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MSP430G2333IRHB32T

Texas Instruments

MSP430G2333IRHB32T by Texas Instruments

MSP430G2333IRHB32T by Texas Instruments is a 16-bit microcontroller with 4096 ROM words and 256 RAM bytes. It operates at a max clock frequency of 0.032 MHz, suitable for industrial applications requiring low power consumption and connectivity via I2C, IRDA, SPI(2), UART, USCI(2). With 8 ADC channels and 10-bit PWM channels, it offers versatile analog-to-digital conversion capabilities.

Median Price

$1.772

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,000 parts In-Stock

1+ parts

$1.772

100+ parts

$1.463

1k+ parts

$0.791

10k+ parts

-

2,000

$1.772

$1.463

$0.791

-

Mouser Electronics

USA . 488 parts In-Stock

1+ parts

$3.320

100+ parts

$1.710

1k+ parts

$1.150

10k+ parts

$1.100

488

$3.320

$1.710

$1.150

$1.100

DigiKey

USA . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.170

10k+ parts

-

500

-

-

$1.170

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,975 parts In-Stock

1+ parts

$1.683

100+ parts

-

1k+ parts

-

10k+ parts

-

4,975

$1.683

-

-

-

Vyrian

USA . 4,191 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,191

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 814 parts In-Stock

1+ parts

$1.595

100+ parts

-

1k+ parts

-

10k+ parts

-

814

$1.595

-

-

-

Microchip USA

USA . 1,769 parts In-Stock

1+ parts

$10.390

100+ parts

$10.320

1k+ parts

$10.290

10k+ parts

$10.260

1,769

$10.390

$10.320

$10.290

$10.260

Parana Technologies

USA . 2,265 parts In-Stock

1+ parts

$23.387

100+ parts

-

1k+ parts

$24.021

10k+ parts

-

2,265

$23.387

-

$24.021

-

DigiPath Technology Company

USA . 2,285 parts In-Stock

1+ parts

$25.752

100+ parts

$23.692

1k+ parts

-

10k+ parts

-

2,285

$25.752

$23.692

-

-

ChromeModa Solutions

Germany . 2,533 parts In-Stock

1+ parts

$26.278

100+ parts

$21.548

1k+ parts

-

10k+ parts

-

2,533

$26.278

$21.548

-

-

IDEA Electronic Components Group

UK . 1,343 parts In-Stock

1+ parts

$26.278

100+ parts

$24.964

1k+ parts

$23.650

10k+ parts

-

1,343

$26.278

$24.964

$23.650

-

Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$45.214

100+ parts

$41.145

1k+ parts

$37.075

10k+ parts

-

2,000

$45.214

$41.145

$37.075

-

Futuretech Components

Singapore . 100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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100

-

-

-

-

iodParts Technologies Inc.

India . 100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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100

-

-

-

-

Overview

Unlock endless possibilities with the Texas Instruments MSP430G2333IRHB32T microcontroller. Manufactured by a trusted industry leader, this powerful device is perfect for a wide range of applications in various industries. With its cutting-edge technology and reliable performance, this microcontroller offers unparalleled value and benefits to customers looking for high-quality solutions. Experience seamless connectivity, low power consumption, and superior performance with the MSP430G2333IRHB32T. Elevate your projects and bring your ideas to life with this exceptional microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material makes the product suitable for various applications.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options, ensuring compatibility with different voltage sources.

Minimum Operating Temperature: -40 °C

Wide temperature range allows for reliable operation in extreme cold conditions.

ADC Channels: YES

Presence of Analog to Digital Converters enables accurate digital conversion of analog signals.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture ensures efficient processing and execution of instructions, enhancing overall performance.

Maximum Clock Frequency: 0.032 MHz

High clock frequency allows for faster data processing and response time.

Connectivity: I2C, IRDA, SPI(2), UART, USCI(2)

Multiple connectivity options enable seamless communication with other devices and systems.

Technical Specifications

Microcontrollers MSP430G2333IRHB32T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 6 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of DMA Channels:

1

No. of I/O Lines:

24

No. of Serial I/Os:

2

No. of Terminals:

32

No. of Timers:

6

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

256

RAM Words:

0.25

ROM Words:

4096

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.42 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, SPI(2), UART, USCI(2)"

Peripherals:

"BOD, DMA(1), TIMER(6), WDT"

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

MSP430G2333IRHB32T Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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