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MSP430G2413IPW20R

Texas Instruments

MSP430G2413IPW20R by Texas Instruments

MSP430G2413IPW20R by Texas Instruments is a 16-bit microcontroller with 8KB ROM and 512B RAM. Operating at up to 16MHz, it offers low power mode and peripherals like BOD, DMA, and timers. Ideal for industrial applications requiring high-speed processing in compact designs.

Median Price

$1.294

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 163,658 parts In-Stock

1+ parts

$1.640

100+ parts

$1.354

1k+ parts

$0.732

10k+ parts

-

163,658

$1.640

$1.354

$0.732

-

Chip1Stop

Japan . 8,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.947

8,000

-

-

-

$0.947

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,011 parts In-Stock

1+ parts

$1.558

100+ parts

-

1k+ parts

-

10k+ parts

-

3,011

$1.558

-

-

-

Vyrian

USA . 7,092 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,092

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,827 parts In-Stock

1+ parts

$1.476

100+ parts

-

1k+ parts

-

10k+ parts

-

1,827

$1.476

-

-

-

Microchip USA

USA . 2,244 parts In-Stock

1+ parts

$6.488

100+ parts

-

1k+ parts

-

10k+ parts

-

2,244

$6.488

-

-

-

AZTECH Wire

Italy . 620 parts In-Stock

1+ parts

$12.540

100+ parts

-

1k+ parts

-

10k+ parts

-

620

$12.540

-

-

-

Parana Technologies

USA . 1,658 parts In-Stock

1+ parts

$40.228

100+ parts

-

1k+ parts

-

10k+ parts

-

1,658

$40.228

-

-

-

DigiPath Technology Company

USA . 1,402 parts In-Stock

1+ parts

$44.296

100+ parts

$40.752

1k+ parts

-

10k+ parts

-

1,402

$44.296

$40.752

-

-

ChromeModa Solutions

Germany . 1,137 parts In-Stock

1+ parts

$45.200

100+ parts

$37.064

1k+ parts

-

10k+ parts

-

1,137

$45.200

$37.064

-

-

IDEA Electronic Components Group

UK . 969 parts In-Stock

1+ parts

$45.200

100+ parts

$42.940

1k+ parts

$40.680

10k+ parts

-

969

$45.200

$42.940

$40.680

-

Component Stockers USA

USA . 82,482 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.770

10k+ parts

$0.770

82,482

-

-

$0.770

$0.770

A-Z Elektronik GmbH

Germany . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,000

-

-

-

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iodParts Technologies Inc.

India . 140 parts In-Stock

1+ parts

-

100+ parts

$2.081

1k+ parts

-

10k+ parts

-

140

-

$2.081

-

-

Overview

Unlock the power of innovation with the MSP430G2413IPW20R by Texas Instruments, a cutting-edge microcontroller that delivers exceptional quality and reliability. Designed by a trusted manufacturer in the industry, this product is perfect for a wide range of applications, from IoT devices to consumer electronics. Experience seamless connectivity and advanced features, all while enjoying the tremendous value and benefits that this product brings to your projects. Trust in Texas Instruments to bring your ideas to life with the MSP430G2413IPW20R.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material, ideal for portable and rugged applications.

Surface Mount: YES

SMT technology allows for compact design and efficient assembly processes.

Maximum Supply Voltage: 3.6 V

Allows for wider voltage range compatibility in various power supply configurations.

On Chip Data RAM Width: 8

Efficient data processing and storage capabilities for quick access to information.

Package Shape: RECTANGULAR

Standard shape for easy integration into different electronic systems and PCB layouts.

Bit Size: 16

Higher bit size allows for complex calculations and operations to be performed efficiently.

Power Supplies (V): 2/3.3

Multiple voltage options for flexibility in power management and energy efficiency.

No. of Terminals: 20

Sufficient terminals for connecting to various external components and peripherals.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact package style saves space and enables high-density PCB designs.

Minimum Supply Voltage: 3.3 V

Ensures stable operation even at lower voltage levels for power-saving applications.

Maximum Operating Temperature: 85 °C

Wide temperature range support for industrial and harsh environments.

CPU Family: MSP430

Highly efficient and reliable microcontroller architecture for embedded systems.

Technical Specifications

Microcontrollers MSP430G2413IPW20R attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

NO

Additional Features:

ALSO OPERATES AT 1.8V AT 6 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

1

No. of I/O Lines:

16

No. of Serial I/Os:

1

No. of Terminals:

20

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

512

RAM Words:

0.5

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.42 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, LIN, SPI, UART, USCI(2)"

Peripherals:

"BOD, COMPARATOR(8), DMA(1), TIMER(2), WDT"

Trade Compliance

MSP430G2413IPW20R Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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