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MSP430G2303IPW28

Texas Instruments

MSP430G2303IPW28 by Texas Instruments

MSP430G2303IPW28 by Texas Instruments is a 16-bit microcontroller with 4096 ROM words and 256 RAM bytes. Operating at 0.032 MHz, it offers low power mode and peripherals like BOD, TIMER(6), WDT. Ideal for industrial applications requiring small form factor and connectivity via I2C, IRDA, SPI(2), UART, USCI(2).

Median Price

$1.907

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 5,700 parts In-Stock

1+ parts

$1.604

100+ parts

$1.325

1k+ parts

$0.716

10k+ parts

-

5,700

$1.604

$1.325

$0.716

-

DigiKey

USA . 410 parts In-Stock

1+ parts

$2.210

100+ parts

$1.337

1k+ parts

$1.262

10k+ parts

-

410

$2.210

$1.337

$1.262

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,447 parts In-Stock

1+ parts

$1.425

100+ parts

-

1k+ parts

-

10k+ parts

-

4,447

$1.425

-

-

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Vyrian

USA . 5,259 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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5,259

-

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,683 parts In-Stock

1+ parts

$1.350

100+ parts

-

1k+ parts

-

10k+ parts

-

4,683

$1.350

-

-

-

Microchip USA

USA . 1,658 parts In-Stock

1+ parts

$13.850

100+ parts

$13.760

1k+ parts

$13.720

10k+ parts

$13.670

1,658

$13.850

$13.760

$13.720

$13.670

Advanced Electronics

New Zealand . 4,584 parts In-Stock

1+ parts

$19.823

100+ parts

$19.625

1k+ parts

$18.832

10k+ parts

-

4,584

$19.823

$19.625

$18.832

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Parana Technologies

USA . 256 parts In-Stock

1+ parts

$38.493

100+ parts

-

1k+ parts

-

10k+ parts

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256

$38.493

-

-

-

DigiPath Technology Company

USA . 631 parts In-Stock

1+ parts

$42.386

100+ parts

-

1k+ parts

-

10k+ parts

-

631

$42.386

-

-

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ChromeModa Solutions

Germany . 398 parts In-Stock

1+ parts

$43.251

100+ parts

$35.466

1k+ parts

-

10k+ parts

-

398

$43.251

$35.466

-

-

IDEA Electronic Components Group

UK . 236 parts In-Stock

1+ parts

$43.251

100+ parts

$41.088

1k+ parts

$38.926

10k+ parts

-

236

$43.251

$41.088

$38.926

-

Perfect Parts

USA . 676 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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676

-

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Overview

Unlock the power of innovation with Texas Instruments' MSP430G2303IPW28 microcontroller. Designed with precision and quality in mind, this small yet powerful device offers a wide range of applications in various industries. From industrial automation to consumer electronics, this product delivers exceptional performance and reliability. With its low power consumption and advanced features, the MSP430G2303IPW28 provides unmatched value for customers seeking cutting-edge technology. Experience the benefits of Texas Instruments' expertise and take your projects to the next level with this versatile microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ideal for portable electronic devices.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and cost in production.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for compatibility with various power sources, enhancing flexibility in design.

On Chip Data RAM Width: 8

The 8-bit width of on-chip data RAM enables efficient data processing, suitable for tasks requiring moderate memory capacity.

Package Shape: RECTANGULAR

Rectangular shape simplifies PCB layout and component placement, optimizing space utilization in the design.

Bit Size: 16

A 16-bit architecture offers improved performance and processing capabilities, making it suitable for a wide range of applications.

Power Supplies (V): 2/3.3

Support for multiple power supply voltages allows for compatibility with diverse power sources, enhancing flexibility in system design.

No. of Terminals: 28

The 28 terminals provide ample connectivity options for external peripherals and components, enabling versatile system integration.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style ensures compact size and efficient heat dissipation, ideal for space-constrained applications.

Minimum Supply Voltage: 1.8 V

The low minimum supply voltage enables operation in energy-efficient modes, prolonging battery life in portable devices.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature tolerance ensures reliable performance in a wide range of environmental conditions, suitable for industrial applications.

CPU Family: MSP430

The MSP430 CPU family offers a well-established and robust platform with a rich ecosystem of development tools and resources for efficient software development.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature tolerance allows for reliable operation in harsh cold environments, ideal for outdoor or automotive applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The use of nickel/palladium/gold finish provides excellent conductivity and corrosion resistance, ensuring reliable terminal connections for extended product lifespan.

Terminal Position: DUAL

The dual terminal position offers redundancy and improved signal integrity, reducing the risk of connection failures in demanding operating conditions.

ROM Words: 4096

The large ROM word capacity allows for storing significant program code and data, enabling complex program execution and versatile functionality.

Maximum Seated Height: 1.2 mm

The low maximum seated height minimizes PCB stack-up height, enabling compact and slim device designs for portable applications.

RAM Words: 0.25

The fractional RAM word capacity provides efficient memory allocation for small-scale data storage and processing tasks, optimizing resource utilization.

Width: 4.4 mm

The compact width dimension facilitates space-efficient PCB layout and component placement, suitable for miniaturized electronic devices.

Boundary Scan: YES

Boundary scan capability simplifies testing and debugging processes during manufacturing and service, enhancing product quality and reliability.

Peripherals: BOD, TIMER(6), WDT

The inclusion of brown-out detection, multiple timers, and a watchdog timer enhances system stability, timing accuracy, and fault tolerance in diverse applications.

Maximum Clock Frequency: 0.032 MHz

The high maximum clock frequency enables fast data processing and real-time operation, suitable for time-critical applications that require rapid computation.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance ensures robust solder joint reliability and integrity during PCB assembly, improving product durability.

Length: 9.7 mm

The moderate length dimension enables flexibility in PCB layout and component placement, accommodating various design constraints for versatile applications.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature tolerance ensures reliable performance in harsh operating environments, meeting the stringent requirements of industrial applications.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC-based microcontroller architecture offers efficient data processing and high performance, suitable for low-power and real-time embedded systems.

No. of Timers: 6

The presence of six on-chip timers enables precise timing control and event scheduling, enhancing system functionality and performance in time-critical applications.

RAM Bytes: 256

The 256-byte RAM capacity provides ample memory space for data storage and processing, supporting efficient operation and multitasking capabilities.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor (CMOS) technology offers low power consumption and high noise immunity, making the device suitable for battery-operated devices.

Terminal Form: GULL WING

The gull wing terminal form factor simplifies PCB soldering and rework processes, ensuring secure and reliable electrical connections for improved product quality.

Maximum Supply Current: 0.42 mA

The low maximum supply current consumption contributes to energy efficiency and prolonged battery life, making it suitable for power-constrained applications.

Nominal Supply Voltage: 2.2 V

The stable nominal supply voltage ensures consistent and reliable operation of the device, minimizing the risk of performance fluctuations in varying operating conditions.

No. of Serial I/Os: 2

The two serial I/O interfaces enable communication with external devices and peripherals, facilitating connectivity and data exchange in the system.

PWM Channels: YES

The presence of Pulse Width Modulation (PWM) channels allows for precise control of analog signals and voltage regulation, enhancing system efficiency and performance.

Connectivity: I2C, IRDA, SPI(2), UART, USCI(2)

The support for multiple connectivity interfaces such as I2C, IRDA, SPI, UART, and USCI enables versatile communication options with various devices and networks.

ROM Programmability: FLASH

The flash programmable ROM allows for easy and quick reprogramming of the device firmware, facilitating firmware updates and customization without replacing the hardware.

Terminal Pitch: 0.65 mm

The fine terminal pitch simplifies PCB layout and routing, enabling dense PCB designs and efficient signal routing for high-performance applications.

Format: FIXED POINT

The fixed-point data format provides efficient and accurate numerical computation, suitable for applications requiring precision and consistency in arithmetic operations.

Speed: 16 rpm

The 16 revolutions per minute speed specification is typically not applicable for microcontrollers; please verify the accuracy of this specification for the intended application.

Low Power Mode: YES

The low-power mode functionality allows for energy-efficient operation and extended battery life, making it suitable for portable and battery-operated devices.

On Chip Program ROM Width: 8

The 8-bit width of on-chip program ROM enables efficient storage and execution of program code, supporting versatile application requirements for code storage.

No. of I/O Lines: 24

The 24 I/O lines provide sufficient interfacing capabilities with external devices and peripherals, enabling versatile connectivity and data exchange in the system.

Technical Specifications

Microcontrollers MSP430G2303IPW28 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

NO

Additional Features:

ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 6 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

9.7 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

0

No. of I/O Lines:

24

No. of Serial I/Os:

2

No. of Terminals:

28

No. of Timers:

6

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP28,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

256

RAM Words:

0.25

ROM Words:

4096

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.42 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, SPI(2), UART, USCI(2)"

Peripherals:

"BOD, TIMER(6), WDT"

Trade Compliance

MSP430G2303IPW28 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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