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MSP430G2855IDA38R

Texas Instruments

MSP430G2855IDA38R by Texas Instruments

MSP430G2855IDA38R by Texas Instruments is a 16-bit microcontroller with 32 I/O lines, 12-Ch 10-Bit ADC channels, and 3 timers. It operates at a max clock frequency of 16 MHz and has low power mode for energy efficiency. Ideal for industrial applications requiring high-speed processing and connectivity via I2C, IRDA, LIN, SPI(2), UART interfaces.

Median Price

$2.528

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 8,149 parts In-Stock

1+ parts

$3.030

100+ parts

$2.655

1k+ parts

$1.500

10k+ parts

-

8,149

$3.030

$2.655

$1.500

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Arrow

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$2.027

4,000

-

-

-

$2.027

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,280 parts In-Stock

1+ parts

$2.878

100+ parts

-

1k+ parts

-

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4,280

$2.878

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-

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Vyrian

USA . 4,933 parts In-Stock

1+ parts

-

100+ parts

-

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4,933

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 611 parts In-Stock

1+ parts

$2.727

100+ parts

-

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-

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611

$2.727

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AZTECH Wire

Italy . 571 parts In-Stock

1+ parts

$19.820

100+ parts

-

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571

$19.820

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Parana Technologies

USA . 22 parts In-Stock

1+ parts

$60.985

100+ parts

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22

$60.985

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DigiPath Technology Company

USA . 323 parts In-Stock

1+ parts

$67.152

100+ parts

$61.779

1k+ parts

-

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323

$67.152

$61.779

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ChromeModa Solutions

Germany . 683 parts In-Stock

1+ parts

$68.522

100+ parts

$56.188

1k+ parts

-

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683

$68.522

$56.188

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IDEA Electronic Components Group

UK . 325 parts In-Stock

1+ parts

$68.522

100+ parts

$65.096

1k+ parts

$61.670

10k+ parts

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325

$68.522

$65.096

$61.670

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Perfect Parts

USA . 24,640 parts In-Stock

1+ parts

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24,640

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Overview

Unlock the power of innovation with the MSP430G2855IDA38R by Texas Instruments, a cutting-edge microcontroller that boasts unparalleled quality and reliability. As a leader in the industry, Texas Instruments delivers top-notch products that cater to a wide range of applications. The MSP430G2855IDA38R offers customers exceptional value with its advanced features, low power consumption, and high performance. Whether you're working on IoT devices, consumer electronics, or industrial automation, this microcontroller provides the perfect solution for your needs. Trust Texas Instruments to bring you the best in technology and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used in microcontrollers for its durability and cost-effectiveness.

Surface Mount: YES

Surface mount technology allows for smaller and more compact designs, making this microcontroller suitable for space-constrained applications.

Maximum Supply Voltage: 3.6 V

With a relatively high maximum supply voltage, this microcontroller can handle a wide range of power inputs.

On Chip Data RAM Width: 8

Having a wider data RAM width allows for faster and more efficient data processing.

Package Shape: RECTANGULAR

Rectangular packages are easy to handle and integrate into circuit designs.

Bit Size: 16

A 16-bit architecture allows for higher computational power and precision in data processing.

Power Supplies (V): 2/3.3

Support for multiple power supply options provides flexibility in powering the microcontroller.

No. of Terminals: 38

Having a higher number of terminals allows for more connectivity options and functionalities.

Minimum Supply Voltage: 3.3 V

The low minimum supply voltage ensures efficient power consumption and operation.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature makes this microcontroller suitable for industrial environments with varying temperature conditions.

CPU Family: MSP430

The MSP430 CPU family is known for its low power consumption and high performance, making it a reliable choice for energy-efficient applications.

Minimum Operating Temperature: -40 °C

The wide operating temperature range allows for reliable performance in extreme cold conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

This terminal finish provides good conductivity and corrosion resistance, ensuring long-term reliability.

ADC Channels: YES

Built-in Analog to Digital Converters (ADC) enable the microcontroller to interface with analog sensors and signals.

Peripheral IC Type: MICROCONTROLLER, RISC

This microcontroller uses a Reduced Instruction Set Computing (RISC) architecture, which typically results in faster and more efficient processing.

Technical Specifications

Microcontrollers MSP430G2855IDA38R attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

OPERATES AT 1.8V SUPPLY AT 6 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G38

JESD-609 Code:

e4

Length:

12.5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

32

No. of Serial I/Os:

1

No. of Terminals:

38

No. of Timers:

3

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP38,.32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

4096

RAM Words:

4

ROM Words:

49152

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.45 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.1 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, IRDA, LIN, SPI(2), UART

Peripherals:

BOR, COMPARATOR(8), POR, PWM, TIMER(3), WDT

Analog To Digital Convertors:

12-Ch 10-Bit

Trade Compliance

MSP430G2855IDA38R Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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