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MSP430I2030TRHBR

Texas Instruments

MSP430I2030TRHBR by Texas Instruments

MSP430I2030TRHBR by Texas Instruments is a 16-bit microcontroller with 3.6V max supply voltage, 1024 bytes RAM, and 16.384 MHz clock frequency. Ideal for industrial applications requiring low power consumption, it features ADC channels, PWM support, and connectivity options like I2C and UART.

Median Price

$2.230

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 15,980 parts In-Stock

1+ parts

$2.230

100+ parts

$1.954

1k+ parts

$1.104

10k+ parts

-

15,980

$2.230

$1.954

$1.104

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,786 parts In-Stock

1+ parts

$2.118

100+ parts

-

1k+ parts

-

10k+ parts

-

4,786

$2.118

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-

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Vyrian

USA . 4,296 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,296

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 876 parts In-Stock

1+ parts

$2.007

100+ parts

-

1k+ parts

-

10k+ parts

-

876

$2.007

-

-

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AZTECH Wire

Italy . 233 parts In-Stock

1+ parts

$8.370

100+ parts

-

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-

10k+ parts

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233

$8.370

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Parana Technologies

USA . 2,242 parts In-Stock

1+ parts

$63.216

100+ parts

-

1k+ parts

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2,242

$63.216

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ChromeModa Solutions

Germany . 3,838 parts In-Stock

1+ parts

$71.029

100+ parts

$58.244

1k+ parts

-

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3,838

$71.029

$58.244

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IDEA Electronic Components Group

UK . 181 parts In-Stock

1+ parts

$71.029

100+ parts

$67.478

1k+ parts

$63.926

10k+ parts

-

181

$71.029

$67.478

$63.926

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DigiPath Technology Company

USA . 1,053 parts In-Stock

1+ parts

-

100+ parts

$64.040

1k+ parts

-

10k+ parts

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1,053

-

$64.040

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Overview

Unlock the potential of your projects with the MSP430I2030TRHBR by Texas Instruments. Known for its superior quality and reliability, Texas Instruments microcontrollers are trusted by professionals worldwide. This versatile chip, with its compact size and low power consumption, is perfect for a wide range of applications. Whether you're working on IoT devices or embedded systems, this microcontroller offers unmatched value and performance. Experience seamless connectivity and precise control with the MSP430I2030TRHBR - the ultimate solution for all your microcontroller needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring it can withstand various environmental conditions.

Maximum Supply Voltage: 3.6 V

Allows for a higher supply voltage which can be useful for powering other components or peripherals connected to the microcontroller.

Width: 5 mm

Compact size makes it suitable for applications where space is limited.

ADC Channels: YES

Ability to convert analog signals to digital data allows for accurate and precise measurements in various applications.

PWM Channels: YES

Pulse Width Modulation (PWM) capability enables precise control over the power delivered to peripheral devices such as motors or LEDs.

Connectivity: I2C, IRDA, SPI(2), UART

Multiple connectivity options allow for easy integration with other devices and communication protocols.

Low Power Mode: YES

Enables energy-efficient operation, extending battery life in portable or battery-powered applications.

Technical Specifications

Microcontrollers MSP430I2030TRHBR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

16.384 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

16

No. of Serial I/Os:

1

No. of Terminals:

32

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

1024

RAM Words:

1

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

16.384 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.2 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Peripheral IC Type:

Connectivity:

I2C, IRDA, SPI(2), UART

Peripherals:

BOD, TEMPERATURE SENSOR, TIMER(2), WDT

Analog To Digital Convertors:

3-Ch 24-Bit

Trade Compliance

MSP430I2030TRHBR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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