-free soldering processes.

Length: 5 mm

The compact length dimension helps in designing small form factor devices.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh industrial environments.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture of the microcontroller provides efficient and high-speed processing capabilities.

RAM Bytes: 512

The 512 RAM bytes offer sufficient memory for data storage and processing.

Technology: CMOS

The CMOS technology ensures low power consumption and high noise immunity.

Terminal Form: NO LEAD

The no-lead terminal form promotes environmental sustainability and compliance with regulations.

Analog To Digital Convertors: 8-Ch 10-Bit

The 8-channel 10-bit ADCs enable precise and accurate analog signal conversion.

Maximum Supply Current: 0.42 mA

The low maximum supply current contributes to energy efficiency and extended battery life.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V is commonly used in many applications, ensuring compatibility.

PWM Channels: YES

The presence of PWM channels allows for precise control of pulse width modulation signals.

Connectivity: I2C, IRDA, LIN, SCI, SPI, UART

The multiple connectivity options enable seamless communication with other devices and systems.

ROM Programmability: FLASH

The flash ROM programmability offers flexibility in updating and reprogramming the microcontroller.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5mm allows for high-density mounting on PCBs.

Moisture Sensitivity Level (MSL): 2

MSL level 2 indicates moderate sensitivity to moisture, requiring standard precautions during handling and storage.

Speed: 16 rpm

The 16 rpm speed ensures quick response and processing of commands.

On Chip Program ROM Width: 8

The 8-bit on-chip program ROM width provides sufficient storage for program codes.

No. of I/O Lines: 24

With 24 I/O lines, the microcontroller offers flexibility in connecting to external devices and peripherals.

Technical Specifications

Microcontrollers MSP430TCH5ERHBR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

2

No. of I/O Lines:

24

No. of Terminals:

32

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

512

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.42 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, IRDA, LIN, SCI, SPI, UART

Peripherals:

BOD, COMPARATOR(8), POR, PWM, TIMER(2), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

MSP430TCH5ERHBR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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