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MSP430G2332QPW2EP

Texas Instruments

MSP430G2332QPW2EP by Texas Instruments

MSP430G2332QPW2EP by Texas Instruments is a 16-bit microcontroller with 8KB Flash ROM and 256B RAM. It features 8 ADC channels, DMA support, and operates at a max frequency of 16MHz. Ideal for automotive applications due to its low power consumption, small form factor, and connectivity options like I2C and SPI.

Median Price

$4.710

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,681 parts In-Stock

1+ parts

$4.710

100+ parts

$3.840

1k+ parts

$2.560

10k+ parts

-

3,681

$4.710

$3.840

$2.560

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 686 parts In-Stock

1+ parts

$4.474

100+ parts

-

1k+ parts

-

10k+ parts

-

686

$4.474

-

-

-

Nova Conductors

Japan . 38 parts In-Stock

1+ parts

$4.760

100+ parts

-

1k+ parts

-

10k+ parts

-

38

$4.760

-

-

-

Vyrian

USA . 6,103 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,103

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 3,615 parts In-Stock

1+ parts

$4.000

100+ parts

-

1k+ parts

-

10k+ parts

-

3,615

$4.000

-

-

-

Corphita

USA . 1,602 parts In-Stock

1+ parts

$4.239

100+ parts

-

1k+ parts

-

10k+ parts

-

1,602

$4.239

-

-

-

Aranea Global

USA . 500 parts In-Stock

1+ parts

$4.665

100+ parts

-

1k+ parts

$4.478

10k+ parts

-

500

$4.665

-

$4.478

-

Continental Prestige Electronics

USA . 2,563 parts In-Stock

1+ parts

$4.760

100+ parts

-

1k+ parts

-

10k+ parts

$4.665

2,563

$4.760

-

-

$4.665

AZTECH Wire

Italy . 61 parts In-Stock

1+ parts

$8.810

100+ parts

-

1k+ parts

-

10k+ parts

-

61

$8.810

-

-

-

Parana Technologies

USA . 1,015 parts In-Stock

1+ parts

$28.160

100+ parts

-

1k+ parts

$44.336

10k+ parts

-

1,015

$28.160

-

$44.336

-

Microchip USA

USA . 2,242 parts In-Stock

1+ parts

$29.920

100+ parts

$29.730

1k+ parts

$29.640

10k+ parts

$29.550

2,242

$29.920

$29.730

$29.640

$29.550

ChromeModa Solutions

Germany . 4,061 parts In-Stock

1+ parts

$31.640

100+ parts

$25.945

1k+ parts

-

10k+ parts

-

4,061

$31.640

$25.945

-

-

IDEA Electronic Components Group

UK . 1,644 parts In-Stock

1+ parts

$31.640

100+ parts

$30.058

1k+ parts

$28.476

10k+ parts

-

1,644

$31.640

$30.058

$28.476

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,000

-

-

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DigiPath Technology Company

USA . 1,086 parts In-Stock

1+ parts

-

100+ parts

$28.527

1k+ parts

-

10k+ parts

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1,086

-

$28.527

-

-

Argo Parts USA

USA . 641 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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641

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Overview

Unlock the potential of your electronic projects with the MSP430G2332QPW2EP by Texas Instruments. This high-quality microcontroller offers unmatched performance and reliability, making it a top choice for a wide range of applications. With features such as low power mode, analog-to-digital converters, and connectivity options like I2C and SPI, this product provides incredible value to customers looking to streamline their designs and improve efficiency. Trust in Texas Instruments to deliver cutting-edge technology that will take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the microcontroller, ensuring a longer lifespan.

Surface Mount: YES

Surface mount capability makes it easier to integrate the microcontroller into circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in power supply options, accommodating various voltage requirements.

On Chip Data RAM Width: 8

Having a wider data RAM width allows for faster data processing and manipulation, enhancing the overall performance of the microcontroller.

Package Shape: RECTANGULAR

The rectangular package shape is commonly used and easily accommodated in standard designs, making it a versatile choice for different applications.

Bit Size: 16

A 16-bit architecture provides increased processing power and capability, suitable for handling more complex tasks and calculations.

Power Supplies (V): 2/3.3

Support for multiple power supply voltages allows for compatibility with various power sources, offering flexibility in design and implementation.

No. of Terminals: 20

Having 20 terminals provides ample connectivity options for interfacing with external devices and components, making the microcontroller versatile in application.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliable performance even in harsh environmental conditions, making it suitable for a wide range of applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller allows for efficient and high-speed operation, making it a good choice for applications requiring quick response times.

Technical Specifications

Microcontrollers MSP430G2332QPW2EP attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

1

No. of External Interrupts:

0

No. of I/O Lines:

16

No. of Serial I/Os:

0

No. of Terminals:

20

No. of Timers:

1

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

RAM Bytes:

256

RAM Words:

0.25

ROM Words:

4096

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.4 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2.7 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SPI

Peripherals:

DMA, TIMER, WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

MSP430G2332QPW2EP Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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