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MSP430G2252IRSA16R

Texas Instruments

MSP430G2252IRSA16R by Texas Instruments

MSP430G2252IRSA16R by Texas Instruments is a 16-bit microcontroller with 2048 ROM words, 256 RAM bytes, and 8 ADC channels. It operates at a max clock frequency of 16 MHz and features low power mode for industrial applications requiring high-speed processing and connectivity via I2C, SPI, USI interfaces.

Median Price

$1.124

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 11,495 parts In-Stock

1+ parts

$1.124

100+ parts

$0.865

1k+ parts

$0.455

10k+ parts

-

11,495

$1.124

$0.865

$0.455

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 150 parts In-Stock

1+ parts

$0.455

100+ parts

-

1k+ parts

-

10k+ parts

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150

$0.455

-

-

-

Digiode

USA . 3,870 parts In-Stock

1+ parts

$1.068

100+ parts

-

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-

10k+ parts

-

3,870

$1.068

-

-

-

Velocity Electronics

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

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6,000

-

-

-

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Vyrian

USA . 4,758 parts In-Stock

1+ parts

-

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-

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4,758

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$0.455

100+ parts

-

1k+ parts

$0.432

10k+ parts

$0.423

2,000

$0.455

-

$0.432

$0.423

Argo Parts USA

USA . 950 parts In-Stock

1+ parts

$0.455

100+ parts

-

1k+ parts

-

10k+ parts

$0.441

950

$0.455

-

-

$0.441

Continental Prestige Electronics

USA . 387 parts In-Stock

1+ parts

$0.455

100+ parts

-

1k+ parts

-

10k+ parts

$0.446

387

$0.455

-

-

$0.446

Ampacity Inc.

Singapore . 11,135 parts In-Stock

1+ parts

$0.960

100+ parts

-

1k+ parts

-

10k+ parts

-

11,135

$0.960

-

-

-

Corphita

USA . 635 parts In-Stock

1+ parts

$1.012

100+ parts

-

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635

$1.012

-

-

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Microchip USA

USA . 1,925 parts In-Stock

1+ parts

$4.180

100+ parts

$4.160

1k+ parts

$4.140

10k+ parts

$4.130

1,925

$4.180

$4.160

$4.140

$4.130

AZTECH Wire

Italy . 119 parts In-Stock

1+ parts

$12.660

100+ parts

-

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-

10k+ parts

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119

$12.660

-

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Corohmni

South Africa . 1 parts In-Stock

1+ parts

$48.175

100+ parts

-

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1

$48.175

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Parana Technologies

USA . 836 parts In-Stock

1+ parts

$71.002

100+ parts

$6,593.569

1k+ parts

$63.901

10k+ parts

-

836

$71.002

$6,593.569

$63.901

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DigiPath Technology Company

USA . 2,354 parts In-Stock

1+ parts

$78.181

100+ parts

$71.927

1k+ parts

-

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2,354

$78.181

$71.927

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IDEA Electronic Components Group

UK . 1,183 parts In-Stock

1+ parts

$79.777

100+ parts

$75.788

1k+ parts

$71.799

10k+ parts

-

1,183

$79.777

$75.788

$71.799

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ChromeModa Solutions

Germany . 548 parts In-Stock

1+ parts

$79.777

100+ parts

$65.417

1k+ parts

-

10k+ parts

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548

$79.777

$65.417

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QUARKTWIN TECHNOLOGY LTD

USA . 3,217 parts In-Stock

1+ parts

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100+ parts

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3,217

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Overview

Unlock the power of innovation with the Texas Instruments MSP430G2252IRSA16R microcontroller. With its cutting-edge technology and high-quality manufacturing, this device offers unmatched performance and reliability for a wide range of applications. From industrial automation to consumer electronics, this versatile chip delivers outstanding value, benefits, and advantages to customers looking to take their projects to the next level. Experience seamless connectivity, low power consumption, and superior functionality with the MSP430G2252IRSA16R - the perfect choice for your next design project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, making it suitable for a variety of applications.

Surface Mount: YES

Allows for easy installation on circuit boards, making the product user-friendly and efficient.

Maximum Supply Voltage: 3.6 V

Provides flexibility in power supply options for the microcontroller.

On Chip Data RAM Width: 8

Offers sufficient data storage capacity for processing tasks.

Package Shape: SQUARE

Provides a compact design for space-saving in the circuit layout.

Bit Size: 16

Enables the microcontroller to handle data in 16-bit increments, enhancing processing capabilities.

Power Supplies (V): 2/3.3

Supports multiple power supply options, allowing for compatibility with various systems.

No. of Terminals: 16

Provides sufficient connectivity options for interfacing with external devices.

Minimum Supply Voltage: 2.2 V

Ensures stable operation even at low voltage conditions.

Maximum Operating Temperature: 85 °C

Suitable for industrial applications where high temperatures may be encountered.

CPU Family: MSP430

A well-established and reliable microcontroller family known for its low power consumption and high performance.

ADC Channels: YES

Enables analog-to-digital conversion for sensor interfacing and data acquisition.

DMA Channels: YES

Facilitates direct memory access for efficient data transfer and processing.

ROM Words: 2048

Offers ample memory for storing program instructions and data.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes a Reduced Instruction Set Computing (RISC) architecture for efficient operation and low power consumption.

Technology: CMOS

Utilizes Complementary Metal-Oxide-Semiconductor technology for low power consumption and high noise immunity.

Analog To Digital Convertors: 8-Ch 10-Bit

Provides multiple channels for analog input conversion with a resolution of 10 bits for accurate signal processing.

PWM Channels: YES

Supports Pulse Width Modulation for controlling motors, LEDs, and other devices requiring variable output signals.

Connectivity: I2C, SPI, USI

Offers versatile communication interfaces for connecting to sensors, displays, and other peripheral devices.

Low Power Mode: YES

Enables power-saving operation modes for energy-efficient applications.

Technical Specifications

Microcontrollers MSP430G2252IRSA16R attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 6MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N16

JESD-609 Code:

e4

Length:

4 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of DMA Channels:

1

No. of I/O Lines:

16

No. of Serial I/Os:

0

No. of Terminals:

16

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC16,.16SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

256

RAM Words:

0.25

ROM Words:

2048

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.4 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.2 V

Nominal Supply Voltage:

2.7 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, SPI, USI"

Peripherals:

"BOD, COMPARATOR(8), DMA(1), TIMER(4), WDT"

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

MSP430G2252IRSA16R Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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