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MSP430G2444IRHA40T

Texas Instruments

MSP430G2444IRHA40T by Texas Instruments

MSP430G2444IRHA40T by Texas Instruments is a 16-bit microcontroller with 8192 ROM words, 512 RAM bytes, and 12-Ch 10-Bit ADC channels. Ideal for industrial applications, it operates at up to 16 MHz with low power mode support and features BOD, POR, TIMER(2) peripherals.

Median Price

$4.080

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,500 parts In-Stock

1+ parts

$3.141

100+ parts

$2.752

1k+ parts

$1.555

10k+ parts

-

1,500

$3.141

$2.752

$1.555

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DigiKey

USA . 230 parts In-Stock

1+ parts

$5.020

100+ parts

$3.188

1k+ parts

-

10k+ parts

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230

$5.020

$3.188

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-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,186 parts In-Stock

1+ parts

$2.984

100+ parts

-

1k+ parts

-

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2,186

$2.984

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Vyrian

USA . 5,585 parts In-Stock

1+ parts

-

100+ parts

-

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5,585

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 696 parts In-Stock

1+ parts

$2.670

100+ parts

$2.603

1k+ parts

$2.590

10k+ parts

-

696

$2.670

$2.603

$2.590

-

Ampacity Inc.

Singapore . 401 parts In-Stock

1+ parts

$2.670

100+ parts

-

1k+ parts

-

10k+ parts

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401

$2.670

-

-

-

Corphita

USA . 1,620 parts In-Stock

1+ parts

$2.827

100+ parts

-

1k+ parts

-

10k+ parts

-

1,620

$2.827

-

-

-

Corohmni

South Africa . 314 parts In-Stock

1+ parts

$3.141

100+ parts

-

1k+ parts

-

10k+ parts

-

314

$3.141

-

-

-

Microchip USA

USA . 2,275 parts In-Stock

1+ parts

$18.890

100+ parts

$18.770

1k+ parts

$18.710

10k+ parts

$18.650

2,275

$18.890

$18.770

$18.710

$18.650

Parana Technologies

USA . 1,405 parts In-Stock

1+ parts

$25.184

100+ parts

-

1k+ parts

$25.833

10k+ parts

-

1,405

$25.184

-

$25.833

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ChromeModa Solutions

Germany . 3,117 parts In-Stock

1+ parts

$28.297

100+ parts

$23.204

1k+ parts

-

10k+ parts

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3,117

$28.297

$23.204

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-

IDEA Electronic Components Group

UK . 152 parts In-Stock

1+ parts

$28.297

100+ parts

$26.882

1k+ parts

$25.467

10k+ parts

-

152

$28.297

$26.882

$25.467

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QUARKTWIN TECHNOLOGY LTD

USA . 22,388 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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22,388

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Perfect Parts

USA . 3,080 parts In-Stock

1+ parts

-

100+ parts

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3,080

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DigiPath Technology Company

USA . 173 parts In-Stock

1+ parts

-

100+ parts

$25.513

1k+ parts

-

10k+ parts

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173

-

$25.513

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Overview

Experience the cutting-edge innovation of the MSP430G2444IRHA40T microcontroller by Texas Instruments, a leader in the industry. Designed with precision and reliability in mind, this device offers unparalleled performance in various applications. With its advanced technology and versatile features, customers can expect seamless integration, enhanced functionality, and optimal efficiency. Unlock the potential of your projects with the MSP430G2444IRHA40T and elevate your experience to new heights. Choose quality, choose Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used in microcontrollers due to its durability and cost-effectiveness.

Surface Mount: YES

Surface mount technology allows for compact design and efficient assembly process.

Maximum Supply Voltage: 3.6 V

Can operate at higher voltage levels, providing flexibility in power supply options.

On Chip Data RAM Width: 8

Wider data RAM width allows for faster data processing and storage capacity.

Package Shape: SQUARE

Square shape is space-efficient and facilitates easy PCB layout.

Bit Size: 16

With 16-bit architecture, the microcontroller can handle larger data sets and perform complex operations.

Power Supplies (V): 2/3.3

Supports dual power supply options for versatility in different applications.

No. of Terminals: 40

Having a higher number of terminals allows for more connectivity options and peripheral interfaces.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of different package styles provides thermal efficiency, space-saving, and design flexibility.

Minimum Supply Voltage: 1.8 V

Can operate at low voltage levels, ideal for power-saving applications.

Maximum Operating Temperature: 85 °C

With high temperature tolerance, suitable for industrial environments where heat may be a factor.

CPU Family: MSP430

Belonging to the MSP430 family ensures compatibility with existing hardware and software ecosystem.

Minimum Operating Temperature: -40 °C

Capable of operating in extreme cold conditions, making it suitable for a wide range of environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Provides excellent conductivity and corrosion resistance for reliable connections.

ADC Channels: YES

Integrated analog-to-digital converters enable the microcontroller to interact with analog signals.

Terminal Position: QUAD

Quad terminal position allows for easy soldering and PCB mounting.

ROM Words: 8192

Large ROM capacity accommodates extensive program storage for complex algorithms and applications.

Maximum Seated Height: 1 mm

Low seated height enables slim and compact device designs.

RAM Words: 0.5

Sufficient RAM capacity for temporary data storage and fast processing.

Width: 6 mm

Compact width for space-constrained designs and efficient PCB layout.

Boundary Scan: YES

Boundary scan feature aids in testing and debugging during production and maintenance.

Peripherals: BOD, POR, TIMER(2)

Integrated peripherals provide additional functionalities for various applications.

Maximum Clock Frequency: 16 MHz

High clock frequency allows for fast processing and real-time operation.

Peak Reflow Temperature °C: 260

Can withstand high temperatures during the reflow soldering process for reliable assembly.

Length: 6 mm

Compact length contributes to overall space efficiency in product design.

Temperature Grade: INDUSTRIAL

Designed to meet industrial-grade temperature specifications for rugged and reliable performance.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture enables fast and efficient processing, ideal for embedded systems.

No. of Timers: 2

Multiple timers allow for precise timing control in various applications.

RAM Bytes: 512

Adequate RAM capacity for data storage and manipulation in real-time operations.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient performance.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and ensures reliability.

Analog To Digital Convertors: 12-Ch 10-Bit

Multiple ADC channels with high resolution for accurate analog signal conversion.

Maximum Supply Current: 0.55 mA

Low supply current consumption for energy-efficient operation.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage ensures consistent performance in operation.

PWM Channels: YES

Pulse Width Modulation (PWM) channels enable precise control of output signals for motor control and power management.

Connectivity: USCI

USCI (Universal Serial Communication Interface) provides versatile communication options for connectivity with other devices.

ROM Programmability: FLASH

Flash ROM allows for easy reprogramming and updating of firmware without requiring external programming tools.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables high-density mounting and compact PCB layout.

Format: FIXED POINT

Fixed-point format simplifies arithmetic operations and reduces computational complexity.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate sensitivity to moisture during storage and assembly processes.

Speed: 16 rpm

Operates at a speed of 16 rotations per minute, suitable for applications requiring precise timing control.

Low Power Mode: YES

Low power mode enables power-saving operation for extended battery life in portable devices.

On Chip Program ROM Width: 8

8-bit ROM width for on-chip program storage and execution, suitable for smaller applications.

No. of I/O Lines: 32

A high number of I/O lines allow for versatile input/output configurations and external device connectivity.

Technical Specifications

Microcontrollers MSP430G2444IRHA40T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e4

Length:

6 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

32

No. of Serial I/Os:

1

No. of Terminals:

40

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC40,.24SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

512

RAM Words:

0.5

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.55 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

USCI

Peripherals:

BOD, POR, TIMER(2)

Analog To Digital Convertors:

12-Ch 10-Bit

Trade Compliance

MSP430G2444IRHA40T Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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