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MSP430G2302IPW1EP

Texas Instruments

MSP430G2302IPW1EP by Texas Instruments

MSP430G2302IPW1EP by Texas Instruments is a 16-bit microcontroller with 8KB Flash ROM and 256B RAM. Operating at up to 16MHz, it features 8 ADC channels, PWM support, and I2C/SPI connectivity. Ideal for industrial applications requiring low power consumption and high-speed processing in a compact form factor.

Median Price

$4.581

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 7,310 parts In-Stock

1+ parts

$4.581

100+ parts

$4.014

1k+ parts

$2.268

10k+ parts

-

7,310

$4.581

$4.014

$2.268

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,821 parts In-Stock

1+ parts

$4.352

100+ parts

-

1k+ parts

-

10k+ parts

-

2,821

$4.352

-

-

-

Vyrian

USA . 2,034 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,034

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,432 parts In-Stock

1+ parts

$4.123

100+ parts

-

1k+ parts

-

10k+ parts

-

4,432

$4.123

-

-

-

AZTECH Wire

Italy . 1,112 parts In-Stock

1+ parts

$12.840

100+ parts

-

1k+ parts

-

10k+ parts

-

1,112

$12.840

-

-

-

Parana Technologies

USA . 2,024 parts In-Stock

1+ parts

$24.480

100+ parts

-

1k+ parts

$25.147

10k+ parts

-

2,024

$24.480

-

$25.147

-

DigiPath Technology Company

USA . 512 parts In-Stock

1+ parts

$26.956

100+ parts

-

1k+ parts

-

10k+ parts

-

512

$26.956

-

-

-

ChromeModa Solutions

Germany . 6,769 parts In-Stock

1+ parts

$27.506

100+ parts

$22.555

1k+ parts

-

10k+ parts

-

6,769

$27.506

$22.555

-

-

IDEA Electronic Components Group

UK . 1,560 parts In-Stock

1+ parts

$27.506

100+ parts

$26.131

1k+ parts

$24.755

10k+ parts

-

1,560

$27.506

$26.131

$24.755

-

Microchip USA

USA . 2,183 parts In-Stock

1+ parts

$29.030

100+ parts

$28.860

1k+ parts

$28.770

10k+ parts

$28.680

2,183

$29.030

$28.860

$28.770

$28.680

Overview

Unlock the power of innovation with the MSP430G2302IPW1EP by Texas Instruments. Crafted with precision and expertise, this microcontroller offers unparalleled quality and reliability. Ideal for a wide range of applications, from IoT devices to consumer electronics, this product provides exceptional value, efficiency, and performance. Experience seamless connectivity, low power consumption, and advanced features that set this microcontroller apart from the rest. Elevate your projects with the MSP430G2302IPW1EP and unleash endless possibilities in the world of technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material makes the microcontroller durable and resistant to external elements, ensuring a longer lifespan.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6 V, this microcontroller can operate efficiently within a wide range of power sources.

On Chip Data RAM Width: 8

Having a data RAM width of 8 bits allows for efficient data processing and storage capabilities within the microcontroller.

Package Shape: RECTANGULAR

The rectangular package shape makes it easy to handle and fit into standard circuit board layouts, enhancing compatibility and ease of use.

Bit Size: 16

With a bit size of 16, this microcontroller can handle complex calculations and processing tasks efficiently, making it suitable for a wide range of applications.

Power Supplies (V): 2/3.3

Having multiple power supply options of 2 V and 3.3 V provides flexibility in power management, allowing for optimized performance in different scenarios.

No. of Terminals: 14

With 14 terminals, this microcontroller offers multiple connectivity options, enabling seamless integration with external devices and components.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style saves space on the circuit board and simplifies the overall design layout.

Minimum Supply Voltage: 3.3 V

The minimum supply voltage of 3.3 V ensures stable operation and reliable performance, even under lower power supply conditions.

Technical Specifications

Microcontrollers MSP430G2302IPW1EP attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES 1.8 V MINIMUM SUPPLY AT 6 MHZ AND 2.7 V MINIMUM SUPPLY AT 12 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

0

No. of External Interrupts:

0

No. of I/O Lines:

16

No. of Serial I/Os:

0

No. of Terminals:

14

No. of Timers:

1

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

RAM Bytes:

256

RAM Words:

0.25

ROM Words:

4096

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.4 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SPI

Peripherals:

BOD, TIMER, WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

MSP430G2302IPW1EP Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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