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MSP430G2353IRHB32T

Texas Instruments

MSP430G2353IRHB32T by Texas Instruments

MSP430G2353IRHB32T by Texas Instruments is a 16-bit microcontroller with 8KB ROM and 256B RAM. It operates at a max frequency of 16MHz, suitable for industrial applications requiring low power consumption. Featuring ADC, DMA, and PWM channels, it offers connectivity options like I2C, SPI, and UART for versatile integration.

Median Price

$2.147

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,500 parts In-Stock

1+ parts

$1.754

100+ parts

$1.449

1k+ parts

$0.783

10k+ parts

-

1,500

$1.754

$1.449

$0.783

-

DigiKey

USA . 977 parts In-Stock

1+ parts

$2.540

100+ parts

$1.543

1k+ parts

-

10k+ parts

-

977

$2.540

$1.543

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,370 parts In-Stock

1+ parts

$1.666

100+ parts

-

1k+ parts

-

10k+ parts

-

4,370

$1.666

-

-

-

Vyrian

USA . 6,949 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,949

-

-

-

-

Speed Components Ltd

Israel . 226 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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226

-

-

-

-

Cogito LLC

Ukraine . 18 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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18

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 790 parts In-Stock

1+ parts

$1.490

100+ parts

-

1k+ parts

-

10k+ parts

-

790

$1.490

-

-

-

Corphita

USA . 2,308 parts In-Stock

1+ parts

$1.579

100+ parts

-

1k+ parts

-

10k+ parts

-

2,308

$1.579

-

-

-

Microchip USA

USA . 1,341 parts In-Stock

1+ parts

$10.280

100+ parts

$10.220

1k+ parts

$10.190

10k+ parts

$10.150

1,341

$10.280

$10.220

$10.190

$10.150

Parana Technologies

USA . 864 parts In-Stock

1+ parts

$38.711

100+ parts

$3,594.944

1k+ parts

$34.840

10k+ parts

-

864

$38.711

$3,594.944

$34.840

-

DigiPath Technology Company

USA . 948 parts In-Stock

1+ parts

$42.626

100+ parts

$39.216

1k+ parts

-

10k+ parts

-

948

$42.626

$39.216

-

-

IDEA Electronic Components Group

UK . 2,331 parts In-Stock

1+ parts

$43.496

100+ parts

$41.321

1k+ parts

$39.146

10k+ parts

-

2,331

$43.496

$41.321

$39.146

-

ChromeModa Solutions

Germany . 315 parts In-Stock

1+ parts

$43.496

100+ parts

$35.667

1k+ parts

-

10k+ parts

-

315

$43.496

$35.667

-

-

Overview

Unlock the potential of your projects with the Texas Instruments MSP430G2353IRHB32T microcontroller. Boasting top-notch quality from a trusted manufacturer, this chip offers versatile applications in various industries. With its low power consumption and high performance, this microcontroller provides exceptional value and benefits to customers looking to streamline their designs. Experience seamless connectivity and efficient data processing with the MSP430G2353IRHB32T, setting new standards for innovation and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package ensures durability and cost-effectiveness for the product.

Maximum Supply Voltage: 3.6 V

Allows for a wider range of external power supply options.

Bit Size: 16

Higher bit size allows for more data processing capabilities.

No. of Terminals: 32

Sufficient number of terminals for versatile connectivity options.

ADC Channels: YES

Integrated Analog to Digital Converters provide accurate analog signal processing.

DMA Channels: YES

Direct Memory Access channels improve data transfer efficiency.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture enhances processing speed and efficiency.

Connectivity: I2C, IRDA, LIN, SPI, UART, USCI(2)

Multiple connectivity options for interfacing with various devices and systems.

ROM Programmability: FLASH

Flash ROM programming allows for easy and quick updates to the program.

Low Power Mode: YES

Low power mode for energy efficiency and prolonged battery life.

Technical Specifications

Microcontrollers MSP430G2353IRHB32T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8V AT 6 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of DMA Channels:

1

No. of I/O Lines:

24

No. of Serial I/Os:

1

No. of Terminals:

32

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

256

RAM Words:

0.25

ROM Words:

4096

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.42 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, LIN, SPI, UART, USCI(2)"

Peripherals:

"BOD, COMPARATOR(8), DMA(1), TIMER(2), WDT"

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

MSP430G2353IRHB32T Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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