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MSP430G2544IYFFR

Texas Instruments

MSP430G2544IYFFR by Texas Instruments

MSP430G2544IYFFR by Texas Instruments is a 16-bit microcontroller with 16640 ROM words, 512 RAM bytes, and 12-Ch 10-Bit ADC channels. It operates at a max clock frequency of 16 MHz and has peripherals like BOD, TIMER(2), WDT. Ideal for industrial applications requiring low power consumption and high-speed processing.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,468 parts In-Stock

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6,468

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Digiode

USA . 3,500 parts In-Stock

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3,500

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Distributors (Availability)

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AZTECH Wire

Italy . 674 parts In-Stock

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$12.441

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674

$12.441

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One Stop Electronics

USA . 1,551 parts In-Stock

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$19.000

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1,551

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Parana Technologies

USA . 720 parts In-Stock

1+ parts

$45.378

100+ parts

$4,214.076

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$40.841

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720

$45.378

$4,214.076

$40.841

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DigiPath Technology Company

USA . 1,391 parts In-Stock

1+ parts

$49.967

100+ parts

$45.970

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1,391

$49.967

$45.970

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ChromeModa Solutions

Germany . 5,990 parts In-Stock

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$50.987

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$41.809

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5,990

$50.987

$41.809

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IDEA Electronic Components Group

UK . 618 parts In-Stock

1+ parts

$50.987

100+ parts

$48.438

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$45.888

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618

$50.987

$48.438

$45.888

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Microchip USA

USA . 4,060 parts In-Stock

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Corphita

USA . 3,131 parts In-Stock

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Overview

Unleash the power of innovation with the MSP430G2544IYFFR by Texas Instruments. This cutting-edge microcontroller offers unparalleled quality and reliability, making it the top choice for a wide range of applications. With features such as low power consumption and a maximum supply voltage of 3.6V, this versatile device is perfect for projects where efficiency is key. Whether you're designing smart home devices or industrial automation systems, the MSP430G2544IYFFR delivers the performance and value you need to bring your ideas to life. Trust in Texas Instruments to provide the technology that drives success.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for compact and efficient designs, making it easier for manufacturers to integrate this microcontroller into their products.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage provides flexibility in power source selection and allows the microcontroller to operate in a wide range of applications.

Package Shape: RECTANGULAR

The rectangular package shape is common and easy to handle, making it suitable for automated assembly processes.

Bit Size: 16

The 16-bit architecture allows for higher processing power and performance compared to 8-bit microcontrollers, making it suitable for demanding applications.

Power Supplies (V): 2/3.3

Support for multiple power supply voltages provides flexibility in design and integration with other components in the system.

No. of Terminals: 49

Having a sufficient number of terminals allows for easy interfacing with other components and peripherals, making it versatile in application usage.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The fine pitch and thin profile package style saves space and allows for high-density mounting, ideal for compact and portable devices.

Minimum Supply Voltage: 1.8 V

The low minimum supply voltage helps in achieving power efficiency and extends battery life in battery-powered devices.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this microcontroller can withstand harsh environmental conditions and maintain reliable performance in industrial settings.

CPU Family: MSP430

The MSP430 CPU family is known for its low power consumption and high performance, making it a popular choice for battery-operated and energy-efficient applications.

Minimum Operating Temperature: -40 °C

The wide temperature range of operation allows the microcontroller to function in extreme cold conditions, making it suitable for outdoor and automotive applications.

Terminal Finish: TIN SILVER COPPER

The combination of tin, silver, and copper terminal finish provides good corrosion resistance and reliable electrical connections for long-term usage.

ADC Channels: YES

Analog to digital converters (ADC) enable the microcontroller to interface with sensors and analog devices, expanding its capabilities in data acquisition and processing.

Terminal Position: BOTTOM

Bottom terminal position allows for easy accessibility and connectivity in PCB layouts, simplifying the assembly process and reducing signal path lengths for improved signal integrity.

ROM Words: 16640

The large ROM capacity provides ample space for program storage, allowing for complex algorithms and applications to be executed efficiently.

Maximum Seated Height: 0.625 mm

The low seated height saves space and enables slim designs, making it suitable for applications with tight constraints on vertical clearance.

Width: 3.33 mm

The compact width dimension allows for space-efficient PCB layouts and compact designs, ideal for small form factor devices.

Peripherals: BOD, TIMER(2), WDT

Built-in peripherals like Brown-Out Detector (BOD), timers, and watchdog timer (WDT) enhance the microcontroller's functionality and reliability in controlling external devices and system operation.

Maximum Clock Frequency: 16 MHz

The high maximum clock frequency allows for fast execution of instructions and real-time processing, suitable for time-critical applications.

Maximum Time At Peak Reflow Temperature (s): 30

The short reflow time at peak temperature ensures efficient soldering during manufacturing processes, reducing assembly time and cost.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures reliable solder connections and robust mechanical properties, essential for durability in harsh operating conditions.

Length: 3.488 mm

The compact length dimension provides flexibility in board layout and integration, allowing for space-saving designs in various electronic products.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in demanding environments with extended temperature ranges, making it suitable for industrial and automotive applications.

Peripheral IC Type: MICROCONTROLLER, RISC

The microcontroller based on Reduced Instruction Set Computing (RISC) architecture offers high performance and power efficiency, ideal for embedded control applications.

RAM Bytes: 512

Having a sufficient amount of RAM enables the microcontroller to store and manipulate data efficiently, enhancing its processing capabilities for complex tasks.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor (CMOS) technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable in noisy environments.

Terminal Form: BALL

The ball terminal form provides reliable electrical connections and ease of soldering during assembly, ensuring secure and durable connections in electronic circuits.

Analog To Digital Convertors: 12-Ch 10-Bit

The 12-channel 10-bit ADC configuration allows for multiple analog inputs to be converted with high resolution, enhancing the microcontroller's ability to interface with various sensors and devices.

Maximum Supply Current: 0.55 mA

The low maximum supply current ensures energy efficiency and extends battery life in portable and battery-operated devices, reducing overall power consumption.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3 V provides stability and compatibility with standard power sources, ensuring optimal performance and reliability in different operational conditions.

PWM Channels: YES

Pulse Width Modulation (PWM) channels enable precise control of analog signals, allowing the microcontroller to generate variable output voltages and signals required for motor control, lighting dimming, and other applications.

Connectivity: I2C, IRDA, LIN, SPI(2), UART

Support for multiple communication interfaces such as I2C, IRDA, LIN, SPI, and UART enables seamless integration with external devices, sensors, and networks, enhancing the microcontroller's connectivity and versatility.

ROM Programmability: FLASH

Flash programmability allows for easy and flexible reprogramming of the microcontroller's memory, enabling firmware updates and customization without the need for specialized equipment or extensive manufacturing processes.

Terminal Pitch: 0.4 mm

The fine terminal pitch of 0.4 mm facilitates high-density mounting and compact PCB designs, improving overall system efficiency and reliability in space-constrained applications.

Speed: 16 rpm

The 16 revolutions per minute (rpm) speed rating may indicate the maximum processing speed or operating frequency of the microcontroller, providing an indication of its performance capabilities in real-time applications.

On Chip Program ROM Width: 8

The 8-bit on-chip program ROM width indicates the data word size that can be processed by the microcontroller, influencing its processing speed and efficiency in executing instructions and algorithms.

No. of I/O Lines: 32

Having 32 input/output lines allows for versatile interfacing with external devices, peripherals, and sensors, expanding the microcontroller's functionality and connectivity options in diverse application scenarios.

Technical Specifications

Microcontrollers MSP430G2544IYFFR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-XBGA-B49

JESD-609 Code:

e1

Length:

3.488 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

32

No. of Terminals:

49

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

BGA49,7X7,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

512

ROM Words:

16640

ROM Programmability:

FLASH

Maximum Seated Height:

.625 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.55 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.33 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, IRDA, LIN, SPI(2), UART

Peripherals:

BOD, TIMER(2), WDT

Analog To Digital Convertors:

12-Ch 10-Bit

Trade Compliance

MSP430G2544IYFFR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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