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MSP430G2252IRSA16T

Texas Instruments

MSP430G2252IRSA16T by Texas Instruments

MSP430G2252IRSA16T by Texas Instruments is a 16-bit microcontroller with 2048 ROM words, 256 RAM bytes, and 8 ADC channels. Ideal for industrial applications due to its low power mode, it offers connectivity via I2C, SPI, and USI interfaces. With a max clock frequency of 16 MHz and peak reflow temperature of 260°C, it ensures efficient performance in various electronic systems.

Median Price

$1.427

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 260 parts In-Stock

1+ parts

$0.885

100+ parts

$0.832

1k+ parts

$0.752

10k+ parts

-

260

$0.885

$0.832

$0.752

-

Texas Instruments

USA . 450 parts In-Stock

1+ parts

$1.427

100+ parts

$1.178

1k+ parts

$0.637

10k+ parts

-

450

$1.427

$1.178

$0.637

-

DigiKey

USA . 265 parts In-Stock

1+ parts

$1.760

100+ parts

$1.048

1k+ parts

$0.949

10k+ parts

-

265

$1.760

$1.048

$0.949

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,987 parts In-Stock

1+ parts

$0.841

100+ parts

-

1k+ parts

-

10k+ parts

-

2,987

$0.841

-

-

-

Vyrian

USA . 6,879 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,879

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,261 parts In-Stock

1+ parts

$0.796

100+ parts

-

1k+ parts

-

10k+ parts

-

3,261

$0.796

-

-

-

Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$50.875

100+ parts

$46.296

1k+ parts

$41.718

10k+ parts

-

1,000

$50.875

$46.296

$41.718

-

Parana Technologies

USA . 628 parts In-Stock

1+ parts

$75.694

100+ parts

-

1k+ parts

-

10k+ parts

-

628

$75.694

-

-

-

IDEA Electronic Components Group

UK . 1,811 parts In-Stock

1+ parts

$85.050

100+ parts

$80.798

1k+ parts

$76.545

10k+ parts

-

1,811

$85.050

$80.798

$76.545

-

ChromeModa Solutions

Germany . 233 parts In-Stock

1+ parts

$85.050

100+ parts

$69.741

1k+ parts

-

10k+ parts

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233

$85.050

$69.741

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-

QUARKTWIN TECHNOLOGY LTD

USA . 27,434 parts In-Stock

1+ parts

-

100+ parts

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27,434

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-

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Microchip USA

USA . 9,906 parts In-Stock

1+ parts

-

100+ parts

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9,906

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-

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DigiPath Technology Company

USA . 782 parts In-Stock

1+ parts

-

100+ parts

$76.681

1k+ parts

-

10k+ parts

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782

-

$76.681

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-

Perfect Parts

USA . 552 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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552

-

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Overview

Experience the power of innovation with the MSP430G2252IRSA16T from Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality microcontrollers that are versatile and reliable. Perfect for a wide range of applications, this product offers customers unmatched value and benefits. With advanced features like ADC channels, DMA channels, and connectivity options like I2C and SPI, the MSP430G2252IRSA16T provides the performance and efficiency you need for your projects. Trust Texas Instruments to deliver excellence in every aspect of your design process.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the microcontroller, ensuring long-term reliability.

Maximum Supply Voltage: 3.6 V

Allows for a wide range of supply voltage options, giving flexibility in power supply design.

Bit Size: 16

16-bit architecture provides enhanced performance and processing capabilities for the microcontroller.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture ensures efficient operation and optimized performance for embedded applications.

Maximum Clock Frequency: 16 MHz

High clock frequency allows for fast processing and response times in real-time applications.

Analog To Digital Convertors: 8-Ch 10-Bit

8-channel 10-bit ADCs enable accurate and reliable conversion of analog signals to digital data.

ROM Programmability: FLASH

Flash ROM allows for easy and quick reprogramming of the microcontroller, facilitating firmware updates and customization.

Low Power Mode: YES

Low power mode helps in reducing power consumption during idle or low-load operations, enhancing energy efficiency.

Connectivity: I2C, SPI, USI

Multiple connectivity options support communication with external devices and peripherals, expanding the functionality of the microcontroller.

Technical Specifications

Microcontrollers MSP430G2252IRSA16T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 6MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N16

JESD-609 Code:

e4

Length:

4 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of DMA Channels:

1

No. of I/O Lines:

16

No. of Serial I/Os:

0

No. of Terminals:

16

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC16,.16SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

256

RAM Words:

0.25

ROM Words:

2048

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.4 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.2 V

Nominal Supply Voltage:

2.7 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, SPI, USI"

Peripherals:

"BOD, COMPARATOR(8), DMA(1), TIMER(4), WDT"

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

MSP430G2252IRSA16T Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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