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MSP430TCH5EPW

Texas Instruments

MSP430TCH5EPW by Texas Instruments

MSP430TCH5EPW by Texas Instruments is a 16-bit microcontroller with 512B RAM, 8 ADC channels, and 2 DMA channels. Ideal for industrial applications due to its low power mode, it features peripherals like BOD, PWM, and timers. With a temperature range of -40 to 85°C, this MCU offers connectivity options such as I2C, SPI, and UART.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,007 parts In-Stock

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Digiode

USA . 4,720 parts In-Stock

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4,720

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Distributors (Availability)

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AZTECH Wire

Italy . 337 parts In-Stock

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$6.372

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$6.372

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One Stop Electronics

USA . 602 parts In-Stock

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$12.000

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Parana Technologies

USA . 1,795 parts In-Stock

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$16.956

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$17.185

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Microchip USA

USA . 1,783 parts In-Stock

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$18.366

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DigiPath Technology Company

USA . 322 parts In-Stock

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$18.671

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322

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ChromeModa Solutions

Germany . 2,053 parts In-Stock

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$19.052

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$15.623

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IDEA Electronic Components Group

UK . 1,711 parts In-Stock

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$19.052

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$18.099

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$17.147

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Corphita

USA . 2,381 parts In-Stock

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Authorized Procurement Solutions

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Overview

Unlock the potential of your next project with the MSP430TCH5EPW by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments guarantees top-notch quality and reliability in its microcontrollers. This versatile product is perfect for a wide range of applications, offering customers exceptional value and performance. Whether you're working on IoT devices, consumer electronics, or industrial automation, the MSP430TCH5EPW delivers unparalleled benefits and advantages to meet all your project needs. Elevate your designs with Texas Instruments and experience innovation like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and durable, ensuring long-term reliability.

Surface Mount: YES

Surface mount capability makes installation easier and more compact, saving space on the PCB.

Maximum Supply Voltage: 3.6 V

Higher maximum supply voltage allows for more flexibility in power supply options.

On Chip Data RAM Width: 8

Wider on-chip data RAM width allows for faster data processing and storage on the microcontroller.

Bit Size: 16

16-bit architecture enables the microcontroller to handle more complex tasks and calculations efficiently.

Power Supplies (V): 2/3.3

Support for multiple power supply voltages allows for compatibility with a wider range of power sources.

No. of Terminals: 28

More terminals provide greater connectivity options for external components and peripherals.

Minimum Supply Voltage: 1.8 V

Lower minimum supply voltage ensures efficient power usage and allows for operation in low-power environments.

Maximum Operating Temperature: 85 °C

High maximum operating temperature range allows for use in harsh environmental conditions without compromising performance.

CPU Family: MSP430

Member of the MSP430 family ensures compatibility with existing designs and access to a wide range of support resources.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature range enables operation in cold environments without risk of damage.

ADC Channels: YES

Integrated Analog to Digital Converters provide accurate analog signal processing capability for sensor applications.

DMA Channels: YES

Direct Memory Access channels allow for efficient data transfers between peripherals and memory without CPU intervention.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture ensures efficient instruction execution and higher performance compared to CISC architectures.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture ensures efficient instruction execution and higher performance compared to CISC architectures.

Analog To Digital Convertors: 8-Ch 10-Bit

8-channel 10-bit ADC provides high-resolution analog signal conversion for accurate sensor readings.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage ensures consistent performance and compatibility with standard power sources.

Connectivity: I2C, IRDA, LIN, SCI, SPI, UART

Wide range of communication interfaces provides flexibility for connecting to various external devices and networks.

No. of Timers: 2

Multiple timers allow for precise timekeeping, event scheduling, and PWM signal generation.

RAM Bytes: 512

512 bytes of on-chip RAM provide ample storage for temporary data and variables during program execution.

Maximum Supply Current: 0.42 mA

Low maximum supply current consumption ensures energy efficiency and extends battery life in portable applications.

Peak Reflow Temperature: 260 C

High peak reflow temperature tolerance ensures reliable soldering during manufacturing without component damage.

Technical Specifications

Microcontrollers MSP430TCH5EPW attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

9.7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

1

No. of External Interrupts:

0

No. of I/O Lines:

24

No. of Serial I/Os:

1

No. of Terminals:

28

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP28,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

512

RAM Words:

1

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.42 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, IRDA, LIN, SCI, SPI, UART

Peripherals:

BOD, COMPARATOR(8), POR, PWM, TIMER(2), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

MSP430TCH5EPW Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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