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MSP430G2231QPW1EP

Texas Instruments

MSP430G2231QPW1EP by Texas Instruments

MSP430G2231QPW1EP by Texas Instruments is a 16-bit microcontroller with 8KB flash ROM and 128B RAM. It operates at a max frequency of 16MHz, suitable for automotive applications. Featuring 8 ADC channels, I2C and SPI connectivity, it offers low power modes and DMA support for efficient performance.

Median Price

$5.400

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 35,380 parts In-Stock

1+ parts

$4.581

100+ parts

$4.014

1k+ parts

$2.268

10k+ parts

-

35,380

$4.581

$4.014

$2.268

-

DigiKey

USA . 21 parts In-Stock

1+ parts

$6.220

100+ parts

$4.042

1k+ parts

$3.702

10k+ parts

$3.519

21

$6.220

$4.042

$3.702

$3.519

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,032 parts In-Stock

1+ parts

$4.056

100+ parts

-

1k+ parts

-

10k+ parts

-

2,032

$4.056

-

-

-

Vyrian

USA . 7,326 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,326

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,265 parts In-Stock

1+ parts

$3.843

100+ parts

-

1k+ parts

-

10k+ parts

-

3,265

$3.843

-

-

-

Microchip USA

USA . 1,894 parts In-Stock

1+ parts

$17.000

100+ parts

$16.750

1k+ parts

$16.630

10k+ parts

$16.510

1,894

$17.000

$16.750

$16.630

$16.510

Parana Technologies

USA . 1,769 parts In-Stock

1+ parts

$70.564

100+ parts

-

1k+ parts

-

10k+ parts

-

1,769

$70.564

-

-

-

DigiPath Technology Company

USA . 1,040 parts In-Stock

1+ parts

$77.699

100+ parts

-

1k+ parts

-

10k+ parts

-

1,040

$77.699

-

-

-

ChromeModa Solutions

Germany . 6,972 parts In-Stock

1+ parts

$79.285

100+ parts

$65.014

1k+ parts

-

10k+ parts

-

6,972

$79.285

$65.014

-

-

IDEA Electronic Components Group

UK . 1,962 parts In-Stock

1+ parts

$79.285

100+ parts

$75.321

1k+ parts

$71.356

10k+ parts

-

1,962

$79.285

$75.321

$71.356

-

Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

Overview

Unlock the power of cutting-edge technology with the Texas Instruments MSP430G2231QPW1EP Microcontroller. Crafted with precision and expertise by a trusted manufacturer, this device offers unparalleled performance and reliability for a wide range of applications. From automotive to industrial automation, this compact yet powerful microcontroller boasts innovative features such as low-power mode and high-speed connectivity options like I2C and SPI. Experience seamless operation and optimal efficiency with the MSP430G2231QPW1EP, your gateway to a world of limitless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material provides durability and protection for the microcontroller, making it suitable for various applications.

Maximum Supply Voltage: 3.6 V

Allows for a higher supply voltage which can result in increased performance and functionality of the microcontroller.

CPU Family: MSP430

MSP430 family is known for its low power consumption, making this microcontroller energy-efficient and ideal for battery-operated devices.

Connectivity: I2C, SPI

Support for I2C and SPI communication protocols enhances the connectivity options for the microcontroller, enabling it to interact with a wide range of peripherals.

Analog To Digital Convertors: 8-Ch 10-Bit

Multiple ADC channels with 10-bit resolution allow for accurate analog to digital conversion, making the microcontroller suitable for applications that require precise sensing and data acquisition.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture ensures efficient and streamlined operation of the microcontroller, enabling fast execution of instructions and improved performance.

Maximum Clock Frequency: 16 MHz

High clock frequency allows for fast processing speeds, making the microcontroller suitable for applications that require real-time data processing or high-speed communication.

Technical Specifications

Microcontrollers MSP430G2231QPW1EP attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES 1.8 V MINIMUM SUPPLY AT 6 MHZ AND 2.7 V MINIMUM SUPPLY AT 12 MHZ

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

CPU Family:

MSP430

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

1

No. of External Interrupts:

0

No. of I/O Lines:

10

No. of Serial I/Os:

0

No. of Terminals:

14

No. of Timers:

1

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

RAM Bytes:

128

RAM Words:

0.125

ROM Words:

3072

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

16 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

.39 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

2.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, SPI

Peripherals:

BOD, DMA, TIMER, WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

MSP430G2231QPW1EP Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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