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MSP430P337AIPJMR

Texas Instruments

MSP430P337AIPJMR by Texas Instruments

MSP430P337AIPJMR by Texas Instruments is a 16-bit microcontroller with 32768 ROM words, 1024 RAM bytes, and 46 I/O lines. It operates at a max frequency of 3.8 MHz and has PWM channels for various industrial applications. With a supply voltage range of 4.5V to 5.5V, it is suitable for temperature-sensitive environments with an operating range from -40°C to 85°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,911 parts In-Stock

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Digiode

USA . 3,359 parts In-Stock

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Bristol Electronics

USA . 1 parts In-Stock

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AZTECH Wire

Italy . 254 parts In-Stock

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$8.592

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One Stop Electronics

USA . 155 parts In-Stock

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$16.000

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Parana Technologies

USA . 595 parts In-Stock

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$64.803

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DigiPath Technology Company

USA . 362 parts In-Stock

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$71.356

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362

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ChromeModa Solutions

Germany . 4,052 parts In-Stock

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$72.812

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$59.706

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4,052

$72.812

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IDEA Electronic Components Group

UK . 329 parts In-Stock

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$72.812

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$69.171

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$65.531

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Corphita

USA . 4,436 parts In-Stock

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Microchip USA

USA . 369 parts In-Stock

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Overview

Unlock the power of innovation with the MSP430P337AIPJMR by Texas Instruments. As a leader in microcontroller technology, Texas Instruments delivers top-quality products that exceed industry standards. Ideal for a wide range of applications, this microcontroller offers unmatched performance and reliability. With features like low power consumption and high-speed processing, the MSP430P337AIPJMR provides exceptional value for customers looking to take their projects to the next level. Discover the endless possibilities with Texas Instruments at your side.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material is lightweight and cost-effective, making the product more affordable.

Maximum Supply Voltage: 5.5 V

Higher supply voltage allows for more flexibility in power requirements.

Bit Size: 16

16-bit architecture provides more processing power and precision.

ADC Channels: YES

Analog-to-digital converter channels allow for conversion of analog signals to digital data, increasing versatility.

ROM Words: 32768

Large ROM capacity allows for storing more data and programs.

RAM Bytes: 1024

Sufficient RAM capacity for temporary data storage and processing.

PWM Channels: YES

Pulse-width modulation channels enable precise control of connected devices.

Technology: CMOS

CMOS technology is known for low power consumption and high noise tolerance.

Maximum Clock Frequency: 3.8 MHz

High clock frequency allows for faster data processing and execution of instructions.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications with a wide operating temperature range.

Technical Specifications

Microcontrollers MSP430P337AIPJMR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 2.5 TO 5.5V SUPPLY

Address Bus Width:

0

Bit Size:

16

Maximum Clock Frequency:

3.8 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PQFP-G100

JESD-609 Code:

e4

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

46

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP100,.7X.9

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

1024

ROM Words:

32768

ROM Programmability:

OTPROM

Maximum Seated Height:

3.4 mm

Speed:

3.8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MSP430P337AIPJMR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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