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MSP430G2744IYFFT

Texas Instruments

MSP430G2744IYFFT by Texas Instruments

MSP430G2744IYFFT by Texas Instruments is a 16-bit microcontroller with 32 I/O lines, 1024 bytes of RAM, and 12-Ch 10-Bit ADC channels. It operates at a max clock frequency of 16 MHz and has peripherals like BOD, TIMER(2), WDT. Ideal for industrial applications requiring low power consumption and high-speed processing.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,077 parts In-Stock

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Digiode

USA . 1,316 parts In-Stock

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1,316

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Distributors (Availability)

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AZTECH Wire

Italy . 868 parts In-Stock

1+ parts

$12.989

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868

$12.989

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One Stop Electronics

USA . 668 parts In-Stock

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$30.000

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668

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

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$43.616

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$39.691

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$35.765

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$43.616

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$35.765

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Parana Technologies

USA . 2,335 parts In-Stock

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$52.441

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$4,869.903

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$47.197

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2,335

$52.441

$4,869.903

$47.197

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DigiPath Technology Company

USA . 1,139 parts In-Stock

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$57.744

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$53.124

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1,139

$57.744

$53.124

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ChromeModa Solutions

Germany . 1,861 parts In-Stock

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$58.922

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$48.316

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1,861

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IDEA Electronic Components Group

UK . 1,745 parts In-Stock

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$58.922

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$55.976

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$53.030

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Corphita

USA . 1,497 parts In-Stock

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Microchip USA

USA . 245 parts In-Stock

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Overview

Unlock endless possibilities with the Texas Instruments MSP430G2744IYFFT Microcontroller! This high-quality product offers a wide range of applications in various industries, providing exceptional value and benefits to customers. With its advanced technology and reliable performance, this microcontroller is perfect for projects requiring precision and efficiency. Trust Texas Instruments to deliver top-notch products that meet your needs and exceed your expectations. Experience innovation like never before with the MSP430G2744IYFFT Microcontroller.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, making it convenient for mass production.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for compatibility with a wide range of power sources.

Package Shape: RECTANGULAR

Rectangular package shape is common and easy to work with for design and mounting purposes.

Bit Size: 16

16-bit architecture provides a good balance between processing power and cost effectiveness.

Power Supplies (V): 2/3.3

Support for multiple power supply voltages offers flexibility in system design.

No. of Terminals: 49

Having a high number of terminals allows for connecting to a variety of external components and peripherals.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

This package style offers high component density, making it suitable for compact designs.

Minimum Supply Voltage: 1.8 V

Low minimum supply voltage helps in reducing power consumption in low-power applications.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability in harsh environmental conditions.

CPU Family: MSP430

MSP430 family of microcontrollers are known for their low power consumption and high performance, making them ideal for battery-operated devices.

Technical Specifications

Microcontrollers MSP430G2744IYFFT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-XBGA-B49

JESD-609 Code:

e1

Length:

3.488 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

32

No. of Terminals:

49

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

BGA49,7X7,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

1024

ROM Words:

33024

ROM Programmability:

FLASH

Maximum Seated Height:

.625 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.55 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.33 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, IRDA, LIN, SPI(2), UART

Peripherals:

BOD, TIMER(2), WDT

Analog To Digital Convertors:

12-Ch 10-Bit

Trade Compliance

MSP430G2744IYFFT Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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