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MSP430G2302IPW20

Texas Instruments

MSP430G2302IPW20 by Texas Instruments

MSP430G2302IPW20 by Texas Instruments is a 16-bit microcontroller with 4096 ROM words and 256 RAM bytes. It operates b/w -40 to 85 °C, with low power mode and peripherals like BOD, DMA(1), TIMER(4), WDT. Suitable for industrial applications requiring I2C, SPI, USI connectivity at 0.032 MHz clock frequency.

Median Price

$1.131

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 9,190 parts In-Stock

1+ parts

$1.434

100+ parts

$1.184

1k+ parts

$0.640

10k+ parts

-

9,190

$1.434

$1.184

$0.640

-

DigiKey

USA . 512 parts In-Stock

1+ parts

$1.930

100+ parts

$1.183

1k+ parts

$1.078

10k+ parts

-

512

$1.930

$1.183

$1.078

-

Arrow

USA . 420 parts In-Stock

1+ parts

-

100+ parts

$0.743

1k+ parts

-

10k+ parts

-

420

-

$0.743

-

-

Rochester

USA . 415 parts In-Stock

1+ parts

-

100+ parts

$1.090

1k+ parts

$0.905

10k+ parts

$0.807

415

-

$1.090

$0.905

$0.807

Verical

USA . 415 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.131

10k+ parts

$1.008

415

-

-

$1.131

$1.008

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,433 parts In-Stock

1+ parts

$0.845

100+ parts

-

1k+ parts

-

10k+ parts

-

2,433

$0.845

-

-

-

Vyrian

USA . 4,671 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,671

-

-

-

-

Cyclops Electronics Ltd

UK . 1,645 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,645

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 809 parts In-Stock

1+ parts

$0.800

100+ parts

-

1k+ parts

-

10k+ parts

-

809

$0.800

-

-

-

Microchip USA

USA . 1,457 parts In-Stock

1+ parts

$5.980

100+ parts

$5.940

1k+ parts

$5.920

10k+ parts

$5.910

1,457

$5.980

$5.940

$5.920

$5.910

Parana Technologies

USA . 1,399 parts In-Stock

1+ parts

$62.594

100+ parts

-

1k+ parts

-

10k+ parts

-

1,399

$62.594

-

-

-

ChromeModa Solutions

Germany . 5,228 parts In-Stock

1+ parts

$70.330

100+ parts

$57.671

1k+ parts

-

10k+ parts

-

5,228

$70.330

$57.671

-

-

IDEA Electronic Components Group

UK . 1,641 parts In-Stock

1+ parts

$70.330

100+ parts

$66.814

1k+ parts

$63.297

10k+ parts

-

1,641

$70.330

$66.814

$63.297

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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7,000

-

-

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DigiPath Technology Company

USA . 595 parts In-Stock

1+ parts

-

100+ parts

$63.410

1k+ parts

-

10k+ parts

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595

-

$63.410

-

-

Kepictronics

USA . 332 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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332

-

-

-

-

Overview

Unlock the power of innovation with the MSP430G2302IPW20 by Texas Instruments. As a leader in microcontroller technology, Texas Instruments delivers unparalleled quality and reliability. Ideal for a wide range of applications, this microcontroller offers customers exceptional value and benefits. With features like low power mode and multiple connectivity options, the MSP430G2302IPW20 provides the performance and flexibility needed for your next project. Experience the advantages of Texas Instruments technology and take your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring a longer lifespan.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options while still maintaining safe operating conditions.

CPU Family: MSP430

Belongs to a reliable and well-known microcontroller family known for its efficiency and performance.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes RISC architecture for efficient data processing and improved performance.

Connectivity: I2C, SPI, USI

Provides multiple connectivity options for interfacing with other devices or modules.

Low Power Mode: YES

Enables power saving features, making it suitable for battery-powered applications or energy-efficient designs.

Technical Specifications

Microcontrollers MSP430G2302IPW20 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

NO

Additional Features:

ALSO OPERATES 1.8 V MINIMUM SUPPLY AT 6 MHZ AND 2.7 V MINIMUM SUPPLY AT 12 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

1

No. of I/O Lines:

16

No. of Serial I/Os:

0

No. of Terminals:

20

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

256

RAM Words:

0.25

ROM Words:

4096

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.4 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, SPI, USI"

Peripherals:

"BOD, DMA(1), TIMER(4), WDT"

Trade Compliance

MSP430G2302IPW20 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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