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MSP430P325IFN

Texas Instruments

MSP430P325IFN by Texas Instruments

MSP430P325IFN by Texas Instruments is a 16-bit microcontroller with 512 bytes of RAM and 16384 ROM words. Operating at up to 3.3 MHz, it features 14 I/O lines and ADC channels, making it ideal for industrial applications requiring low power consumption and high performance in a compact chip carrier package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,660 parts In-Stock

1+ parts

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4,660

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Digiode

USA . 1,331 parts In-Stock

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1,331

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 801 parts In-Stock

1+ parts

$9.435

100+ parts

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801

$9.435

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One Stop Electronics

USA . 1,020 parts In-Stock

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$15.000

100+ parts

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1,020

$15.000

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Parana Technologies

USA . 1,703 parts In-Stock

1+ parts

$59.538

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1,703

$59.538

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DigiPath Technology Company

USA . 1,831 parts In-Stock

1+ parts

$65.559

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1,831

$65.559

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ChromeModa Solutions

Germany . 1,085 parts In-Stock

1+ parts

$66.897

100+ parts

$54.856

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1,085

$66.897

$54.856

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IDEA Electronic Components Group

UK . 427 parts In-Stock

1+ parts

$66.897

100+ parts

$63.552

1k+ parts

$60.207

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427

$66.897

$63.552

$60.207

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Corphita

USA . 3,786 parts In-Stock

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3,786

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Microchip USA

USA . 458 parts In-Stock

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458

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Overview

Unlock endless possibilities with the MSP430P325IFN by Texas Instruments, a top-tier manufacturer known for quality and innovation in microcontrollers. Perfect for a wide range of applications, this product offers unmatched value with its high performance and reliability. Whether you're working on IoT devices, wearables, or industrial automation, this microcontroller delivers superior efficiency and versatility. Stay ahead of the curve and bring your projects to life with the MSP430P325IFN.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and cost-effective, making the microcontroller suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and ease of automated assembly, making the product suitable for modern electronics manufacturing.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage provides flexibility in powering the microcontroller and allows for compatibility with a wide range of external components.

Bit Size: 16

A 16-bit architecture offers improved performance and processing capabilities compared to lower bit sizes, making the microcontroller suitable for tasks that require higher computational power.

Power Supplies (V): 3/5

Support for multiple power supply options enhances versatility in system integration and power management, allowing the microcontroller to be used in a variety of environments.

No. of Terminals: 68

The ample number of terminals provides flexibility for connecting external devices and interfaces, making the microcontroller suitable for complex system designs.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliability and performance even in harsh environmental conditions, making the microcontroller suitable for industrial applications.

ADC Channels: YES

Analog-to-digital converter channels enable the microcontroller to interface with analog sensors and signals, expanding its capabilities for sensor-based applications.

Peripheral IC Type: MICROCONTROLLER, RISC

A RISC architecture offers efficient and streamlined processing, enhancing the performance and power efficiency of the microcontroller for various embedded applications.

Technical Specifications

Microcontrollers MSP430P325IFN attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Maximum Clock Frequency:

3.3 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-J68

JESD-609 Code:

e4

Length:

24.23 mm

Moisture Sensitivity Level (MSL):

4

No. of I/O Lines:

14

No. of Terminals:

68

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC68,1.0SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

512

ROM Words:

16384

ROM Programmability:

OTPROM

Maximum Seated Height:

4.57 mm

Speed:

3.3 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

24.23 mm

Peripheral IC Type:

Trade Compliance

MSP430P325IFN Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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