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MSP430G2233IRHB32T

Texas Instruments

MSP430G2233IRHB32T by Texas Instruments

MSP430G2233IRHB32T by Texas Instruments is a 16-bit microcontroller with 2048 ROM words and 256 RAM bytes. It operates at a max clock frequency of 0.032 MHz, suitable for industrial applications requiring low power consumption. Features include 8 ADC channels, 6 timers, and connectivity options like I2C and UART.

Median Price

$1.330

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,200 parts In-Stock

1+ parts

$1.398

100+ parts

$1.154

1k+ parts

$0.624

10k+ parts

-

2,200

$1.398

$1.154

$0.624

-

Rochester

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$1.220

1k+ parts

$1.010

10k+ parts

$0.903

1,000

-

$1.220

$1.010

$0.903

DigiKey

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.530

10k+ parts

-

1,000

-

-

$1.530

-

Verical

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.262

10k+ parts

$1.129

1,000

-

-

$1.262

$1.129

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,133 parts In-Stock

1+ parts

$0.824

100+ parts

-

1k+ parts

-

10k+ parts

-

2,133

$0.824

-

-

-

Vyrian

USA . 6,801 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,801

-

-

-

-

Sunrise Surplus Inc.

USA . 2,750 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,750

-

-

-

-

DigiKey Marketplace

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$0.900

1k+ parts

-

10k+ parts

-

1,000

-

$0.900

-

-

Electronics Depot

USA . 31 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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31

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,650 parts In-Stock

1+ parts

$0.780

100+ parts

-

1k+ parts

-

10k+ parts

-

2,650

$0.780

-

-

-

Component Stockers USA

USA . 1,323 parts In-Stock

1+ parts

$0.900

100+ parts

$0.840

1k+ parts

$0.760

10k+ parts

-

1,323

$0.900

$0.840

$0.760

-

Microchip USA

USA . 1,991 parts In-Stock

1+ parts

$8.193

100+ parts

-

1k+ parts

-

10k+ parts

-

1,991

$8.193

-

-

-

Parana Technologies

USA . 1,405 parts In-Stock

1+ parts

$67.687

100+ parts

-

1k+ parts

-

10k+ parts

-

1,405

$67.687

-

-

-

DigiPath Technology Company

USA . 745 parts In-Stock

1+ parts

$74.532

100+ parts

-

1k+ parts

-

10k+ parts

-

745

$74.532

-

-

-

ChromeModa Solutions

Germany . 2,570 parts In-Stock

1+ parts

$76.053

100+ parts

$62.363

1k+ parts

-

10k+ parts

-

2,570

$76.053

$62.363

-

-

IDEA Electronic Components Group

UK . 1,302 parts In-Stock

1+ parts

$76.053

100+ parts

$72.250

1k+ parts

$68.448

10k+ parts

-

1,302

$76.053

$72.250

$68.448

-

Overview

Unlock endless possibilities with the MSP430G2233IRHB32T microcontroller by Texas Instruments. Designed with precision and reliability in mind, this chip carrier offers cutting-edge technology for a wide range of applications. From industrial automation to consumer electronics, this device provides low power consumption and high performance, making it a valuable asset for any project. Say goodbye to limitations and hello to innovation with the MSP430G2233IRHB32T.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the microcontroller suitable for various applications without adding excessive weight.

Maximum Supply Voltage: 3.6 V

Can operate at a higher voltage range, providing flexibility in powering options for different systems.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC (Reduced Instruction Set Computing) architecture allows for efficient and fast processing of instructions, enhancing the overall performance of the microcontroller.

ROM Programmability: FLASH

The ability to program the Read-Only Memory (ROM) using flash memory technology enables easy updates and modifications to the program code without requiring physical replacements.

ADC Channels: YES

Having Analog to Digital Converter (ADC) channels allows the microcontroller to process analog signals, making it suitable for sensor interfacing and data acquisition applications.

No. of Timers: 6

Multiple timers provide precise timing control for various functions and processes within a system, enhancing efficiency and accuracy.

Connectivity: I2C, IRDA, SPI(2), UART, USCI(2)

Support for multiple communication protocols enables seamless integration with external devices and peripherals, increasing the versatility of the microcontroller.

Low Power Mode: YES

The availability of low power mode helps in reducing power consumption during idle or standby periods, extending battery life and improving energy efficiency.

Technical Specifications

Microcontrollers MSP430G2233IRHB32T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 6 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of DMA Channels:

1

No. of I/O Lines:

24

No. of Serial I/Os:

2

No. of Terminals:

32

No. of Timers:

6

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

256

RAM Words:

0.25

ROM Words:

2048

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.42 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

"I2C, IRDA, SPI(2), UART, USCI(2)"

Peripherals:

"BOD, DMA(1), TIMER(6), WDT"

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

MSP430G2233IRHB32T Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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