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MSP430G2413IPW20

Texas Instruments

MSP430G2413IPW20 by Texas Instruments

MSP430G2413IPW20 by Texas Instruments is a 16-bit microcontroller with 8KB ROM and 512B RAM. Operating at up to 16MHz, it offers low power modes and peripherals like BOD, DMA, and timers. Ideal for industrial applications requiring high-speed processing in compact designs.

Median Price

$2.794

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 23,970 parts In-Stock

1+ parts

$1.967

100+ parts

$1.624

1k+ parts

$0.878

10k+ parts

-

23,970

$1.967

$1.624

$0.878

-

Mouser Electronics

USA . 269 parts In-Stock

1+ parts

$3.620

100+ parts

$2.170

1k+ parts

$1.670

10k+ parts

$1.570

269

$3.620

$2.170

$1.670

$1.570

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,643 parts In-Stock

1+ parts

$1.748

100+ parts

-

1k+ parts

-

10k+ parts

-

3,643

$1.748

-

-

-

Vyrian

USA . 4,768 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,768

-

-

-

-

Bristol Electronics

USA . 64 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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64

-

-

-

-

Atlantic Semiconductor

USA . 64 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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64

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 662 parts In-Stock

1+ parts

$1.656

100+ parts

-

1k+ parts

-

10k+ parts

-

662

$1.656

-

-

-

Microchip USA

USA . 1,255 parts In-Stock

1+ parts

$17.030

100+ parts

$16.930

1k+ parts

$16.870

10k+ parts

$16.820

1,255

$17.030

$16.930

$16.870

$16.820

Parana Technologies

USA . 1,088 parts In-Stock

1+ parts

$27.084

100+ parts

$2,515.122

1k+ parts

$24.375

10k+ parts

-

1,088

$27.084

$2,515.122

$24.375

-

DigiPath Technology Company

USA . 105 parts In-Stock

1+ parts

$29.822

100+ parts

-

1k+ parts

-

10k+ parts

-

105

$29.822

-

-

-

IDEA Electronic Components Group

UK . 1,911 parts In-Stock

1+ parts

$30.431

100+ parts

$28.909

1k+ parts

$27.388

10k+ parts

-

1,911

$30.431

$28.909

$27.388

-

ChromeModa Solutions

Germany . 439 parts In-Stock

1+ parts

$30.431

100+ parts

$24.953

1k+ parts

-

10k+ parts

-

439

$30.431

$24.953

-

-

A-Z Elektronik GmbH

Germany . 5,030 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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5,030

-

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Perfect Parts

USA . 1,158 parts In-Stock

1+ parts

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1,158

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Overview

Discover the cutting-edge MSP430G2413IPW20 microcontroller by Texas Instruments, a leader in the industry known for top-quality products. Designed for a wide range of applications, this small outline, thin profile chip offers unparalleled performance and efficiency. With features like low power mode and on-chip data RAM, customers can expect superior functionality and reliability. Whether you're working on IoT devices or automation systems, this microcontroller will take your projects to the next level. Experience the value and benefits of Texas Instruments' technology with the MSP430G2413IPW20.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material makes the product lightweight and durable, which is ideal for portable applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the product on circuit boards.

Maximum Supply Voltage: 3.6 V

A higher supply voltage allows for better performance and flexibility in powering the device.

Bit Size: 16

The 16-bit architecture provides improved processing power for tasks requiring higher computational capabilities.

Power Supplies (V): 2/3.3

Having multiple power supply options allows for compatibility with different systems and voltage requirements.

Maximum Operating Temperature: 85 °C

With a high operating temperature range, this product can withstand harsh environmental conditions.

DMA Channels: YES

Direct Memory Access (DMA) channels enable efficient data transfers without involving the CPU, enhancing overall system performance.

ROM Words: 8192

The large ROM capacity allows for storing a significant amount of program data and instructions for the microcontroller.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture and dedicated peripherals make this microcontroller suitable for real-time control applications.

Connectivity: "I2C, IRDA, LIN, SPI, UART, USCI(2)

Multiple connectivity options ensure compatibility with various communication protocols and interfaces for seamless integration with other devices.

Technical Specifications

Microcontrollers MSP430G2413IPW20 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

NO

Additional Features:

ALSO OPERATES AT 1.8V AT 6 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

1

No. of I/O Lines:

16

No. of Serial I/Os:

1

No. of Terminals:

20

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

512

RAM Words:

0.5

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.42 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, LIN, SPI, UART, USCI(2)"

Peripherals:

"BOD, COMPARATOR(8), DMA(1), TIMER(2), WDT"

Trade Compliance

MSP430G2413IPW20 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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