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MSP430P325AIFN

Texas Instruments

MSP430P325AIFN by Texas Instruments

MSP430P325AIFN by Texas Instruments is a 16-bit microcontroller with 512 bytes of RAM and 16384 ROM words. Operating at up to 0.032 MHz, it has 14 I/O lines and ADC channels for industrial applications. With a temperature range of -40 to 85 °C, this CMOS technology chip carrier is suitable for various embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,096 parts In-Stock

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8,096

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Digiode

USA . 4,036 parts In-Stock

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4,036

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Distributors (Availability)

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Parana Technologies

USA . 1,018 parts In-Stock

1+ parts

$13.693

100+ parts

-

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$14.189

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1,018

$13.693

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$14.189

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DigiPath Technology Company

USA . 254 parts In-Stock

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$15.077

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254

$15.077

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ChromeModa Solutions

Germany . 2,322 parts In-Stock

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$15.385

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$12.616

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2,322

$15.385

$12.616

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IDEA Electronic Components Group

UK . 232 parts In-Stock

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$15.385

100+ parts

$14.616

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$13.846

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232

$15.385

$14.616

$13.846

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AZTECH Wire

Italy . 557 parts In-Stock

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$17.234

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557

$17.234

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One Stop Electronics

USA . 419 parts In-Stock

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$21.000

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419

$21.000

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Corphita

USA . 3,947 parts In-Stock

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Microchip USA

USA . 471 parts In-Stock

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Overview

Unlock the potential of your projects with the Texas Instruments MSP430P325AIFN microcontroller. Designed by a trusted manufacturer, this versatile chip offers high-quality performance and reliability for a wide range of applications. Whether you're working on IoT devices, consumer electronics, or industrial automation, this microcontroller delivers value with its efficient power consumption, advanced peripherals, and flexible design options. Embrace innovation and streamline your development process with the MSP430P325AIFN - the smart choice for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the microcontroller lightweight and durable, perfect for portable and long-lasting applications.

Surface Mount: YES

Surface mount capability allows for easy integration onto printed circuit boards, saving space and simplifying the assembly process.

Maximum Supply Voltage: 5.5 V

Support for a maximum supply voltage of 5.5V provides flexibility in power input options for the device.

Package Shape: SQUARE

Square package shape allows for efficient use of space on the PCB, optimizing the overall design layout.

Bit Size: 16

16-bit architecture enables higher computational performance and precision compared to lower bit microcontrollers.

Power Supplies (V): 3/5

Support for both 3V and 5V power supplies allows flexibility in operating voltage, making it compatible with a wide range of systems.

No. of Terminals: 68

Having 68 terminals enables connectivity to multiple peripherals and external components, enhancing the microcontroller's functionality.

ADC Channels: YES

Integrated ADC channels enable analog signal processing, making the microcontroller suitable for applications that require analog input processing.

ROM Words: 16384

Large ROM capacity of 16384 words allows for storing a significant amount of program code and data, accommodating complex applications.

RAM Bytes: 512

512 bytes of RAM provide ample memory for temporary data storage and processing, enhancing the microcontroller's performance.

Technical Specifications

Microcontrollers MSP430P325AIFN attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-J68

JESD-609 Code:

e4

Length:

24.2316 mm

Moisture Sensitivity Level (MSL):

4

No. of I/O Lines:

14

No. of Terminals:

68

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC68,1.0SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

512

ROM Words:

16384

ROM Programmability:

OTPROM

Maximum Seated Height:

4.57 mm

Speed:

3.3 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

24.2316 mm

Peripheral IC Type:

Trade Compliance

MSP430P325AIFN Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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