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MSP430P337AIPJM

Texas Instruments

MSP430P337AIPJM by Texas Instruments

MSP430P337AIPJM by Texas Instruments is a 16-bit microcontroller with 1024 bytes of RAM and 32768 ROM words. It operates at a max clock frequency of 3.8 MHz, suitable for industrial applications requiring up to 46 I/O lines and PWM channels. With a temperature range from -40°C to 85°C, it offers reliable performance in various environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,770 parts In-Stock

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Digiode

USA . 3,154 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 55 parts In-Stock

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Bristol Electronics

USA . 1 parts In-Stock

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One Stop Electronics

USA . 485 parts In-Stock

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$12.000

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AZTECH Wire

Italy . 238 parts In-Stock

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$13.954

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Parana Technologies

USA . 1,635 parts In-Stock

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$54.292

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DigiPath Technology Company

USA . 775 parts In-Stock

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$59.782

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775

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ChromeModa Solutions

Germany . 6,799 parts In-Stock

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$61.002

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$50.022

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IDEA Electronic Components Group

UK . 1,530 parts In-Stock

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$61.002

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$57.952

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$54.902

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Corphita

USA . 2,793 parts In-Stock

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Computer Components Inc. - USA

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Overview

Unlock endless possibilities with the Texas Instruments MSP430P337AIPJM microcontroller. Crafted with precision and expertise, this device offers unparalleled quality and reliability. Ideal for a wide range of applications, from consumer electronics to industrial automation, this microcontroller provides value and efficiency like no other. Embrace innovation and elevate your projects with the cutting-edge technology and superior performance that only Texas Instruments can deliver. Experience the difference with the MSP430P337AIPJM.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection for the microcontroller, making it ideal for long-term use in various environments.

Surface Mount: YES

Allows for easy and efficient mounting on PCBs, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 5.5 V

Can handle a wide range of supply voltages, providing flexibility in power supply design.

Bit Size: 16

With a 16-bit architecture, the microcontroller can perform calculations and process data more efficiently than lower-bit counterparts.

Power Supplies (V): 3/5

Supports both 3V and 5V power supplies, allowing compatibility with a wide range of applications and devices.

No. of Terminals: 100

Provides ample connectivity options for interfacing with other components, sensors, and peripherals.

Maximum Operating Temperature: 85 °C

Can operate reliably in higher temperature environments, making it suitable for industrial and automotive applications.

Minimum Operating Temperature: -40 °C

Capable of functioning in low-temperature conditions, expanding its usability in harsh environmental conditions.

ADC Channels: YES

Integrated analog-to-digital converters simplify the process of reading analog sensor data, enhancing the microcontroller's functionality.

ROM Words: 32768

Large ROM capacity allows for storing program data and instructions, enabling the microcontroller to execute complex tasks.

RAM Bytes: 1024

Sufficient RAM for data storage and manipulation, facilitating multitasking and efficient program execution.

Technical Specifications

Microcontrollers MSP430P337AIPJM attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 2.5 TO 5.5V SUPPLY

Address Bus Width:

0

Bit Size:

16

Maximum Clock Frequency:

3.8 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PQFP-G100

JESD-609 Code:

e4

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

46

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP100,.7X.9

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

1024

ROM Words:

32768

ROM Programmability:

OTPROM

Maximum Seated Height:

3.4 mm

Speed:

3.8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MSP430P337AIPJM Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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