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MSP430G2312IRSA16T

Texas Instruments

MSP430G2312IRSA16T by Texas Instruments

MSP430G2312IRSA16T by Texas Instruments is a 16-bit microcontroller with 4096 ROM words, 256 RAM bytes, and 4 timers. It operates at up to 16 MHz, suitable for industrial applications requiring low power consumption and connectivity via I2C, SPI, USI interfaces.

Median Price

$1.301

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,000 parts In-Stock

1+ parts

$1.301

100+ parts

$1.075

1k+ parts

$0.581

10k+ parts

-

2,000

$1.301

$1.075

$0.581

-

DigiKey

USA . 500 parts In-Stock

1+ parts

$1.620

100+ parts

-

1k+ parts

$0.994

10k+ parts

-

500

$1.620

-

$0.994

-

Rochester

USA . 250 parts In-Stock

1+ parts

-

100+ parts

$1.130

1k+ parts

$0.938

10k+ parts

$0.836

250

-

$1.130

$0.938

$0.836

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 912 parts In-Stock

1+ parts

$0.767

100+ parts

-

1k+ parts

-

10k+ parts

-

912

$0.767

-

-

-

Vyrian

USA . 6,983 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,983

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 825 parts In-Stock

1+ parts

$0.690

100+ parts

-

1k+ parts

-

10k+ parts

-

825

$0.690

-

-

-

Corphita

USA . 545 parts In-Stock

1+ parts

$0.726

100+ parts

-

1k+ parts

-

10k+ parts

-

545

$0.726

-

-

-

Component Stockers USA

USA . 1,621 parts In-Stock

1+ parts

$0.820

100+ parts

$0.770

1k+ parts

$0.620

10k+ parts

-

1,621

$0.820

$0.770

$0.620

-

Microchip USA

USA . 2,763 parts In-Stock

1+ parts

$7.628

100+ parts

-

1k+ parts

-

10k+ parts

-

2,763

$7.628

-

-

-

Parana Technologies

USA . 225 parts In-Stock

1+ parts

$47.522

100+ parts

-

1k+ parts

-

10k+ parts

-

225

$47.522

-

-

-

DigiPath Technology Company

USA . 2,375 parts In-Stock

1+ parts

$52.327

100+ parts

$48.141

1k+ parts

-

10k+ parts

-

2,375

$52.327

$48.141

-

-

ChromeModa Solutions

Germany . 3,516 parts In-Stock

1+ parts

$53.395

100+ parts

$43.784

1k+ parts

-

10k+ parts

-

3,516

$53.395

$43.784

-

-

IDEA Electronic Components Group

UK . 72 parts In-Stock

1+ parts

$53.395

100+ parts

$50.725

1k+ parts

$48.056

10k+ parts

-

72

$53.395

$50.725

$48.056

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iodParts Technologies Inc.

India . 9,189 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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9,189

-

-

-

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Perfect Parts

USA . 629 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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629

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Overview

Unlock endless possibilities with the MSP430G2312IRSA16T by Texas Instruments, a top-quality microcontroller that revolutionizes the way you approach your projects. With a wide range of applications in various industries, this powerful device offers unparalleled value and benefits to customers. Trust in the expertise of Texas Instruments to deliver cutting-edge technology that will elevate your designs to new heights. Discover the advantages of the MSP430G2312IRSA16T and experience innovation like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller chip, ensuring long-term reliability.

Maximum Supply Voltage: 3.6 V

Can handle higher voltage inputs, allowing for flexibility in power supply options.

Bit Size: 16

Offers a good balance between performance and complexity for a wide range of applications.

CPU Family: MSP430

The MSP430 family is known for its low power consumption and high performance, making it a popular choice for energy-efficient applications.

Temperature Grade: INDUSTRIAL

Suitable for industrial environments where temperature fluctuations and harsh conditions may be present.

Technology: CMOS

CMOS technology is known for its low power consumption and high noise immunity, making it an energy-efficient and reliable choice for microcontrollers.

Connectivity: 'I2C, SPI, USI'

Provides versatile communication options, allowing the microcontroller to easily interface with a variety of other devices and sensors.

ROM Programmability: FLASH

Flash memory allows for easy reprogramming of the microcontroller, making it flexible and adaptable to changing requirements.

Low Power Mode: YES

Enables power-saving features that are essential for battery-powered and energy-efficient applications.

Technical Specifications

Microcontrollers MSP430G2312IRSA16T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 6MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N16

JESD-609 Code:

e4

Length:

4 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of DMA Channels:

0

No. of I/O Lines:

16

No. of Serial I/Os:

0

No. of Terminals:

16

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC16,.16SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

256

RAM Words:

0.25

ROM Words:

4096

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.4 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.2 V

Nominal Supply Voltage:

2.7 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, SPI, USI"

Peripherals:

"BOD, COMPARATOR(8), TIMER(4), WDT"

Trade Compliance

MSP430G2312IRSA16T Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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